K4RBH086VB-BCQK vs K4RAH086VP-BCWM 对比
详细并排对比 K4RBH086VB-BCQK 出自 Samsung Electronics 和 K4RAH086VP-BCWM 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4RBH086VB-BCQK | K4RAH086VP-BCWM |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $0.00 |
| 存储器类型 | DDR5 SDRAM | DDR5 SDRAM |
| Density | 16 Gb | — |
| 存储组织 | 2G x 8 | — |
| 数据速率 | 4800 Mbps | 5600 Mbps/pin |
| Supply Voltage (VDD) | 1.1 V | — |
| 接口 | DDR5 (CA bus, ODECC) | Parallel |
| On-die ECC | Yes | — |
| 封装 | FBGA-82 | [DATA_NEEDED: exact FBGA package code and body size] |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Refresh | [DATA_NEEDED: refresh rate 32ms/64ms] | — |
| CAS Latency (CL) | [DATA_NEEDED: CAS latency at 4800 Mbps] | — |
| Power Supply Rails | VDD/VDDQ 1.1 V (PMIC on module) | — |
| MSL 等级 | [DATA_NEEDED: moisture sensitivity level] | [DATA_NEEDED: moisture sensitivity level] |
| RoHS 状态 | Compliant | unknown |
| Packaging | [DATA_NEEDED: tray or tape and reel standard quantity] | Tray |
| 存储容量 | — | 16 Gb |
| Memory Organization | — | 2G x 8 |
| 电源电压 | — | 1.1 V |
| Technology | — | DRAM DDR5 |
| Memory Format | — | DRAM |
| Volatile / Non-Volatile | — | Volatile |
| Application Segment | — | Industrial |
| 生命周期状态 | — | Active |