K4RHE165VB-BCWM vs K4RHE086VB-BCWM 对比
详细并排对比 K4RHE165VB-BCWM 出自 Samsung Electronics 和 K4RHE086VB-BCWM 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4RHE165VB-BCWM | K4RHE086VB-BCWM |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $7.65 |
| 存储器类型 | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb (3 GB) | 24 Gb |
| 存储组织 | 1G x 16 | 2G x 8 |
| 数据速率 | 5600 Mbps | 5600 Mbps |
| 电源电压 | 1.1 V | 1.1 V |
| 封装 | 106 FBGA | 82 FBGA |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| 工作温度 | 0 to 85 C | [DATA_NEEDED: operating temperature range] |
| Product Status | Mass Production | — |
| 接口 | DDR5 (parallel, DDR) | DDR5 (JEDEC) |
| Access Type | Synchronous | — |
| Clock Rate (nominal) | 2800 MHz (5600 MT/s DDR) | — |
| Ball Count | 106 | — |
| RoHS 状态 | [DATA_NEEDED: RoHS Status] | unknown |
| MSL 等级 | [DATA_NEEDED: MSL Level] | — |
| Standard Pack Quantity | [DATA_NEEDED: Standard Pack Quantity] | — |
| Configuration | — | x8 |
| Application Segment | — | Server / Data Center / Premium PC |
| Manufacturer | — | Samsung Semiconductor |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS latency] |
| On-Die ECC | — | [DATA_NEEDED: on-die ECC support] |
| Package Height | — | [DATA_NEEDED: package height] |