K4RHE165VB-BCWM vs K4RHE086VP 对比
详细并排对比 K4RHE165VB-BCWM 出自 Samsung Electronics 和 K4RHE086VP 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4RHE165VB-BCWM | K4RHE086VP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | DDR5 |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $9.90 |
| 存储器类型 | DDR5 SDRAM | DDR5 SDRAM |
| Density | 24 Gb (3 GB) | 24 Gb |
| 存储组织 | 1G x 16 | x8 |
| 数据速率 | 5600 Mbps | — |
| 电源电压 | 1.1 V | — |
| 封装 | 106 FBGA | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| 工作温度 | 0 to 85 C | — |
| Product Status | Mass Production | — |
| 接口 | DDR5 (parallel, DDR) | — |
| Access Type | Synchronous | — |
| Clock Rate (nominal) | 2800 MHz (5600 MT/s DDR) | — |
| Ball Count | 106 | — |
| RoHS 状态 | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| MSL 等级 | [DATA_NEEDED: MSL Level] | — |
| Standard Pack Quantity | [DATA_NEEDED: Standard Pack Quantity] | — |
| Process Node | — | 1a-class (D1a) |
| Package Type | — | FBGA |
| 接口类型 | — | DDR5 (double data rate 5) |
| Maximum Data Rate | — | [DATA_NEEDED: speed bin data rate] |
| Supply Voltage (VDD) | — | [DATA_NEEDED: VDD in V] |
| On-Die ECC | — | Yes (DDR5 standard feature) |
| Bank Groups | — | [DATA_NEEDED: bank group count] |
| 工作温度范围 | — | [DATA_NEEDED: temperature range] |
| 品牌 | — | Samsung Electronics |
| Product Family | — | Samsung K4RHE DDR5 series |
| Typical Application | — | Server / client DRAM modules |