LPC55S26JBD64E vs LPC5526JBD64E 对比
详细并排对比 LPC55S26JBD64E 出自 NXP Semiconductors 和 LPC5526JBD64E 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | LPC55S26JBD64E | LPC5526JBD64E |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.02 | $2.95 |
| Core Processor | ARM Cortex-M33 (r0p3) | ARM Cortex-M33 (r0p3) |
| Core Size | 32-bit | 32-Bit |
| 最大时钟频率 | 150 MHz | 150 MHz |
| Flash Memory | 256 KB | 256KB (256K x 8) |
| SRAM | 256 KB | — |
| Connectivity | USB HS, I2C, SPI, UART/USART, I2S, SDIO | — |
| Peripherals | CASPER crypto co-processor, PLU, SCTimer/PWM, DMA, Comparator, Temperature Sensor | — |
| ADC Resolution | 16 bit | — |
| ADC Conversion Rate | 1.0 Msamples/sec | — |
| Security Features | AES, PUF, SHA, CRC, RNG | — |
| Interrupt Controller | NVIC with NMI input (selectable sources) | NVIC (built-in) |
| Memory Protection | MPU (Memory Protection Unit) | — |
| 封装 | 64-HTQFP (10 x 10 mm) | 64-HTQFP (10x10 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| Process Technology | 40 nm NVM | 40 nm NVM |
| Peak Reflow Temperature | 260 C | 260 C |
| 湿敏等级（MSL） | 3 | 3 |
| Terminal Finish | Tin (JESD-609 code e3) | Tin (JESD-609 code e3) |
| 工作温度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: temperature range] |
| 电源电压 | [DATA_NEEDED: supply voltage range] | [DATA_NEEDED: supply voltage range] |
| RAM Size | — | [DATA_NEEDED: SRAM size] |
| Security Feature | — | ARM TrustZone |
| Memory Protection Unit | — | Yes (MPU) |
| NMI Input | — | Yes, with selection of sources |
| Max Time At Peak Reflow | — | 30 s |
| RoHS 状态 | — | Compliant |
| 生命周期状态 | — | Active |