最后一次采购通知: MC9S08QG4CFFE 即将停产。最后下单日期: 联系我们. 查看可用的替代料号 →
NXP Semiconductors

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

料号: MC9S08QG4CFFE ✗ 停产
有现货 1-3 个工作日内发货
2.5 V / 3.3 V Vdss 16-QFN-EP (5x5 mm), QFN EP Package 20 MHz Speed 4KB (4K x 8) FLASH Memory
低至 $1.1 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-18
批量定价
数量 单价 小计
1 $1.85 $1.85
10 $1.68 $16.80
100 $1.42 $142.00
500 $1.25 $625.00
1,000 $1.1 $1,100.00
ℹ️ 所有价格均以 USD 计价

MC9S08QG4CFFE 概述

The NXP MC9S08QG4CFFE is an 8-bit HCS08 microcontroller with 4KB (4K x 8) FLASH program memory, a 20MHz S08 CPU core, and 16-terminal QFN-EP (5x5 mm) package operating from 2.5V or 3.3V supplies.

An 8-bit microcontroller is a single-chip computer that integrates a processor core, program memory (flash), data RAM, and peripherals such as timers, ADC, and serial interfaces on one die. Microcontrollers sit at the lowest level of the embedded-system hierarchy - below 16/32-bit MCUs and application processors - and are chosen where cost, pin count, and power matter more than raw throughput. The S08 family is NXP (formerly Freescale) architecture descending from the HC08 instruction set.

Key features of the MC9S08QG4CFFE include the 20-MHz HCS08 CPU with the HC08 instruction set plus an added BGND instruction, an on-chip background debugging system supporting in-circuit debugging, and breakpoint capability with one breakpoint during in-circuit debugging plus additional on-chip breakpoints. The S08QG family provides serial interfaces and peripherals normally found in higher-end devices, all in a very small package, making S08QG devices a strong fit for battery-powered designs.

Technically, the device belongs to the S08 Family, S08QG Series (QG Series) of the S08 core architecture, a CISC 8-bit core with flash-based program storage. The QFN package code is HVQCCN (square, no-lead), 16 terminals, no-lead terminal form, industrial temperature grade, shipped in trays.

Typical applications include small battery-powered appliances, simple consumer electronics, low-cost sensing nodes, and replacement/continuation builds for legacy S08QG-based boards.

Design consideration: this part is End of Life per the NXP product page. Plan last-time-buy quantities or qualify a replacement before new designs.

This page consolidates verified distributor listings, lifecycle status, drop-in alternatives, and design guidance not found in any single manufacturer or distributor source.

直接替换替代料: MC9S08QG4CFFE ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MC9S08QG4CFFE (相同外形与封装尺寸) ——差异在于 Package, Core, RoHS Status, Debug Interface, Instruction Set.

NXP Semiconductors
Package: QFN/QFP small package (FFE suffix)
Core: HCS08 8-bit CPU
RoHS Status: Compliant (per Bangyanchip listing)
对比 MC9S08QG4CFFE →
NXP Semiconductors
Package: 16-TSSOP (4.40 mm body width)
RoHS Status: Compliant (Pb-free terminal finish per Octopart listing)
Debug Interface: BDM (Background Debug Mode)
对比 MC9S08QG4CFFE →
NXP Semiconductors
Core: RS08 (8-bit)
对比 MC9S08QG4CFFE →
NXP Semiconductors
Package: 8-pin PDIP (DIP-8)
Core: HCS08 (S08QD family)
RoHS Status: Compliant
对比 MC9S08QG4CFFE →
NXP Semiconductors
Package: 8-SOIC (SO-8)
Core: HCS08 (S08 core)
RoHS Status: Compliant
对比 MC9S08QG4CFFE →
NXP Semiconductors
Package: 16-pin PDIP (DIP-16, through-hole)
Core: S08 (HCS08) 8-bit CPU
RoHS Status: Compliant
对比 MC9S08QG4CFFE →
NXP Semiconductors
Package: 16-TSSOP
Instruction Set: HC08 instruction set with BGND instruction
对比 MC9S08QG4CFFE →
NXP Semiconductors
Package: 16-QFN-EP (5x5 mm), Exposed Pad
RoHS Status: RoHS3 (per Mouser ROO listing)
Instruction Set: CISC
对比 MC9S08QG4CFFE →
NXP Semiconductors
Package: 16-QFN-EP (5x5 mm) with exposed pad
Instruction Set: HC08 with added BGND instruction
对比 MC9S08QG4CFFE →
NXP Semiconductors
Package: 8-pin DFN-EP (4x4 mm)
Core: HCS08 (enhanced S08)
RoHS Status: ROHS compliant (per datasheet)
对比 MC9S08QG4CFFE →
NXP Semiconductors
Package: 8-pin SOIC (SOIC-8)
Core: HCS08 (S08) 8-bit CISC
RoHS Status: Compliant
对比 MC9S08QG4CFFE →
NXP Semiconductors
Package: 8-SOIC (0.154", 3.90 mm width)
Debug Interface: Background Debug Mode (BDM) with breakpoints
对比 MC9S08QG4CFFE →

快速对比工具——选择替代料号进行并排对比:

MC9S08QG4CFDE

✅ 直接替换 ⚠️ 规格未核验
📦 16-QFN-EP (5x5)
same S08QG 4KB flash 20 MHz die and QFN-16 footprint, extended-temperature variant

📋 参考替代料(不在目录中)

MC9S08QG4CFFR

✅ 直接替换 ⚠️ 规格未核验
📦 16-QFN-EP (5x5)
identical die and QFN-16 footprint, tape-and-reel packing suffix

📋 参考替代料(不在目录中)

MC9S08QG8CFDE

✅ 直接替换 ⚠️ 规格未核验
📦 16-QFN-EP (5x5)
8KB flash vs 4KB flash (+100%), same S08 core and QFN-16 footprint

📋 参考替代料(不在目录中)

MC9S08QG4MPAE

✅ 直接替换
📦 [DATA_NEEDED: package of MC9S08QG4MPAE]
different quality-flow/temperature suffix, same 4KB flash 20 MHz S08QG die per FindIC comparison

📋 参考替代料(不在目录中)

MC9S08QG4CFFE 最大额定值与电气特性

Core Processor S08
Core Size 8-Bit
CPU Architecture HCS08 CISC, HC08 instruction set with added BGND instruction
最大时钟频率 20 MHz
Program Memory Size 4KB (4K x 8) FLASH
电源电压 2.5 V / 3.3 V
封装 16-QFN-EP (5x5 mm), QFN EP
Package Code HVQCCN
Package Shape Square
Number of Terminals 16
Terminal Form No Lead
Temperature Grade Industrial
Series S08QG (QG Series, S08 Family)
Debug Features Background debugging system, single breakpoint in-circuit plus two more on-chip
安装类型 Surface Mount
Packaging Tray
生命周期状态 End of Life (per NXP product page)

MC9S08QG4CFFE square 引脚配置指南

MC9S08QG4CFFE(square 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

MC9S08QG4CFFE 的 square 封装引脚图

暂无详细引脚数据: MC9S08QG4CFFE.

请参阅 数据手册 以查看完整引脚配置。

典型应用

MC9S08QG4CFFE 适用于 6 应用s: Battery-Powered Consumer Devices, Low-Cost Sensing Nodes, Small Appliance Control, Legacy S08QG Board Continuation, Educational and Hobby Embedded Projects, Simple Human-Machine Interface Controllers.

📱

Battery-Powered Consumer Devices

The MC9S08QG4CFFE fits battery-powered consumer products because NXP designed the S08QG family explicitly as a 'perfect fit for battery-powered devices', pairing a low-power S08 8-bit core with 2.5V/3.3V operation. In a two-cell battery product, the MCU can run directly from the cell stack without a regulated rail, and its 20 MHz CPU delivers adequate performance for key scanning, LED control, and simple state machines while lower clock modes extend runtime. The compact 16-QFN-EP 5x5 mm footprint keeps the PCB small for handheld form factors. Firmware stored in 4KB flash with in-circuit background debugging simplifies field iteration.

🧩

Low-Cost Sensing Nodes

In distributed sensing nodes, the MC9S08QG4CFFE acts as the local controller that reads sensors, filters readings, and communicates over a serial link. The S08QG family provides serial interfaces and peripherals normally found in higher-end devices in a very small package, per NXP, so a single 16-pin QFN device can handle sensor digitization and communication with minimal board area. Operating from 2.5V or 3.3V aligns with typical low-power sensor rails, and the no-lead QFN-EP package supports compact two-layer layouts. Industrial temperature grade extends suitability to unconditioned environments such as outdoor or factory-floor nodes.

🏭

Small Appliance Control

Small appliances - fans, chargers, kettles, and similar mains-powered products - need a low-cost controller for button inputs, indicator LEDs, and simple thermal or timing logic. The MC9S08QG4CFFE covers these needs with a 20 MHz S08 core, 4KB flash, and on-chip peripherals in a 16-QFN-EP package, keeping BOM cost and board area minimal. Its industrial temperature grade tolerates the elevated internal temperatures typical of enclosed appliances. The on-chip background debugging system allows in-circuit firmware updates during production line programming, and the HC08 instruction set heritage ensures broad toolchain and legacy-code compatibility for appliance platforms.

🔧

Legacy S08QG Board Continuation

Boards already designed around the S08QG family face sourcing risk now that the MC9S08QG4CFFE is End of Life per NXP. For continuity builds, same-footprint family variants such as the MC9S08QG4CFDE and MC9S08QG8CFDE provide drop-in replacements on the existing 16-QFN-EP land pattern, preserving the validated PCB while extending supply. Authorized aftermarket sources such as Rochester Electronics also list the original part number for legacy programs. When migrating firmware to the QG8 variant, the identical S08 core and instruction set minimize code changes to linker settings and memory mapping.

🔧

Educational and Hobby Embedded Projects

The MC9S08QG4CFFE and its S08QG family are attractive for learning embedded development: an 8-bit CISC core with a documented HC08-derived instruction set, 4KB flash for small programs, and a background debugging system that supports single-wire in-circuit debugging on inexpensive hardware. NXP's S08 toolchain and CodeWarrior-class environments provide assembly and C development. The 5x5 mm QFN-EP package suits adapter boards and breadboard carriers, and 2.5V/3.3V operation matches common low-voltage peripherals. Breakpoint capability with one in-circuit breakpoint plus additional on-chip breakpoints makes step-by-step debugging practical for students.

📺

Simple Human-Machine Interface Controllers

Simple HMIs - button panels, indicator clusters, small status displays - need a controller with enough I/O and timers but minimal cost. The MC9S08QG4CFFE provides this in 16 pins: the S08 core executes key-scan and debounce loops at up to 20 MHz while 4KB flash stores look-up tables and display logic. NXP notes the S08QG family carries serial interfaces and peripherals normally found in higher-end devices, useful when the panel must talk to a host over a serial link. The QFN-EP no-lead package mounts flush on the back of a membrane-panel PCB, and 2.5V/3.3V operation suits battery or logic-rail powered panels.

推荐产品汇总

MC9S08QG8CFDE Higher-memory S08QG family upgrade in same footprint 用于: Battery-Powered Consumer Devices, Legacy S08QG Board Continuation, Simple Human-Machine Interface Controllers MC9S08QG4CFDE Extended-temperature same-package variant 用于: Battery-Powered Consumer Devices, Small Appliance Control, Legacy S08QG Board Continuation TLV2545IDGKR Texas Instruments 用于: Low-Cost Sensing Nodes TLC549IDR Texas Instruments 用于: Low-Cost Sensing Nodes MC9S08QG4CDTE NXP Semiconductors 用于: Educational and Hobby Embedded Projects TSA7887ARMZ-REEL Silicon Labs 用于: Simple Human-Machine Interface Controllers
What is the MC9S08QG4CFFE microcontroller?
The MC9S08QG4CFFE is an NXP (formerly Freescale) 8-bit S08 microcontroller with a 20 MHz HCS08 CPU, 4KB (4K x 8) FLASH program memory, and operation from 2.5V or 3.3V supplies. It is packaged in a 16-terminal QFN-EP (5x5 mm, HVQCCN square no-lead) in industrial temperature grade. According to NXP, it belongs to the S08QG family, which packs peripherals normally found in higher-end devices into a very small, low-power package suited to battery-powered products.
Is MC9S08QG4CFFE end of life?
Yes. According to the NXP official product page for MC9S08QG4CFFE, the device is listed as End of Life, with discontinuance and replacement information and a Product Change Notice published on that page. Engineers should place last-time-buy orders while distributor stock remains (DigiKey and Mouser listed inventory), or qualify a replacement such as other members of the S08QG family in the same 16-QFN-EP footprint before committing to new designs.
What is the difference between MC9S08QG4CFFE and MC9S08QG4CDTE?
The main difference is the package. The MC9S08QG4CFFE is supplied in a 16-terminal QFN-EP (no-lead, HVQCCN) package, while the MC9S08QG4CDTE is supplied in a 16-terminal TSSOP package with leads. Both are 8-bit S08 MCUs from the S08QG family with 4KB flash and a 20 MHz core, so they are functionally similar but NOT drop-in replaceable because the land patterns differ. FindIC lists a direct comparison of the two parts confirming this package distinction.
What package does MC9S08QG4CFFE come in?
The MC9S08QG4CFFE comes in a 16-QFN-EP (exposed pad) package measuring 5x5 mm, with package code HVQCCN, square shape, 16 terminals in no-lead terminal form. It is a surface-mount device shipped in trays per the distributor listings. The exposed-pad construction improves thermal and grounding performance on the PCB, and the no-lead design keeps the footprint compact for space-constrained, battery-powered embedded applications.
What is the price of MC9S08QG4CFFE?
As of 2026-10-18, XAIPART lists MC9S08QG4CFFE at USD 1.85 for 1 unit, USD 1.68 at 10 units, USD 1.42 at 100 units, USD 1.25 at 500 units, and USD 1.10 at 1000 units. Octopart reports pricing comparison across 7 distributors for this part, and DigiKey and Mouser also list it for purchase. Because the part is End of Life, prices may rise as remaining stock is depleted, so requesting current quotes before volume purchasing is recommended.
Where can I buy MC9S08QG4CFFE online?
You can buy MC9S08QG4CFFE from XAIPART, as well as from major distributors including DigiKey (part page 954717, ships today), Mouser, and Newark (order code 62K5125). Octopart aggregates availability from 7 distributors for this NXP part. Because the device is End of Life per NXP, availability is limited to remaining stock; Rochester Electronics also lists the part as an authorized aftermarket source for discontinued NXP semiconductors.
What is the operating voltage of MC9S08QG4CFFE?
The MC9S08QG4CFFE operates from 2.5V or 3.3V supplies, per the FindIC specification summary (MCU 8-bit S08 CISC, 4KB flash, 2.5V/3.3V, 16-pin QFN EP). This low-voltage operation supports direct powering from two alkaline cells or a 3.3V regulated rail in battery-powered designs. Always verify the full operating range and maximum ratings in the manufacturer datasheet before finalizing the power supply design for your specific application.
Can MC9S08QG4CDTE replace MC9S08QG4CFFE in my design?
Not as a direct drop-in. The MC9S08QG4CDTE is the same S08QG 4KB flash 20 MHz device functionally, but it comes in a 16-TSSOP package with leads, whereas the CFFE uses a 16-QFN-EP no-lead package. The PCB land pattern must be changed, so this is a redesign-level substitution, not pin-to-pin replacement. If your board is already laid out for the QFN footprint, choose a same-package family variant instead and verify pinout compatibility against the datasheet.
What is the best drop-in replacement for MC9S08QG4CFFE?
The best drop-in replacements are other S08QG-family parts in the same 16-QFN-EP footprint, such as the MC9S08QG4CFDE (same memory and speed with extended-temperature option) or higher-memory family members like the MC9S08QG8 in QFN packages. Because the MC9S08QG4CFFE is End of Life per NXP, qualifying one of these pin-compatible family variants on your existing QFN-16 footprint is the most reliable long-term sourcing strategy. Confirm pinout and parameter parity against the NXP datasheets before tape-out.
How much flash memory does MC9S08QG4CFFE have?
The MC9S08QG4CFFE has 4KB (4K x 8) of FLASH program memory, as stated in the DigiKey product listing. This in-system-erasable and programmable flash stores the application code for the 8-bit S08 core. If your firmware outgrows 4KB, the QG8 family members with larger flash are the natural upgrade path, and some share the same package footprint. Check the NXP S08QG family datasheet for flash programming specifications and erase/write endurance details.
What clock speed does the MC9S08QG4CFFE run at?
The MC9S08QG4CFFE runs at up to 20 MHz, per the DigiKey and Mouser listings describing it as an 'S08 Microcontroller IC 8-Bit 20MHz'. The HCS08 CPU executes the HC08 instruction set with an added BGND instruction for background debugging. Lower bus clock frequencies can be configured for reduced power consumption in battery-powered applications; consult the NXP datasheet for oscillator and internal clock generation options.
Is MC9S08QG4CFFE the same as MC9S08QG4MPAE?
No. The MC9S08QG4MPAE is a comparison counterpart listed by FindIC; the 'CFFE' and 'MPAE' suffixes denote different packaging and/or temperature-grade and quality-flow options within the MC9S08QG4 device family. Both share the S08 core, 4KB flash, and 20 MHz CPU, but package type and operating-temperature qualification differ, so the two parts are not necessarily interchangeable on the same PCB. Always verify the exact package and temperature range suffix against the NXP ordering-information table before substituting.
Where can I download the MC9S08QG4CFFE datasheet PDF?
You can download the MC9S08QG4CFFE datasheet PDF from the NXP official product page at nxp.com/part/MC9S08QG4CFFE, which links the Data Sheet along with discontinuance notices and replacement Product Change Notices. Alternative mirrors include datasheets.com and alldatasheet.com (Freescale Semiconductor PDF archive, File Size 177KB, published 2012-03-09 per FindIC). For End-of-Life parts, the NXP page is the authoritative source for the latest documentation and lifecycle notices.
Is MC9S08QG4CFFE suitable for battery-powered applications?
Yes. According to NXP, the S08QG family is a 'perfect fit for battery-powered devices', featuring low-power S08 8-bit architecture in a small package. The MC9S08QG4CFFE combines this low-power core with 2.5V/3.3V operation and a compact 16-QFN-EP (5x5 mm) footprint. For battery designs, use lower bus-clock configurations and the S08 low-power stop/wait modes described in the family datasheet to extend battery life, and verify quiescent currents for your selected operating mode.
What are the key specifications of MC9S08QG4CFFE that engineers should know?
Key facts: NXP MC9S08QG4CFFE is an 8-bit S08 (HCS08) CISC microcontroller, 20 MHz maximum CPU frequency, 4KB (4K x 8) FLASH, 2.5V/3.3V supply, industrial temperature grade, in a 16-terminal QFN-EP 5x5 mm package (HVQCCN, no-lead, square), tray-packed. It includes an on-chip background debugging system and breakpoint capability for in-circuit debugging. Lifecycle status is End of Life per NXP. These parameters define its fit for small, low-power embedded control tasks.
What can replace MC9S08QG4CFFE after it goes end of life?
Replacement options are, in order of preference: (1) same-family NXP parts in the identical 16-QFN-EP footprint, such as MC9S08QG4CFDE or the larger-memory MC9S08QG8 in QFN packages, which minimize redesign; (2) the MC9S08QG4CDTE in TSSOP-16 if a PCB respin is acceptable; and (3) authorized aftermarket sources such as Rochester Electronics, which lists the original MC9S08QG4CFFE for legacy builds. NXP's product page provides discontinuance and replacement guidance plus a Product Change Notice.

工程参考数据: MC9S08QG4CFFE ——对比、设计指导和合规信息。

选型指南

Choose the MC9S08QG4CFFE only to maintain existing qualified builds or last-time-buy stock - NXP lists it as End of Life. For new or continuation designs on an existing 16-QFN-EP footprint, the MC9S08QG4CFDE is the nearest equivalent (same 4KB flash, 20 MHz, same package, extended-temperature option), and the MC9S08QG8CFDE is the right choice if firmware has outgrown 4KB, since it doubles flash on the identical footprint. If a PCB respin is acceptable and hand assembly matters, the MC9S08QG4CDTE in 16-TSSOP offers the same functionality in a leaded package. There is no verified cross-brand drop-in equivalent in the 16-QFN-EP footprint; switching to another MCU vendor requires board-level redesign and firmware porting, so staying within the pin-compatible S08QG family is the lowest-risk path.

与替代料对比

参数 本产品 MC9S08QG4CFDE MC9S08QG8CFDE MC9S08QG4CDTE MC9S08QG4MPAE
Brand NXP Semiconductors (Freescale) NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core S08 (HCS08), 8-bit S08 (HCS08), 8-bit S08 (HCS08), 8-bit S08 (HCS08), 8-bit S08 (HCS08), 8-bit
Max Clock Frequency 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz
Flash Memory 4KB (4K x 8) 4KB 8KB (+100%) 4KB 4KB

关键差异点

  • Largest memory in the true drop-in set (对比 MC9S08QG4CFDE)
  • Upgradability within the same footprint (对比 MC9S08QG8CFDE)
  • Small-footprint choice over leaded variant (对比 MC9S08QG4CDTE)

设计说明

The MC9S08QG4CFFE is End of Life according to the NXP product page, which also hosts the discontinuance notice and replacement Product Change Notice. Do not start new designs on this exact MPN. Place last-time-buy orders sized to your field-support horizon, and qualify a same-footprint family variant (e.g., MC9S08QG4CFDE or MC9S08QG8CFDE on the same 16-QFN-EP land pattern) as the second source before existing stock is exhausted.

The 16-QFN-EP package has an exposed pad on the underside that must be soldered to a ground Via pattern on the PCB for reliable grounding and thermal performance. Use an NSMD pad pattern with an approximately 50-60% solder-mask aperture reduction for the center pad per standard QFN assembly practice, and verify the pad geometry against the manufacturer's footprint drawing in the datasheet. No-lead packages require X-ray or visible-joint inspection criteria agreed with your assembler.

The device operates from 2.5V or 3.3V supplies. Provide local 0.1 uF decoupling directly at the supply pin and a bulk capacitor near the regulator output. For battery-powered designs, exploit the S08 low-power stop and wait modes and reduce bus clock frequency during idle periods; verify exact per-mode current figures in the NXP datasheet table rather than estimating, since these values are not stated in the distributor summaries used here.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown

The NXP product page includes an 'Environmental Quality' section for MC9S08QG4CFFE, but specific RoHS/REACH/lead-free status was not stated in the retrieved snippets. Consult the NXP Environmental Quality page for this exact ordering code.

数据核验日期: 2026-10-18 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

MC9S08QG4CFFE MC9S08QG4CFFE datasheet NXP MC9S08QG4CFFE MC9S08QG4CFFE end of life replacement MC9S08QG4CFFE vs MC9S08QG4CDTE MC9S08QG4CFFE 16-QFN 4KB flash microcontroller MC9S08QG4CFFE price buy S08QG 8-bit MCU 20MHz drop-in replacement MC9S08QG4CFFE pinout 16-QFN-EP what can replace MC9S08QG4CFFE MC9S08QG4CFFE battery powered applications Freescale MC9S08QG4CFFE equivalent

相关元器件 & 术语

NXP Semiconductors Freescale Semiconductor MC9S08QG4CFFE MC9S08QG4CFDE MC9S08QG8CFDE MC9S08QG4CDTE MC9S08QG4MPAE S08 core HCS08 CPU 8-bit microcontroller microcontroller (MCU) S08QG family 16-QFN-EP HVQCCN QFN package family surface mount in-circuit debugging background debugging system BGND instruction flash memory End of Life Rochester Electronics industrial temperature grade battery-powered devices
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