MC9S12DT256MPVE vs MC9S12DT256MFUE 对比

详细并排对比 MC9S12DT256MPVE 出自 NXP Semiconductors 和 MC9S12DT256MFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd
NXP Semiconductors
MC9S12DT256MFUE MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE ✓ 量产中

规格对比

参数 MC9S12DT256MPVE MC9S12DT256MFUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $14.36 $19.20
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz 25 MHz
Program Memory (Flash) 256 KB —
RAM 12 KB [DATA_NEEDED: RAM size]
EEPROM 4 KB [DATA_NEEDED: EEPROM size]
数据总线宽度 16-bit 16-bit
电源电压 2.35 V to 2.75 V (regulated core) —
I/O Pins 91 —
ADC 2 x 10-bit, 8 channels each (16 channels total) 16-channel, 10-bit (per family)
Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
封装 112-LQFP (20x20 mm) —
安装类型 Surface Mount Surface Mount
工作温度 -40C to +125C (automotive grade) —
Debug Interface Background Debug Mode (BDM) + JTAG —
RoHS 状态 Compliant [DATA_NEEDED: RoHS status]
生命周期状态 NRND (Not Recommended for New Designs) —
Core Architecture — HCS12 (CPU12), 16-bit CISC
Flash Memory — 256 KB (256K x 8)
Operating Supply Voltage (Core) — 2.35 V to 2.75 V
I/O Supply Voltage — 5V-tolerant I/O on VDDR/VSSR
Number of I/O Pins — 91
Package Type — 80-QFP (PQFP/LQFP-80, 14x14 mm)
Terminal Form — GULL WING
Number of Terminals — 80
Temperature Grade — Automotive
MSL 等级 — [DATA_NEEDED: MSL level]
On-chip CAN Module — MSCAN (CAN 2.0A/B)
PWM Module — 8-channel 16-bit PWM
Communication Peripherals — SCI, SPI, IIC, BDLC

数据手册与资源

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