MC9S12DT256MPVE vs MC9S12DT256MFUE 비교

다음의 상세 나란히 비교: MC9S12DT256MPVE 제조: NXP Semiconductors 및 MC9S12DT256MFUE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd
NXP Semiconductors
MC9S12DT256MFUE MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE ✓ 활성

사양 비교

파라미터 MC9S12DT256MPVE MC9S12DT256MFUE
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND 활성
재고 상태 In Stock In Stock
단가 (USD) $14.36 $19.20
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz 25 MHz
Program Memory (Flash) 256 KB —
RAM 12 KB [DATA_NEEDED: RAM size]
EEPROM 4 KB [DATA_NEEDED: EEPROM size]
데이터 버스 폭 16-bit 16-bit
공급 전압 2.35 V to 2.75 V (regulated core) —
I/O Pins 91 —
ADC 2 x 10-bit, 8 channels each (16 channels total) 16-channel, 10-bit (per family)
Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
패키지 112-LQFP (20x20 mm) —
실장 유형 Surface Mount Surface Mount
동작 온도 -40C to +125C (automotive grade) —
Debug Interface Background Debug Mode (BDM) + JTAG —
RoHS 상태 Compliant [DATA_NEEDED: RoHS status]
수명 주기 상태 NRND (Not Recommended for New Designs) —
Core Architecture — HCS12 (CPU12), 16-bit CISC
Flash Memory — 256 KB (256K x 8)
Operating Supply Voltage (Core) — 2.35 V to 2.75 V
I/O Supply Voltage — 5V-tolerant I/O on VDDR/VSSR
Number of I/O Pins — 91
Package Type — 80-QFP (PQFP/LQFP-80, 14x14 mm)
Terminal Form — GULL WING
Number of Terminals — 80
Temperature Grade — Automotive
MSL 레벨 — [DATA_NEEDED: MSL level]
On-chip CAN Module — MSCAN (CAN 2.0A/B)
PWM Module — 8-channel 16-bit PWM
Communication Peripherals — SCI, SPI, IIC, BDLC

데이터시트 & 자료

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