MCIMX233DJM4B vs MCIMX233CJM4C 对比

详细并排对比 MCIMX233DJM4B 出自 NXP Semiconductors 和 MCIMX233CJM4C 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MCIMX233DJM4B MCIMX233DJM4B - i.MX23 ARM926EJ-S MPU, 454 MHz, 169-MAPBGA | NXP Semiconductors

MCIMX233DJM4B - i.MX23 ARM926EJ-S MPU, 454 MHz, 169-MAPBGA | NXP Semiconductors

MCIMX233DJM4B ⚠ 最后一次采购
NXP Semiconductors
MCIMX233CJM4C MCIMX233CJM4C - i.MX233 ARM9 454MHz MPU 169-BGA | NXP

MCIMX233CJM4C - i.MX233 ARM9 454MHz MPU 169-BGA | NXP

MCIMX233CJM4C ✗ 停产

规格对比

参数 MCIMX233DJM4B MCIMX233CJM4C
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 停产
库存状态 有库存 有库存
单价(USD) $9.85 $9.85
Core Architecture ARM926EJ-S ARM926EJ-S (ARMv5TEJ)
Core Count 1 —
数据总线宽度 32-bit 32-bit
Maximum CPU Clock 454 MHz 454 MHz
Instruction Cache 16 KB —
Data Cache 16 KB —
封装 169-MAPBGA (11x11 mm) —
Ball Pitch 0.65 mm —
USB USB HS Device/Host with integrated PHY —
UART 3 —
SSP (SPI) 2 —
I2C 1 master —
Serial Audio Interface (SAI) 2 —
SPDIF 1 (transceiver) —
Low-Resolution ADC 6 channels, 12-bit —
LCD Controller Yes (digital TFT panels) —
Integrated PMU Yes (linear LDOs + DCDC control) —
Mixed-Signal Audio / Headphone Amplifier Yes (integrated) —
电源电压 Single 3.6 V to 4.5 V (Li-Ion cell) —
工作温度范围 -40 C to +85 C (commercial grade) -40C to +85C (Industrial)
安装类型 Surface Mount (BGA) Surface Mount
Number of Cores — 1
Instruction Cache (I-Cache) — 16 KB
Data Cache (D-Cache) — 16 KB
Internal SRAM — 32 KB
ROM (Bootloader) — 64 KB
Program Memory Size — 64 KB (16K x 32)
RAM Size — 32 KB (8K x 32)
Number of I/O — 95
Oscillator Type — External
封装 / 外壳 — 169-MAPBGA (11x11 mm)
Process Technology — 90 nm CMOS
RoHS 状态 — Compliant

数据手册与资源

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