MPC8343ECVRAGDB vs MPC8343ECZQAGDB 对比

详细并排对比 MPC8343ECVRAGDB 出自 NXP Semiconductors 和 MPC8343ECZQAGDB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8343ECVRAGDB MPC8343ECVRAGDB - PowerQUICC II Pro MPU, e300, 400MHz, 620-HBGA | NXP

MPC8343ECVRAGDB - PowerQUICC II Pro MPU, e300, 400MHz, 620-HBGA | NXP

MPC8343ECVRAGDB ✗ 停产
NXP Semiconductors
MPC8343ECZQAGDB MPC8343ECZQAGDB - 400MHz PowerQUICC II Pro SoC | NXP

MPC8343ECZQAGDB - 400MHz PowerQUICC II Pro SoC | NXP

MPC8343ECZQAGDB ⚠ 最后一次采购

规格对比

参数 MPC8343ECVRAGDB MPC8343ECZQAGDB
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 停产 最后采购期
Core Architecture PowerPC e300 (32-bit) Power Architecture (e300), 32-bit
Core Frequency 400 MHz 400 MHz
Number of Cores 1 —
封装 620-HBGA (29x29 mm) 620-PBGA (29 x 29 mm)
电源电压 1.8 V / 2.5 V / 3.3 V —
L1 Cache 16 KB instruction / 16 KB data —
L2 Cache External (cache controller integrated) —
Memory Controller DDR1 / DDR2 (32-bit, with ECC) DDR1 / DDR2 with ECC
PCI Interface PCI 2.3, 32-bit, 66 MHz 32-bit, 66 MHz
Ethernet 1 Gbit (10/100/1000) 1 x 10/100/1000 MAC (GbE)
USB USB 2.0 (Full/High Speed) USB 2.0 full-speed host/device
Security Engine SEC (DES/3DES/AES/SHA/RSA/RNG) SEC 2.0 (IPsec/SSL acceleration)
Process Technology 0.13 um CMOS 0.13 μm CMOS
工作温度 -40 C to +105 C -40 °C to +105 °C (industrial)
安装类型 Surface Mount (BGA) Surface Mount (BGA)
MSL 等级 [DATA_NEEDED: MSL Level] —
RoHS 状态 Compliant Compliant per NXP product page
Instruction Set — PowerPC compliant
Operating Voltage — 1.8 V / 2.5 V / 3.3 V
DMA Channels — 4

数据手册与资源

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