MPC8555EPXAPF vs MPC8555VTAPF 对比
详细并排对比 MPC8555EPXAPF 出自 NXP Semiconductors 和 MPC8555VTAPF 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC8555EPXAPF | MPC8555VTAPF |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $92.50 | $152.00 |
| Architecture | PowerPC e500 (Power Architecture) | — |
| Core | Single e500 | — |
| 数据总线宽度 | 32-Bit | — |
| Maximum Clock Speed | 833 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 2.5 V / 3.3 V | — |
| Package Type | FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) | — |
| Package Height | 3.75 mm | — |
| 引脚数量 | 783 | — |
| 工作温度范围 | -40 °C to +85 °C (industrial, extended) | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| Memory Controller | DDR / DDR2 up to 333 MHz | — |
| Ethernet | Two 10/100 Fast Ethernet MACs | Dual 10/100/1000 MAC with TCP/IP acceleration |
| PCI Interface | PCI / PCI-X bridge (up to 133 MHz) | — |
| Process Technology | 130 nm CMOS | — |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Security Engine | SEC 2.0 (Integrated) | IPSec / SSL / TLS / 3DES / AES acceleration |
| Core Processor | — | PowerPC e500 |
| Number of Cores | — | 1 Core, 32-Bit |
| Maximum Core Frequency | — | 833 MHz |
| Co-Processor / DSP | — | Communications; CPM (Communications Processor Module) |
| Memory Controllers | — | DDR, SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | Yes (per datasheet) |
| PCI / PCI-X Interfaces | — | Dual PCI/PCI-X |
| Local Bus Controller | — | Yes |
| L1 Cache | — | 32 KB Instruction + 32 KB Data |
| 工作温度 | — | -40C to +105C (Industrial / Extended) |
| 封装 | — | 783-FCPBGA, 29x29 mm |
| 安装类型 | — | Surface Mount (BGA) |
| Part Status | — | Not For New Designs |