MRF6S23140HR3 vs MRF6S27050HR5 对比
详细并排对比 MRF6S23140HR3 出自 NXP Semiconductors 和 MRF6S27050HR5 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MRF6S23140HR3 - 28W, 2.3GHz RF Power LDMOS | NXP Semiconductors
MRF6S23140HR3 ✓ 量产中NXP Semiconductors
MRF6S27050HR5 - 2.62 GHz RF Power LDMOS, 7W, NI-780H | NXP
MRF6S27050HR5 Obsolete规格对比
| 参数 | MRF6S23140HR3 | MRF6S27050HR5 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | MOSFETs | MOSFETs |
| 生命周期状态 | 有效 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $65.00 | $17.50 |
| 晶体管类型 | LDMOS, N-Channel Enhancement-Mode | LDMOS, N-Channel, RF Power |
| Technology | Lateral N-Channel RF Power MOSFET | — |
| Drain-Source Voltage (Rated) | 68 V | — |
| Operating Drain Voltage (Typical) | 28 V | — |
| Test Quiescent Drain Current | 1.3 A | — |
| Operating Frequency Range | 2300 MHz to 2400 MHz | — |
| Test Frequency | 2.39 GHz | — |
| Output Power (Average, 2 x W-CDMA) | 28 W | — |
| Power Gain | 15.2 dB | — |
| Drain Efficiency | [DATA_NEEDED: drain efficiency %] | — |
| 封装 / 外壳 | NI-880H-2L (CASE 465B-03, STYLE 1) | NI-780H-2L |
| 安装类型 | Chassis / Flange Mount | Chassis Mount / Screw Flange |
| Configuration | Single, push-pull capable | — |
| Input Matching | Internally matched (per datasheet) | — |
| 工作温度范围 | [DATA_NEEDED: operating temperature range] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Status | — | Obsolete |
| Frequency | — | 2.62 GHz (operating band) |
| Test Voltage (Vds) | — | 28 V |
| Current Rating | — | [DATA_NEEDED: continuous/maximum drain current] |
| Test Current | — | 500 mA |
| Power Gain (Gps) | — | 16 dB (typical at 2.62 GHz) |
| Power Output | — | 7 W |
| Voltage - Rated (Vds max) | — | 68 V |
| Supplier Device Package | — | NI-780 |
| 工作温度 | — | [DATA_NEEDED: operating temperature range] |
| MSL 等级 | — | Not applicable (non-surface-mount ceramic package) |
| Primary Application | — | WCDMA / UMTS base-station PA driver and final stage |