MRF8S9170NR3 vs MRF8S9220HSR3 对比

详细并排对比 MRF8S9170NR3 出自 NXP Semiconductors 和 MRF8S9220HSR3 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MRF8S9170NR3 MRF8S9170NR3 - 50W 920-960MHz RF Power LDMOS | NXP

MRF8S9170NR3 - 50W 920-960MHz RF Power LDMOS | NXP

MRF8S9170NR3 ✓ 量产中
NXP Semiconductors
MRF8S9220HSR3 MRF8S9220HSR3 - 65W 920-960MHz W-CDMA RF Power LDMOS | NXP

MRF8S9220HSR3 - 65W 920-960MHz W-CDMA RF Power LDMOS | NXP

MRF8S9220HSR3 ✓ 量产中

规格对比

参数 MRF8S9170NR3 MRF8S9220HSR3
品牌 NXP Semiconductors NXP Semiconductors
分类 MOSFETs MOSFETs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $38.50 $96.80
Manufacturer NXP Semiconductors —
晶体管类型 LDMOS, N-Channel Enhancement-Mode Lateral MOSFET —
Technology RF Power LDMOS LDMOS (Laterally Diffused MOSFET), N-Channel Enhancement-Mode
Frequency Range 920 MHz to 960 MHz 920 MHz to 960 MHz
Output Power (Average, W-CDMA) 50 W —
Power Gain (Typical) 19.3 dB at 920 MHz, 28 V, 1 A quiescent bias —
Drain-Source Voltage Rating (Vdss) 70 V —
Operating Drain Voltage (Test Condition) 28 V —
Quiescent Bias Current (Idq, Test Condition) 1 A —
Drain Current (Operating) [DATA_NEEDED: typical operating Id at 50 W Pout] —
封装 OM-780-2 (ceramic flange) —
安装类型 Surface Mount / Flange Mount (bolt-down thermal pad) Surface Mount / Flange Mount
工作温度 [DATA_NEEDED: Tj max and operating range from datasheet] —
Class of Operation Class AB, Class C (W-CDMA) —
Lead-Free / RoHS Lead Free (per digchip listing) Lead Free (per DigChip listing)
ESD Protection [DATA_NEEDED: ESD class rating from datasheet] —
Impedance Characterization Series-equivalent large-signal impedance parameters provided —
Test Conditions Note 100% PAR tested for guaranteed output power capability —
Output Power (Avg, W-CDMA) — 65 W
Operating Drain Voltage (VDD) — 28 V (typical)
Drain-Source Voltage Rating (VDS max) — 70 V
Power Gain (typ) — 19.4 dB
Test Drain Current — 1.6 A
Drain Efficiency (typ) — [DATA_NEEDED: drain efficiency %]
封装 / 外壳 — NI-780S (Case 465-06, Style 1), ceramic
Package Dimensions (L x W x H) — 20.7 mm x 9.91 mm x 4.32 mm
Configuration — Single-ended, 1-carrier W-CDMA
工作结温 — -65 C to +225 C
Modulation Support — W-CDMA, CDMA, LTE (Class AB / Class C)

数据手册与资源

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