MT40A1G8AG-062E vs H5AN4G8NBJR-UHC 对比

详细并排对比 MT40A1G8AG-062E 出自 Micron Technology 和 H5AN4G8NBJR-UHC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT40A1G8AG-062E MT40A1G8AG-062E - 8Gb DDR4 SDRAM 3200Mb/s x8 | Micron

MT40A1G8AG-062E - 8Gb DDR4 SDRAM 3200Mb/s x8 | Micron

MT40A1G8AG-062E ✓ 量产中
SK hynix
H5AN4G8NBJR-UHC H5AN4G8NBJR-UHC - 4Gb DDR4 SDRAM 2400, 1.2V | SK Hynix

H5AN4G8NBJR-UHC - 4Gb DDR4 SDRAM 2400, 1.2V | SK Hynix

H5AN4G8NBJR-UHC ✓ 量产中

规格对比

参数 MT40A1G8AG-062E H5AN4G8NBJR-UHC
品牌 Micron Technology SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $3.10 $3.18
存储器类型 DDR4 SDRAM DDR4 SDRAM
存储容量 8 Gbit —
存储组织 1G x 8 512M x 8
接口 Parallel DDR4 (JEDEC)
Clock Frequency 1.6 GHz (DDR4-3200, 3200 MT/s data rate) —
Clock Cycle Time 19 ns class (-062E speed grade) —
Supply Voltage (VDD) 1.2 V —
封装 78-FBGA (7.5 x 11 mm) TFBGA-78 (11 x 7.5 mm)
安装类型 Surface Mount (BGA) Surface Mount
Temperature Grade Automotive (AUT) —
Access Time (CAS Latency class) DDR4-3200 timing class (tAA per datasheet) —
Bank Group Architecture Yes (DDR4 bank groups) —
Termination On-Die Termination (ODT) —
CA Parity Supported (DDR4 command/address parity) —
Packaging Option Tape and Reel (TR / :R suffix) —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant (Rohs Code: Yes)
工作温度范围 [DATA_NEEDED: operating temperature range] —
Refresh Rate [DATA_NEEDED: refresh rate] —
Density — 4 Gbit
数据速率 — 2400 Mbps (PC2400)
电源电压 — 1.2 V
Technology — CMOS DRAM
Lifecycle Code — Active
REACH Compliance — Compliant
Manufacturer — SK Hynix Inc.
工作温度 — [DATA_NEEDED: operating temperature range]
CAS 延迟 — [DATA_NEEDED: CAS latency for -UHC speed bin]
Refresh — [DATA_NEEDED: refresh rate 1x/2x/4x support]

数据手册与资源

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