MT40A512M16LY-075:E vs K4A8G165WB-BCWE 对比
详细并排对比 MT40A512M16LY-075:E 出自 Micron Technology 和 K4A8G165WB-BCWE 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MT40A512M16LY-075:E | K4A8G165WB-BCWE |
|---|---|---|
| 品牌 | Micron Technology | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5.80 | $6.55 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| 存储容量 | 8 Gbit (512M x 16) | — |
| 数据速率 | 2666 MT/s | 3200 Mbps |
| Clock Frequency | 1.33 GHz | — |
| CAS 延迟 | 19 | — |
| Supply Voltage (VDD/VDDQ) | 1.2V ±60mV | — |
| VPP Supply | 2.5V (-125mV, +250mV) | — |
| 接口 | Parallel | Parallel |
| 封装 | 96-FBGA (7.5x13.5mm) | 96FBGA |
| 工作温度范围 | 0°C to +95°C | — |
| Refresh Time | 64ms at -40°C to 85°C, 32ms at >85°C to 95°C, 16ms at >95°C to 105°C | — |
| Internal Banks (x16) | 8 banks (4 groups of 2) | — |
| I/O Type | 1.2V pseudo open-drain | — |
| RoHS | Compliant | — |
| 安装类型 | Surface Mount | Surface Mount |
| Density | — | 8 Gb |
| 存储组织 | — | 512M x 16 |
| 电源电压 | — | 1.2 V |
| Access Time (CAS Latency) | — | 19 ns |
| 工作温度 | — | 0C to +85C |
| Burst Length | — | 8 |
| Bank Group Architecture | — | Yes |
| On-Die Termination (ODT) | — | Yes, dynamic ODT with ZQ calibration |
| Functions | — | Auto precharge, asynchronous reset, CRC, data mask |
| RoHS 状态 | — | Compliant |
| Lead Free | — | Yes |