SPC5517EBVLQ66 vs SPC5516GBMLQ66 对比

详细并排对比 SPC5517EBVLQ66 出自 NXP Semiconductors 和 SPC5516GBMLQ66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
SPC5517EBVLQ66 SPC5517EBVLQ66 - Automotive MCU 1.5MB Flash 66MHz LQFP-144

SPC5517EBVLQ66 - Automotive MCU 1.5MB Flash 66MHz LQFP-144

SPC5517EBVLQ66 ✓ 量产中
NXP Semiconductors
SPC5516GBMLQ66 SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP

SPC5516GBMLQ66 - 32-bit Dual-Core 66MHz MCU 1MB Flash | NXP

SPC5516GBMLQ66 ✓ 量产中

规格对比

参数 SPC5517EBVLQ66 SPC5516GBMLQ66
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $8.15 $10.40
Product Family MPC55xx Qorivva —
Core Power Architecture e200z0 / e200z1 (dual-core) —
Core Size 32-bit 32-Bit Dual-Core
Operating Frequency 66 MHz —
Program Memory (Flash) 1.5 MB (1.5M x 8) —
电源电压 3.3 V / 5 V mixed I/O 4.5 V to 5.25 V
工作温度 -40C to +125C -40C to +125C (AEC-Q100 Grade 3)
Automotive Grade AEC-Q100 qualified —
Number of I/O 111 111
Connectivity CANbus, EBI/EMI, I2C, SCI, SPI CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
封装 144-LQFP (20x20 mm) 144-LQFP (20 x 20 mm, 1.40 mm height)
安装类型 Surface Mount Surface Mount
MSL 等级 3 (168 hours) [DATA_NEEDED: MSL rating]
Part Status Active —
RoHS 状态 Compliant Compliant
Core Processor — e200z0, e200z1
Core Architecture — Power Architecture (MPC55xx Qorivva)
Maximum Clock Speed — 66 MHz
Program Memory Size — 1 MB (1M x 8) FLASH
Program Memory Type — Flash with ECC
RAM Size — [DATA_NEEDED: RAM size]
数据总线宽度 — 32-bit
AEC-Q100 Qualified — Yes (automotive grade)

数据手册与资源

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