W25H02JVTBIM vs MT25QL02GCBB8E12-0AUT 对比
详细并排对比 W25H02JVTBIM 出自 Winbond 和 MT25QL02GCBB8E12-0AUT 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Micron Technology
MT25QL02GCBB8E12-0AUT - 2Gbit SPI NOR Flash 133MHz | Micron
MT25QL02GCBB8E12-0AUT ✓ 量产中规格对比
| 参数 | W25H02JVTBIM | MT25QL02GCBB8E12-0AUT |
|---|---|---|
| 品牌 | Winbond | Micron Technology |
| 分类 | Memory ICs | Flash |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2.38 | $7.65 |
| Density | 2 Gbit (256M x 8) | — |
| 存储器类型 | Serial NOR Flash | NOR Flash, Serial (SPI) |
| 接口 | SPI / Dual SPI / Quad SPI / QPI / DTR | SPI, Dual SPI, Quad I/O |
| Maximum Clock Rate | 133 MHz | — |
| Equivalent Throughput (Quad DTR) | 416 MHz (50 MB/s) | — |
| Access Time | 7.5 ns | — |
| Supply Voltage (VCC) | 2.7 V to 3.6 V | — |
| Sector Size | 4 KB uniform | — |
| Block Size | 32 KB and 64 KB | — |
| Program/Erase Endurance | 100,000 cycles per sector | — |
| Data Retention | 20 years | — |
| 封装 | 24-ball TFBGA (8x6 mm) | 24-T-PBGA (6x8 mm) |
| 工作温度 | -40C to +85C | -40C to +125C |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | Compliant |
| 无卤 | Yes | — |
| JEDEC Manufacturer ID | 0xEF (Winbond) | — |
| Memory Capacity | — | 2 Gbit (256 MB) |
| 存储组织 | — | 256M x 8 |
| 最大时钟频率 | — | 133 MHz |
| 电源电压 | — | 2.7 V to 3.6 V |
| Programming Voltage | — | 3 V |
| Endurance | — | 100000 write/erase cycles |
| Qualification | — | AEC-Q100 (automotive) |
| 特性 | — | XIP, write enable latch, power-on reset, hardware/software write protection, absolute write protection, extended address access |
| Marking Code | — | RW340 |
| Supply Voltage Class | — | 3 V (MT25QL series) |
| Access Protocol Support | — | Standard/Dual-Output/Dual-I/O/Quad-Output/Quad-I/O SPI |