XC6SLX16-3FT256I - Spartan-6 LX FPGA, 14579 Cells, 186 I/O | AMD
料号： XC6SLX16-3FT256I ✓ 量产中XC6SLX16-3FT256I 概述
An FPGA is a reconfigurable digital integrated circuit whose logic, memory and I/O are defined by a bitstream loaded at power-up. A logic cell contains a lookup table plus flip-flops and routing resources, and thousands of such cells are interconnected by a programmable switch matrix. The Spartan-6 LX family is the logic-optimized member of the Spartan-6 series: it targets designs dominated by wide datapaths, control logic, protocol bridges and video/interface consolidation rather than maximum DSP density. In the device hierarchy, this part sits as a programmable logic device within the FPGA & CPLD family of integrated circuits.
Key characteristics of the XC6SLX16-3FT256I include the -3 speed grade, which is the highest-performance Spartan-6 LX grade available, and a 45 nm CMOS process node that keeps both static power and dynamic power manageable in cost-sensitive embedded systems. The device provides 186 user I/O in a compact 256-ball grid, which is a high I/O-to-logic ratio for a device of this size. Temperature handling is specified as 0 C to +85 C (32 F to 185 F) with industrial-grade parts marking, and the FT256 package is offered in a lead-free configuration.
Technically, the device combines LUT-based six-input logic architecture with dedicated block RAM for data buffering and DSP-oriented arithmetic, plus SelectIO resources that support high-speed memory interfaces and common I/O standards through selectable I/O drivers. Because the device is a -3 grade part, timing closure is the easiest of the Spartan-6 LX options, giving the highest achievable system clock and the greatest margin on demanding multi-clock domains. Configuration is handled through the standard Xilinx JTAG and configuration interface scheme, supporting both persistent and reconfiguration-oriented design flows.
Typical applications include industrial control and PLC I/O expansion, industrial Ethernet and fieldbus bridging, video and image datapath consolidation, USB and multi-protocol interface hubs, motor and motion control sequencers, and compact embedded control platforms for aerospace, telecommunications and consumer networking equipment.
When designing with this device, plan the power budget and thermal design around the 1.2 V core supply and the I/O supply rails, and confirm the pinout against the AMD Spartan-6 package pinout files for the FT256 package before layout. Because the FT256 package is a dense 1.0 mm-pitch BGA, a fine-pitch assembly and adequate solder mask and paste control are required to avoid bridging defects.
This page consolidates distributor pricing, verified drop-in replacement options, and packaging and thermal design notes for the XC6SLX16-3FT256I that are not consolidated in any single manufacturer document, so engineers can evaluate the device and its alternates before committing a PCB layout.
直接替换替代料： XC6SLX16-3FT256I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC6SLX16-3FT256I （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Configurable Logic Blocks (CLBs), Lead-Free Status.
XC6SLX16-3FTG256I
✅ 直接替换联系询价
查看数据手册 →XC6SLX16-3FTG256C
✅ 直接替换联系询价
查看数据手册 →XC6SLX16-3FT256C
✅ 直接替换联系询价
查看数据手册 →XC6SLX16-2FTG256I
✅ 直接替换联系询价
查看数据手册 →XC6SLX16-2FTG256C
✅ 直接替换联系询价
查看数据手册 →XC6SLX16-N3FT256I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX16-3FT256I 最大额定值与电气特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX (logic-optimized) |
| Logic Cells | 14,579 cells |
| Configurable Logic Blocks (CLBs) | 1,139 CLBs |
| User I/O Count | 186 I/O |
| Max Internal Frequency | 667 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -3 (highest Spartan-6 LX performance grade) |
| 封装 | 256-LBGA / FTBGA-256 (FT256), surface-mount ball grid |
| Package Body Size | 17 x 17 mm, 1.0 mm ball pitch |
| Terminal Count | 256 terminals |
| 工作温度 | 0 C to +85 C (32 F to 185 F) |
| Temperature Grade Marking | Industrial |
| Lead-Free Status | Lead-free package construction |
| 安装类型 | Surface Mount |
| Package Code | LBGA / FT256 |
XC6SLX16-3FT256I lbga / ft256 引脚配置指南
XC6SLX16-3FT256I（lbga / ft256 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC6SLX16-3FT256I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC6SLX16-3FT256I 适用于 6 应用s: Industrial Control and PLC I/O Consolidation, Industrial Ethernet and Fieldbus Protocol Bridging, Video Image and Display Pipeline Processing, USB and Multi-Protocol Interface Hub, Motor, Motion and Robotics Sequencing, Aerospace, Telemetry and Compact Embedded Control.
Industrial Control and PLC I/O Consolidation
The XC6SLX16-3FT256I is well matched to industrial PLC and remote I/O designs because it concentrates 186 user I/O into a compact 17 x 17 mm FT256 BGA while running on a 1.2 V core with a -3 speed grade for fast deterministic control-loop execution. The -3 grade reaches the 667 MHz class of internal timing, which lets one device host multiple independent clock domains for encoder capture, PWM generation and interlock handling rather than forcing those tasks into separate MCUs. Because the part is marked industrial and offered in lead-free construction, it suits equipment that must ship into long-lifecycle machine and building-automation programs. The trade-off is that block RAM and DSP resources are limited compared with larger Spartan-6 families, so designs needing heavy buffering should consider the LX25 class instead. Manage the 1.2 V rail with a dedicated low-impedance plane and dense via stitching under the BGA to keep the core junction temperature inside the grade limit.
推荐
Industrial Ethernet and Fieldbus Protocol Bridging
Protocol bridging gateways often need to terminate several serial standards and translate them into a common packet format, which is exactly the parallelism an FPGA provides. The XC6SLX16-3FT256I offers 1,139 configurable logic blocks and 14,579 logic cells in a single 256-ball package, enough to run an Ethernet MAC, a fieldbus controller and a host-processor interface concurrently without splitting the design across multiple devices. Its -3 speed grade and 667 MHz class internal timing give generous margin for 100 MHz-class fabric domains and DDR-style source-synchronous interfaces to external PHY and transceiver parts. The 186 I/O count means fewer multiplexing stages and a shorter bill of materials than an MCU-plus-GPIO approach. The main limitation is memory capacity, which is not published in the available distributor data, so buffer-heavy aggregation designs should be verified against the AMD block RAM table for the -3 grade before schematic freeze.
推荐
Video Image and Display Pipeline Processing
Video and image pipelines benefit from FPGA parallelism because pixel-rate datapaths demand sustained multi-gigabit throughput with low latency. The XC6SLX16-3FT256I provides 186 I/O in a compact FT256 footprint, allowing parallel RGB or LVDS data inputs to be captured, colour-converted and re-timed close to the connector, and the -3 speed grade supports the highest clocking of the Spartan-6 LX options for synchronous video timing. Using the FPGA in front of a display or camera pipeline also allows de-bayering, gamma and scaler functions to be updated in the field through reconfiguration. The practical constraint is that video designs usually want larger frame buffers, so designers should confirm available block RAM against the required frame size. Keep the pixel clock domain and the parallel I/O region on the same bank and supply clean, separately filtered rails for the digital I/O to avoid pattern-dependent noise on the pixel bus.
推荐
USB and Multi-Protocol Interface Hub
Compact consumer and instrumentation products often need to bridge USB to one or more legacy or industrial serial buses, a job the XC6SLX16-3FT256I performs with a single device instead of a USB microcontroller plus glue logic. The 1,139 CLBs and 14,579 logic cells allow a UTMI plus USB 2.0 device controller, a command parser and multiple UART or SPI peripherals to run in parallel on one die, while the 186 I/O budget leaves ample pins for downstream bus transceivers. The -3 speed grade keeps the 48 MHz USB full-speed and high-speed PHY interface timing comfortable, and the 1.2 V core supply keeps the power budget low for battery- or bus-powered instruments. Designers should note that the device offers no hard protocol controllers, so all USB and bus logic is soft, meaning CPU budget must be budgeted for soft-IP arbitration. Keep USB differential pairs on a contiguous ground-referenced lane and add ESD protection close to the connector.
推荐
Motor, Motion and Robotics Sequencing
Motion control boards need deterministic timing, many parallel I/O and fast fault reaction, all of which the XC6SLX16-3FT256I provides in a small 256-ball package. The -3 speed grade lets the FPGA generate PWM and step/direction sequences, sample encoder feedback and implement safety interlocks in parallel rather than time-slicing them on a microcontroller, and the 186 I/O count supports several axes plus limit-switch and brake outputs without external mux logic. Its 45 nm CMOS process keeps dynamic power acceptable in continuously running industrial drives, and the 1.2 V core rail simplifies sequencing with the motor-driver supplies. The trade-off is that closed-loop current control is best left to a dedicated analogue or DSP front end, with the FPGA handling sequencing and fault management. Provide separate filtered supplies for the digital core and any 5 V I/O bank, and keep the switching stages physically separated to keep edge-sensitive encoder signals out of high di/dt return paths.
推荐
Aerospace, Telemetry and Compact Embedded Control
Telemetry, instrumentation and small airborne or ground-support platforms reward the combination of Spartan-6 LX logic density with a very small BGA footprint and low core voltage. The XC6SLX16-3FT256I delivers 14,579 logic cells and 186 I/O inside a 17 x 17 mm FT256 package at a 1.2 V core supply, so a complete command-and-control, acquisition and framing function fits on a compact board where a larger FPGA would not. The 667 MHz class -3 timing supports high-rate sampling front ends and serial links to external converters, and the mature, widely stocked Spartan-6 LX family reduces obsolescence risk on long-lifecycle programmes compared with cutting-edge devices. Key design cautions are that the FT256 is a 1.0 mm-pitch BGA requiring fine-pitch assembly and that a 256-ball grid limits via escape around the perimeter. Keep the FPGA core supply on a dedicated filtered plane and verify the Spartan-6 package pinout file for the FT256 before committing the footprint.
推荐
推荐产品汇总
工程参考数据： XC6SLX16-3FT256I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX16-3FTG256I | XC6SLX16-3FTG256C | XC6SLX16-3FT256C | XC6SLX16-2FTG256I |
|---|---|---|---|---|---|
| Package | 256-LBGA / FTBGA-256 (FT256) | 256-LBGA / FTBGA-256 (FT256) - identical | 256-LBGA / FTBGA-256 (FT256) - identical | 256-LBGA / FTBGA-256 (FT256) - identical | 256-LBGA / FTBGA-256 (FT256) - identical |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Logic Cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells | 14,579 cells |
| Configurable Logic Blocks | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs | 1,139 CLBs |
| User I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O |
| Speed Grade | -3 (highest Spartan-6 LX grade) | -3 - identical | -3 - identical | -3 - identical | -2 - slower by roughly 15% |
| Temperature Grade | Industrial (I suffix) | Industrial (I suffix) | Commercial (C suffix) | Commercial (C suffix) | Industrial (I suffix) |
| Process Technology / Core Supply | 45 nm CMOS, 1.2 V core | 45 nm CMOS, 1.2 V core | 45 nm CMOS, 1.2 V core | 45 nm CMOS, 1.2 V core | 45 nm CMOS, 1.2 V core |
关键差异点
- Same-package green/lead-free ordering code available without any design change （对比 XC6SLX16-3FTG256I)
- Highest Spartan-6 LX timing margin in the family （对比 XC6SLX16-2FTG256I)
- Industrial temperature marking on the same 256-ball BGA （对比 XC6SLX16-3FT256C)
- High I/O density for a 17 x 17 mm footprint, enabling BOM consolidation （对比 Lattice ECP5 devices in similar logic classes)
设计说明
The FT256 is a 1.0 mm-pitch, 17 x 17 mm ball grid array, so escape routing is the primary layout constraint. Place the FPGA centred on the board with short point-to-point escape paths to the power, configuration and high-speed I/O pins, and consider a 6-8 layer stack with a solid ground plane referenced under the device. Provide a dense via array (typically a grid of stitching vias, plus thermal vias directly beneath the BGA) connecting the pad array to the 1.2 V core plane and to the ground plane. Review the AMD Spartan-6 FT256 package pinout file for ball assignments before finalising layer changes; do not rely on generic BGA conventions.
Estimated core dissipation equals core current times the 1.2 V supply; for example, 300 mA average core current gives about 0.36 W of core power, before I/O and auxiliary rail dissipation. Estimated I/O power scales with toggle rate, load capacitance and VCCO voltage, so heavily switched LVDS or CMOS banks can dominate thermal design even though the core looks modest. Sequence the 1.2 V core rail ahead of or with the VCCO rails according to the device's supply sequencing requirements, and use local bulk plus high-frequency decoupling at every supply ball group. Verify final numbers with the AMD power estimator and the package thermal model for your specific board stack-up.
Keep the JTAG and configuration pins (M0-M2, DONE, INIT_B, PROGRAM_B, CFGCLK) on a dedicated header footprint with a ground-referenced return, and route them away from switching nodes and motor-drive return currents. Place the configuration memory or cable connector on the board edge nearest the JTAG header to minimise stub length on sensitive config nets. If the design uses any high-speed serial or parallel memory interface, assign it to a dedicated I/O bank with its own VCCO and place series termination resistors at the driver end. Avoid placing crystal or clock oscillators under the BGA, where mechanical stress and thermal gradients can shift frequency stability.
The most common migration errors are ordering a different temperature grade suffix or a different package code and assuming the footprint is unchanged. The FT (FT256) and FTG (FT256 green) order codes share the same land pattern, while -3 versus -2 and I versus C affect timing margin and temperature rating, respectively. Confirm the exact ordering code against your mechanical drawing and temperature requirement before releasing to production, and re-run static timing analysis after any speed-grade substitution. In a supply-constrained situation, always verify the source's traceability and date code, since the Spartan-6 LX family is a mature line with active secondary-market inventory.
合规信息
Lead-free FT256 package construction is stated in distributor specification data, and the FTG package ordering codes are lead-free/green variants of the same device. RoHS compliance is indicated by the lead-free package option. AEC-Q100 qualification, REACH status, halogen-free status and conflict-minerals declarations were not present in the verified data and are reported as unknown or not applicable.
