10AX090S4F45E3LG - Arria 10 GX FPGA 900K LE, 1932-FCBGA | Altera
料号： 10AX090S4F45E3LG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5879.79 | $5,879.79 |
| 10 | $5585.8 | $55,858.00 |
| 100 | $5111.42 | $511,142.00 |
| 250 | $4762.59 | $1,190,647.50 |
| 500 | $4582.63 | $2,291,315.00 |
10AX090S4F45E3LG 概述
What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as transceivers, DSP slices, and block RAM. FPGAs sit within the broader category of programmable logic devices (PLDs) and bridge the gap between general-purpose processors and application-specific integrated circuits (ASICs). The Arria 10 family targets mid-range, transceiver-rich applications requiring a balance of logic density, DSP performance, and power efficiency.
Key features of the 10AX090 include up to 900,000 logic elements, 59,234,304 bits of embedded memory (approximately 7.4 Mbytes), up to 28.05 Gbps serial transceivers supporting protocols such as PCIe Gen3, 10GbE, and Interlaken, and dedicated variable-precision DSP blocks. The -3 speed grade (E3) denotes an enhanced timing closure device, and the LG suffix marks an industrial lead-free package without a heat spreader.
Architecturally, Arria 10 GX is built on a 20 nm process combining a hardened ARM-less core fabric with hardened PCIe Gen3 and memory controller IP. This heterogeneous integration enables significantly lower power consumption than competing FPGAs at similar logic densities, while the transceiver tiles allow line-rate operation for high-speed serial links.
Typical applications include high-speed data acquisition systems, 100G/400G network infrastructure, 4K/8K video broadcast equipment, military radar and electronic warfare signal processing, ASIC prototyping, and high-performance compute acceleration. The combination of high logic density and high-speed transceivers makes it well suited to multi-protocol bridging and DSP-intensive workloads.
When designing with this device, allocate at least one month for Quartus Prime compilation at full utilization, and ensure PCB layout supports the 1 mm-pitch FCBGA with matched-length serial links and proper power-rail decoupling per the Arria 10 pin connection guidelines.
This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 family, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： 10AX090S4F45E3LG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AX090S4F45E3LG （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Logic Elements, Process Technology, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
10AX090S4F45E2LG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10AX090S4F45I3LG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$6050 / 个
查看数据手册 →10AX090S3F45E3LG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10AX090S4F45E3SG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
10AX090S2F45E2LG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3750 / 个
查看数据手册 →10AX090S4F45E3LG 最大额定值与电气特性
| Series | Arria 10 GX |
| Family | Arria 10 GX (10AX090) |
| Logic Elements (LE) | 900,000 |
| Embedded Memory | 59,234,304 bits (~7.4 Mbytes) |
| Maximum User I/O Pins | 624 |
| 封装 | 1932-ball FCBGA (F45, 45 mm) |
| Ball Pitch | 1.0 mm |
| Transceivers | Up to 28.05 Gbps backplane-capable |
| Speed Grade | -3 (enhanced, E3) |
| Temperature Grade | Industrial (LG suffix) |
| Lead-Free / Halogen-Free | Yes (LG suffix indicates lead-free, no heat spreader) |
| Process Node | 20 nm TSMC |
| Configuration | FPGA - Field Programmable Gate Array |
| RoHS 状态 | Compliant |
10AX090S4F45E3LG 1932-ball fcbga (f45, 45 mm) 引脚配置指南
10AX090S4F45E3LG（1932-ball fcbga (f45, 45 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AX090S4F45E3LG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AX090S4F45E3LG 适用于 7 应用s: 100G/400G Network Infrastructure, 4K/8K Video Broadcast Equipment, ASIC Prototyping, Military Radar and Electronic Warfare, Test and Measurement Instrumentation, Industrial High-Performance Computing Acceleration, 5G Wireless Baseband Processing.
100G/400G Network Infrastructure
The 10AX090S4F45E3LG fits 100G/400G line-card designs because its 28.05 Gbps backplane-capable transceivers implement CAUI-4 / CAUI-10 lanes directly, while 900,000 logic elements absorb the MAC, PCS, and packet-processing pipeline. Designers place the FPGA between the QSFP28/QSFP-DD cage and the switch ASIC, mapping 4x or 10x 25-28 Gbps serial links to the MGT tiles. The -3 enhanced speed grade closes timing on 312.5 MHz internal datapaths typical of OTN framer / deframer blocks. Compared with a CPU-based architecture, this single-chip design eliminates external NPU silicon and reduces BOM cost by 30-50%.
推荐
4K/8K Video Broadcast Equipment
The 10AX090S4F45E3LG suits 4K/8K broadcast contribution and studio equipment where 12G-SDI, DisplayPort 1.4, and HDMI 2.0b interfaces must be aggregated alongside video processing DSP. Its 900,000 logic elements handle multi-stream up/down/cross conversion, color-space transform, and HDR tone-mapping in real time. The transceiver tiles support 12G-SDI over coax at distances up to 100 m with proper cable equalization. Compared with ASIC implementations, the FPGA allows rapid codec standard updates (HEVC, AV1) without respin.
推荐
ASIC Prototyping
The 10AX090S4F45E3LG is a high-utilization ASIC prototyping platform because 900,000 logic elements map to roughly 20-25 million ASIC gates depending on LUT utilization. Its large embedded memory (59 Mbits) absorbs scan-stitch buffers and transaction recorders for high-speed validation runs. The -3 speed grade provides timing margin to emulate ASIC clock trees operating above 500 MHz. Compared with software simulation, FPGA prototyping delivers 100-1000x faster runtime, cutting weeks of regression cycles down to days.
推荐
Military Radar and Electronic Warfare
The 10AX090S4F45E3LG suits radar and EW signal-processing subsystems that require both high DSP throughput and high-speed digitizer interfaces. Its variable-precision DSP blocks deliver up to ~1.5 TMACS per device, and the 28.05 Gbps transceivers accept direct ADC/DAC JESD204B/C links at lane rates up to 12.5 Gbps. The LG industrial temperature grade supports -40 C to +100 C operation typical of fielded military systems. Compared with discrete DSP+FPGA architectures, the integrated solution reduces SWaP-C by ~40%.
推荐
Test and Measurement Instrumentation
The 10AX090S4F45E3LG drives high-end oscilloscope and protocol-analyzer platforms because its wide transceiver bandwidth captures USB 3.1 Gen2, PCIe Gen3, and 100GbE signals simultaneously. Its block RAM enables deep acquisition memory (gigasample buffers) and its DSP blocks implement real-time eye-diagram, jitter, and BERT analysis. The -3 enhanced speed grade closes timing on multi-protocol decoders running at 250 MHz user logic. Compared with multi-FPGA systems, single-chip integration simplifies calibration and reduces instrument cost.
推荐
Industrial High-Performance Computing Acceleration
The 10AX090S4F45E3LG serves as a compute accelerator for industrial edge servers and HPC workloads where OpenCL and RTL kernels benefit from massive parallelism. Its 900,000 logic elements, combined with thousands of DSP slices and 28.05 Gbps PCIe Gen3 x8 hard IP, deliver real-time inference and signal-processing throughput. The LG industrial temperature grade supports harsh factory and outdoor enclosures. Compared with GPU accelerators, FPGA implementation offers deterministic latency and lower power per operation in latency-critical control loops.
推荐
5G Wireless Baseband Processing
The 10AX090S4F45E3LG handles 5G NR baseband functions including LDPC/Polar coding, FFT/iFFT, and massive-MIMO beamforming weights with deterministic latency. Its DSP blocks run the physical-layer chains at the LTE/NR subcarrier rates, while the 624 user I/O pins interface to RF front-end ADCs/DACs over JESD204B/C. The -3 enhanced speed grade closes timing on 491.52 MHz DSP pipelines required for 100 MHz 5G NR carriers. Compared with DSP+ASIC architectures, the FPGA enables PHY algorithm updates per 3GPP Release schedule without board respin.
推荐
推荐产品汇总
工程参考数据： 10AX090S4F45E3LG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AX090S4F45E2LG | 10AX090S4F45I3LG | 10AX090S3F45E3LG | 10AX090S4F45E3SG | 10AX090S2F45E2LG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1932-ball FCBGA (F45, 45 mm) | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F45, 45 mm) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | -3 enhanced (E3) | -2 (E2) | -3 industrial (I3) | -3 enhanced (E3), S3 transceiver | -3 enhanced (E3), SG heat spreader | -2 (E2), S2 transceiver |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
| Max Transceiver Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 17.4 Gbps (S3 tier) | 28.05 Gbps | 17.4 Gbps (S2 tier) |
| Heat Spreader | No (LG suffix) | No (LG suffix) | No (LG suffix) | No (LG suffix) | Yes (SG suffix) | No (LG suffix) |
| Temperature Grade | Industrial (LG) | Industrial (LG) | Industrial (LG) | Industrial (LG) | Industrial (SG) | Industrial (LG) |
关键差异点
- Fastest -3 enhanced speed grade in a 1932-ball F45 FCBGA without heat spreader （对比 10AX090S4F45E2LG)
- 28.05 Gbps backplane-capable transceiver tier （对比 10AX090S2F45E2LG)
- Industrial temperature grade without heat spreader （对比 10AX090S4F45E3SG)
设计说明
The 1932-ball FCBGA package (F45, 45 mm) has a typical junction-to-ambient thermal resistance in the 8-12 C/W range with adequate PCB thermal via array under the die. At sustained utilization above 70%, expect 15-25 W dissipation; LG parts without an integrated heat spreader require an external heatsink plus 400-600 LFM airflow, while SG variants (e.g., 10AX090S4F45E3SG) tolerate lower airflow. Always consult the Arria 10 thermal management application note for junction-to-case resistance before mechanical design.
The 1.0 mm ball-pitch FCBGA mandates a minimum 12-layer PCB stackup with controlled-impedance routing for all serial links and matched-length transceiver pairs (typically +/- 5 mil skew tolerance). Use a stacked-via (laser-drilled microvia to buried via) escape pattern to fan out the inner rows, and place the decoupling capacitor array on the opposite side directly under each power pin pair. Decoupling must follow the Arria 10 pin connection guidelines with 0.1 uF, 1 uF, and 22 uF capacitors distributed across VCC/VCCPT/VCCA/VCCP power rails.
Estimated: Quartus Prime compilation time at full 900,000-LE utilization typically exceeds 8-12 hours on a high-end workstation with full timing-driven synthesis; plan for at least 2x this time when targeting -3 enhanced speed grade with timing-driven place-and-route. I/O assignments left as 'LVCMOS 1.8V default' on unconfigured pins draw leakage current and can prevent clean JTAG configuration - explicitly set unused pins as 'tri-stated input with weak pull-up' in the Quartus device configuration. Finally, do not confuse the F45 (45 mm) and F40 (40 mm) packages: they have different ball maps and are NOT drop-in compatible despite similar logic capacity.
合规信息
LG suffix indicates lead-free package per Altera/Intel ordering code guide. RoHS and REACH compliant per product page. Not AEC-Q100 qualified (FPGA, not an automotive discrete IC).
