10AX090S4F45I3LG - Arria 10 GX FPGA 900K LE | Intel
MPN: 10AX090S4F45I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7072.86 | $7,072.86 |
| 10 | $6800 | $68,000.00 |
| 50 | $6550 | $327,500.00 |
| 100 | $6300 | $630,000.00 |
| 500 | $6050 | $3,025,000.00 |
Drop-in alternatives for 10AX090S4F45I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AX090S4F45E3LG
✅ Drop-In✓ In Stock
$4582.63 / Unit
View Datasheet →10AX090N4F45I3LG
✅ Drop-In✓ In Stock
$5202.97 / Unit
View Datasheet →10AX090S3F45I2SG
✅ Drop-In✓ In Stock
$4563.74 / Unit
View Datasheet →10AX090N3F45I2LG
✅ Drop-In✓ In Stock
$2995 / Unit
View Datasheet →10AX090S4F45I3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 (approx. 59 Mbit) |
| User I/Os | 624 |
| Package | 1932-ball FCBGA (45 x 45 mm) |
| Process Technology | 20 nm |
| Transceivers | Up to 24 channels |
| Transceiver Data Rate | Up to 17.4 Gbps per channel |
| Hard Memory Controller | Yes (DDR3/DDR4, LPDDR2, QDR IV) |
| PCIe Hard IP | PCIe Gen3 x8 (hard IP block) |
| Operating Temperature | -40C to +100C (Industrial) |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
| Speed Grade | -3 (faster speed grade) |
10AX090S4F45I3LG 1932-ball fcbga (45 x 45 mm) Pin Configuration Guide
Complete pinout information for 10AX090S4F45I3LG (1932-ball fcbga (45 x 45 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090S4F45I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090S4F45I3LG is suitable for 6 applications: 4K/8K Broadcast Video Processing, Wireless Baseband / 5G Fronthaul, High-Performance ASIC Prototyping, Medical Imaging Systems, Military Radar and Electronic Warfare, Test and Measurement Instrumentation.
4K/8K Broadcast Video Processing
The 10AX090S4F45I3LG's 900K logic elements and 59 Mbit embedded memory provide the parallel processing fabric required for real-time 4K and 8K video pipelines, including color space conversion, scaling, deinterlacing, and HDR tone mapping. The 24 transceivers at 17.4 Gbps handle 12G-SDI and quad-link 3G-SDI ingest/egress simultaneously, while hardened PCIe Gen3 x8 IP enables direct attachment to host capture/display cards. Compared to GPU-based processing, the FPGA determinism and sub-frame latency make it preferred for live broadcast workflows where consistent timing is critical.
Recommended
Wireless Baseband / 5G Fronthaul
The 10AX090S4F45I3LG delivers the compute density and transceiver throughput needed for LTE Advanced and 5G NR baseband processing, with hardened floating-point DSP blocks supporting FFT/iFFT, channel estimation, and MIMO detection at line rate. The 17.4 Gbps transceivers interface directly with CPRI and OBSAI fronthaul links to remote radio heads (RRH), eliminating external PHY chips. Industrial temperature rating (-40C to +100C) supports outdoor base-station deployments, while the 1932-ball FCBGA enables dense PCB layouts within compact radio units.
Recommended
High-Performance ASIC Prototyping
With 900K logic elements, abundant M20K memory blocks, and abundant variable-precision DSP, the 10AX090S4F45I3LG provides sufficient capacity to prototype mid-range ASICs and SoCs before committing to mask costs. Multiple FPGAs can be ganged together via the 17.4 Gbps transceivers using chip-to-chip serial links, emulating multi-million-gate ASICs at near-real-time speeds. The industrial temperature grade also enables prototype validation in environmental stress screening. Quartus Prime supports ASIC prototyping flows with time-domain multiplexing and pin multiplexing for bring-up.
Recommended
Medical Imaging Systems
The 10AX090S4F45I3LG serves as the compute engine in CT, MRI, ultrasound, and digital X-ray imaging systems, where its parallel processing fabric accelerates image reconstruction (filtered back-projection, iterative reconstruction) and real-time image enhancement pipelines. Hardened PCIe Gen3 simplifies integration with host PCs for image archival and PACS connectivity. The industrial temperature rating supports imaging carts and operating-room deployments, while the 624 user I/Os interface directly with high-speed analog front ends and camera link sensors.
Recommended
Military Radar and Electronic Warfare
The 10AX090S4F45I3LG supports defense applications including phased-array radar beamforming, electronic countermeasures (ECM), and signal-intelligence (SIGINT) processing. Its 24 transceivers at 17.4 Gbps aggregate multi-GHz instantaneous bandwidth from multiple ADC channels, while the hardened floating-point DSP blocks perform pulse compression, MTI filtering, and Doppler processing in real time. Industrial temperature rating and the rugged 1932-ball FCBGA package suit airborne and ground-mobile platforms.
Recommended
Test and Measurement Instrumentation
The 10AX090S4F45I3LG forms the heart of high-end oscilloscopes, logic analyzers, protocol analyzers, and bit-error-rate testers, where its abundant logic and transceiver channels enable real-time capture and analysis of multi-gigabit signals. Hardened PCIe Gen3 x8 streams captured data directly to host processors for display and storage. The 624 user I/Os support direct probing of high-pin-count devices, while the industrial temperature rating supports lab and field-deployed test equipment. Quartus Prime IP library includes protocol analyzers for PCIe, USB, SATA, and Ethernet.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090S4F45I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090S4F45E3LG | 10AX090N4F45I3LG | 10AX090S3F45I2SG | 10AX090N3F45I2LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45, 45x45 mm) | 1932-ball FCBGA (F45, 45x45 mm) - same | 1932-ball FCBGA (F45, 45x45 mm) - same | 1932-ball FCBGA (F45, 45x45 mm) - same | 1932-ball FCBGA (F45, 45x45 mm) - same |
| Logic Elements | 900,000 | 900,000 - same | 900,000 - same | 900,000 - same | 900,000 - same |
| Speed Grade | -3 (fastest) | -3 - same | -3 - same | -2 (slower) | -2 (slower) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) - same | -40C to +100C (Industrial) - same | -40C to +100C (Industrial) - same |
| Transceivers | Up to 24 channels, 17.4 Gbps | Up to 24 channels, 17.4 Gbps - same | Transceiver IP disabled or reduced | Up to 24 channels, ~14 Gbps (slower) | Transceiver IP disabled, ~14 Gbps |
| Family Sub-series | Arria 10 GX (with transceivers) | Arria 10 GX - same | Arria 10 GX (N variant) | Arria 10 GX - same | Arria 10 GX (N variant) |
| Approx Unit Price (qty 1) | $7,072.86 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Same-package F45 1932-ball FCBGA drop-in with commercial temperature rating (vs 10AX090S4F45E3LG)
- Same-package industrial F45 variant with same speed grade (vs 10AX090N4F45I3LG)
- Cost-reduced F45 drop-in with -2 speed grade (vs 10AX090S3F45I2SG)
Design Notes
The 1932-ball FCBGA F45 package requires high-density interconnect (HDI) PCB stack-up with microvias (typically 4-6 sequential laminations) to escape the 1.0 mm ball pitch. Route all high-speed transceiver channels with controlled impedance (100 ohm differential) and matched lengths (within 0.05 mm intra-pair, 0.5 mm inter-pair). Reference the Intel Arria 10 PCB Design Guidelines application note for via-in-pad, decoupling, and stack-up recommendations specific to F45.
Estimated: At full transceiver utilization (24 channels at 17.4 Gbps) plus PCIe Gen3 x8, the 10AX090S4F45I3LG can dissipate 15-25W. The F45 FCBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 8-12 C/W with a properly designed thermal interface material (TIM) and heatsink. Industrial deployments should target junction temperatures below 100C with adequate airflow - refer to the Arria 10 thermal management application note for heatsink selection and TIM guidance.
Do not confuse the 10AX090S (S-series with full transceiver IP) with the 10AX090N (N-series with reduced/no transceiver IP licensing). Both share the same ballout, but configuring transceivers on an N-series device will fail at Quartus Prime fitter stage. Also verify the speed grade suffix (I3 = industrial -3, E3 = commercial -3, I2 = industrial -2) matches your timing closure targets - dropping from -3 to -2 typically reduces Fmax by 15-20%.
Place 0.1 uF X7R ceramic decoupling capacitors within 100 mils of every power pin, with bulk decoupling (10-22 uF tantalum or polymer) at each power rail entry. Use a power plane cutout under the BGA to minimize inductance, and stitch the GND plane around high-speed signals with via fencing every 2-3 mm. Reference the Intel Arria 10 Signal Integrity Design Guidelines for eye-mask compliance at 17.4 Gbps.
Compliance Information
RoHS compliance confirmed per Amphero listing. AEC-Q100 not applicable for FPGA in commercial/industrial use. Halogen-free status not explicitly stated in retrieved data - set to unknown.
