10AX090S4F45E3LG - Arria 10 GX FPGA 900K LE, 1932-FCBGA | Altera
부품 번호: 10AX090S4F45E3LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5879.79 | $5,879.79 |
| 10 | $5585.8 | $55,858.00 |
| 100 | $5111.42 | $511,142.00 |
| 250 | $4762.59 | $1,190,647.50 |
| 500 | $4582.63 | $2,291,315.00 |
10AX090S4F45E3LG 개요
What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as transceivers, DSP slices, and block RAM. FPGAs sit within the broader category of programmable logic devices (PLDs) and bridge the gap between general-purpose processors and application-specific integrated circuits (ASICs). The Arria 10 family targets mid-range, transceiver-rich applications requiring a balance of logic density, DSP performance, and power efficiency.
Key features of the 10AX090 include up to 900,000 logic elements, 59,234,304 bits of embedded memory (approximately 7.4 Mbytes), up to 28.05 Gbps serial transceivers supporting protocols such as PCIe Gen3, 10GbE, and Interlaken, and dedicated variable-precision DSP blocks. The -3 speed grade (E3) denotes an enhanced timing closure device, and the LG suffix marks an industrial lead-free package without a heat spreader.
Architecturally, Arria 10 GX is built on a 20 nm process combining a hardened ARM-less core fabric with hardened PCIe Gen3 and memory controller IP. This heterogeneous integration enables significantly lower power consumption than competing FPGAs at similar logic densities, while the transceiver tiles allow line-rate operation for high-speed serial links.
Typical applications include high-speed data acquisition systems, 100G/400G network infrastructure, 4K/8K video broadcast equipment, military radar and electronic warfare signal processing, ASIC prototyping, and high-performance compute acceleration. The combination of high logic density and high-speed transceivers makes it well suited to multi-protocol bridging and DSP-intensive workloads.
When designing with this device, allocate at least one month for Quartus Prime compilation at full utilization, and ensure PCB layout supports the 1 mm-pitch FCBGA with matched-length serial links and proper power-rail decoupling per the Arria 10 pin connection guidelines.
This page synthesizes distributor pricing, drop-in alternatives within the Arria 10 family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: 10AX090S4F45E3LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX090S4F45E3LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Logic Elements, Process Technology, Embedded Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX090S4F45E2LG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX090S4F45I3LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6050 / 개
데이터시트 보기 →10AX090S3F45E3LG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX090S4F45E3SG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10AX090S2F45E2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3750 / 개
데이터시트 보기 →10AX090S4F45E3LG 최대 정격 & 전기적 특성
| Series | Arria 10 GX |
| Family | Arria 10 GX (10AX090) |
| Logic Elements (LE) | 900,000 |
| Embedded Memory | 59,234,304 bits (~7.4 Mbytes) |
| Maximum User I/O Pins | 624 |
| 패키지 | 1932-ball FCBGA (F45, 45 mm) |
| Ball Pitch | 1.0 mm |
| Transceivers | Up to 28.05 Gbps backplane-capable |
| Speed Grade | -3 (enhanced, E3) |
| Temperature Grade | Industrial (LG suffix) |
| Lead-Free / Halogen-Free | Yes (LG suffix indicates lead-free, no heat spreader) |
| Process Node | 20 nm TSMC |
| Configuration | FPGA - Field Programmable Gate Array |
| RoHS 상태 | Compliant |
10AX090S4F45E3LG 1932-ball fcbga (f45, 45 mm) 핀 구성 가이드
10AX090S4F45E3LG(1932-ball fcbga (f45, 45 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX090S4F45E3LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX090S4F45E3LG 적합 용도: 7 애플리케이션s: 100G/400G Network Infrastructure, 4K/8K Video Broadcast Equipment, ASIC Prototyping, Military Radar and Electronic Warfare, Test and Measurement Instrumentation, Industrial High-Performance Computing Acceleration, 5G Wireless Baseband Processing.
100G/400G Network Infrastructure
The 10AX090S4F45E3LG fits 100G/400G line-card designs because its 28.05 Gbps backplane-capable transceivers implement CAUI-4 / CAUI-10 lanes directly, while 900,000 logic elements absorb the MAC, PCS, and packet-processing pipeline. Designers place the FPGA between the QSFP28/QSFP-DD cage and the switch ASIC, mapping 4x or 10x 25-28 Gbps serial links to the MGT tiles. The -3 enhanced speed grade closes timing on 312.5 MHz internal datapaths typical of OTN framer / deframer blocks. Compared with a CPU-based architecture, this single-chip design eliminates external NPU silicon and reduces BOM cost by 30-50%.
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4K/8K Video Broadcast Equipment
The 10AX090S4F45E3LG suits 4K/8K broadcast contribution and studio equipment where 12G-SDI, DisplayPort 1.4, and HDMI 2.0b interfaces must be aggregated alongside video processing DSP. Its 900,000 logic elements handle multi-stream up/down/cross conversion, color-space transform, and HDR tone-mapping in real time. The transceiver tiles support 12G-SDI over coax at distances up to 100 m with proper cable equalization. Compared with ASIC implementations, the FPGA allows rapid codec standard updates (HEVC, AV1) without respin.
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ASIC Prototyping
The 10AX090S4F45E3LG is a high-utilization ASIC prototyping platform because 900,000 logic elements map to roughly 20-25 million ASIC gates depending on LUT utilization. Its large embedded memory (59 Mbits) absorbs scan-stitch buffers and transaction recorders for high-speed validation runs. The -3 speed grade provides timing margin to emulate ASIC clock trees operating above 500 MHz. Compared with software simulation, FPGA prototyping delivers 100-1000x faster runtime, cutting weeks of regression cycles down to days.
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Military Radar and Electronic Warfare
The 10AX090S4F45E3LG suits radar and EW signal-processing subsystems that require both high DSP throughput and high-speed digitizer interfaces. Its variable-precision DSP blocks deliver up to ~1.5 TMACS per device, and the 28.05 Gbps transceivers accept direct ADC/DAC JESD204B/C links at lane rates up to 12.5 Gbps. The LG industrial temperature grade supports -40 C to +100 C operation typical of fielded military systems. Compared with discrete DSP+FPGA architectures, the integrated solution reduces SWaP-C by ~40%.
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Test and Measurement Instrumentation
The 10AX090S4F45E3LG drives high-end oscilloscope and protocol-analyzer platforms because its wide transceiver bandwidth captures USB 3.1 Gen2, PCIe Gen3, and 100GbE signals simultaneously. Its block RAM enables deep acquisition memory (gigasample buffers) and its DSP blocks implement real-time eye-diagram, jitter, and BERT analysis. The -3 enhanced speed grade closes timing on multi-protocol decoders running at 250 MHz user logic. Compared with multi-FPGA systems, single-chip integration simplifies calibration and reduces instrument cost.
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Industrial High-Performance Computing Acceleration
The 10AX090S4F45E3LG serves as a compute accelerator for industrial edge servers and HPC workloads where OpenCL and RTL kernels benefit from massive parallelism. Its 900,000 logic elements, combined with thousands of DSP slices and 28.05 Gbps PCIe Gen3 x8 hard IP, deliver real-time inference and signal-processing throughput. The LG industrial temperature grade supports harsh factory and outdoor enclosures. Compared with GPU accelerators, FPGA implementation offers deterministic latency and lower power per operation in latency-critical control loops.
추천
5G Wireless Baseband Processing
The 10AX090S4F45E3LG handles 5G NR baseband functions including LDPC/Polar coding, FFT/iFFT, and massive-MIMO beamforming weights with deterministic latency. Its DSP blocks run the physical-layer chains at the LTE/NR subcarrier rates, while the 624 user I/O pins interface to RF front-end ADCs/DACs over JESD204B/C. The -3 enhanced speed grade closes timing on 491.52 MHz DSP pipelines required for 100 MHz 5G NR carriers. Compared with DSP+ASIC architectures, the FPGA enables PHY algorithm updates per 3GPP Release schedule without board respin.
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추천 제품 요약
엔지니어링 참조 데이터: 10AX090S4F45E3LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX090S4F45E2LG | 10AX090S4F45I3LG | 10AX090S3F45E3LG | 10AX090S4F45E3SG | 10AX090S2F45E2LG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1932-ball FCBGA (F45, 45 mm) | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F45, 45 mm) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | -3 enhanced (E3) | -2 (E2) | -3 industrial (I3) | -3 enhanced (E3), S3 transceiver | -3 enhanced (E3), SG heat spreader | -2 (E2), S2 transceiver |
| Embedded Memory | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits | 59,234,304 bits |
| Max Transceiver Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 17.4 Gbps (S3 tier) | 28.05 Gbps | 17.4 Gbps (S2 tier) |
| Heat Spreader | No (LG suffix) | No (LG suffix) | No (LG suffix) | No (LG suffix) | Yes (SG suffix) | No (LG suffix) |
| Temperature Grade | Industrial (LG) | Industrial (LG) | Industrial (LG) | Industrial (LG) | Industrial (SG) | Industrial (LG) |
주요 차별점
- Fastest -3 enhanced speed grade in a 1932-ball F45 FCBGA without heat spreader (vs 10AX090S4F45E2LG)
- 28.05 Gbps backplane-capable transceiver tier (vs 10AX090S2F45E2LG)
- Industrial temperature grade without heat spreader (vs 10AX090S4F45E3SG)
설계 노트
The 1932-ball FCBGA package (F45, 45 mm) has a typical junction-to-ambient thermal resistance in the 8-12 C/W range with adequate PCB thermal via array under the die. At sustained utilization above 70%, expect 15-25 W dissipation; LG parts without an integrated heat spreader require an external heatsink plus 400-600 LFM airflow, while SG variants (e.g., 10AX090S4F45E3SG) tolerate lower airflow. Always consult the Arria 10 thermal management application note for junction-to-case resistance before mechanical design.
The 1.0 mm ball-pitch FCBGA mandates a minimum 12-layer PCB stackup with controlled-impedance routing for all serial links and matched-length transceiver pairs (typically +/- 5 mil skew tolerance). Use a stacked-via (laser-drilled microvia to buried via) escape pattern to fan out the inner rows, and place the decoupling capacitor array on the opposite side directly under each power pin pair. Decoupling must follow the Arria 10 pin connection guidelines with 0.1 uF, 1 uF, and 22 uF capacitors distributed across VCC/VCCPT/VCCA/VCCP power rails.
Estimated: Quartus Prime compilation time at full 900,000-LE utilization typically exceeds 8-12 hours on a high-end workstation with full timing-driven synthesis; plan for at least 2x this time when targeting -3 enhanced speed grade with timing-driven place-and-route. I/O assignments left as 'LVCMOS 1.8V default' on unconfigured pins draw leakage current and can prevent clean JTAG configuration - explicitly set unused pins as 'tri-stated input with weak pull-up' in the Quartus device configuration. Finally, do not confuse the F45 (45 mm) and F40 (40 mm) packages: they have different ball maps and are NOT drop-in compatible despite similar logic capacity.
규정 준수 정보
LG suffix indicates lead-free package per Altera/Intel ordering code guide. RoHS and REACH compliant per product page. Not AEC-Q100 qualified (FPGA, not an automotive discrete IC).
