10AX090S2F45E2LG - Arria 10 GX FPGA, 900K LE, 1932-FCBGA | Intel
MPN: 10AX090S2F45E2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4650 | $46,500.00 |
| 100 | $4290 | $429,000.00 |
| 500 | $3990 | $1,995,000.00 |
| 1,000 | $3750 | $3,750,000.00 |
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View Datasheet →10AX090S2F45E2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| DSP Blocks | Variable-precision, 24-bit multiplier base |
| Adaptive Logic Modules (ALMs) | 338,200 |
| Transceiver Channels | Up to 24 (data rate per channel up to 14.1 Gbps) |
| Hard Memory Controllers | 4, supports DDR4 / DDR3 / RLDRAM3 / QDR IV |
| PCIe Hard IP | PCI Express Gen3 x8 / Gen2 x8 |
| Process Technology | 20 nm Tri-Gate (FinFET) |
| Speed Grade | E2 (commercial/extended) |
| Package | 1932-ball FCBGA, 45 mm body (F45) |
| Operating Temperature Grade | Industrial (per -LG suffix convention; verify against order code) |
| Core Voltage (Vcc) | 0.9 V (nominal; per family datasheet) |
| RoHS / Lead-Free | Yes (LG suffix indicates Pb-free) |
| Configuration Interface | Active serial (EPCQ-L), JTAG, Fast Passive Parallel |
10AX090S2F45E2LG 1932-ball fcbga, 45 mm body (f45) Pin Configuration Guide
Complete pinout information for 10AX090S2F45E2LG (1932-ball fcbga, 45 mm body (f45) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090S2F45E2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090S2F45E2LG is suitable for 6 applications: 100G/40G Ethernet Line Card Aggregation, Software-Defined Radio (SDR) Front-End, FPGA-Based ASIC Prototyping, Medical Imaging Accelerator, High-Frame-Rate Broadcast Video Processing, Radar / Beamforming Signal Processing.
100G/40G Ethernet Line Card Aggregation
The 10AX090S2F45E2LG is well suited for 100G/40G Ethernet line cards in carrier-grade switches and routers. With 24 transceiver channels at 14.1 Gbps, the device can implement CAUI-10 (10 lanes at 10.3125 Gbps), 100GBASE-R4, or OTU4 framing. The hardened PCIe Gen3 x8 controller provides backplane interconnect to a network processor, while four DDR4 controllers feed deep packet buffers. The 1932-ball FCBGA F45 package supports the high pin-count routing required for 10+ serial links plus parallel TCAM and QDR interfaces in a single device, replacing multiple FPGAs in 40G-class designs.
Recommended
Software-Defined Radio (SDR) Front-End
The 10AX090S2F45E2LG enables wideband SDR front-ends through 24 transceivers sampling at up to 14.1 Gbps, supporting multi-band digital down-conversion chains for LTE, 5G NR, and tactical radio waveforms. The variable-precision DSP blocks (24-bit base) execute FFT, channelization, and beamforming pipelines in fixed-point, with 338,200 ALMs handling control and MAC layers. Hard PCIe Gen3 enables streaming baseband data to a host CPU at >7 GB/s, while DDR4 controllers feed decimation buffers. The E2 speed grade provides timing closure for 491.52 MHz DSP clocks common in LTE sample rates.
Recommended
FPGA-Based ASIC Prototyping
The 10AX090S2F45E2LG serves as a high-density prototyping vehicle for mid-complexity ASIC designs targeting 100-200M gates. With 900,000 logic elements, 59 Mbits of embedded memory, and 24 transceivers, the device can host multi-clock domain ASIC blocks plus SerDes bridges to ASSP test chips. Quartus Prime TimeQuest supports ASIC netlist back-annotation, and the F45 1932-ball FCBGA exposes sufficient GPIO for chip-to-chip break-out. Engineers stack multiple Arria 10 devices via LVDS or HSMC bridges for designs exceeding one device's capacity.
Recommended
Medical Imaging Accelerator
The 10AX090S2F45E2LG accelerates CT, MRI, and ultrasound reconstruction pipelines through parallel DSP blocks implementing filtered back-projection, Fourier transforms, and image registration. Hardened DDR4 controllers sustain the 4-8 GB/s memory bandwidth required for 1024x1024x256 volume rendering at real-time rates. The 24 transceivers enable raw RF data ingestion from ultrasound front-end ADCs at 12 Gbps lane rates. E2 speed grade meets timing for 200-300 MHz DSP clock domains typical in medical imaging accelerator blocks.
Recommended
High-Frame-Rate Broadcast Video Processing
The 10AX090S2F45E2LG processes 4K/8K broadcast video at 60-120 Hz through the 24 transceivers implementing SDI (SMPTE 2022/2082), HDMI 2.1, and 12G-SDI ingest. Variable-precision DSP blocks execute real-time color-space conversion, scaling, and frame-rate conversion pipelines. DDR4 controllers feed multi-frame buffers; PCIe Gen3 connects to host CPU for file playback. Industrial temperature variants are required for outdoor broadcast and OB-van deployments where ambient temperatures exceed commercial ranges.
Recommended
Radar / Beamforming Signal Processing
The 10AX090S2F45E2LG performs phased-array radar baseband processing, implementing FFT, pulse compression, Doppler filtering, and adaptive beamforming for AESA radar front-ends. The 24 transceivers at 14.1 Gbps accept digitized sub-array data from multi-channel ADC ASICs; variable-precision DSP blocks compute complex-matrix beamforming weights at sample rates up to 491.52 MHz. Four DDR4 controllers maintain sliding-window data archives for SAR processing. Hardened PCIe Gen3 x8 streams detected tracks to the radar controller at sustained rates above 6 GB/s.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090S2F45E2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090S2F45E1SG | 10AX090S1F45E1SG | 10AX090S1F45I1SG | 10AX090R2F40E2SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45, 45 mm) | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F45, 45 mm) - same | 1932-ball FCBGA (F40, 40 mm) - body variant |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | E2 (S2) | E1 (S1) | E1 (S1) | E1 (I1) | E2 (R2) |
| Temperature Grade | Extended (LG suffix indicates lead-free, verify temp against order code) | Extended (SG) | Extended (SG) | Industrial (I grade) | Extended (SG) |
| Transceiver Rate (max) | 14.1 Gbps | 14.1 Gbps | 12.5 Gbps | 12.5 Gbps | 14.1 Gbps |
| Hardened PCIe Gen3 | Yes (x8) | Yes (x8) | Yes (x8) | Yes (x8) | Yes (x8) |
| Approx. 1k-piece price | $3,750 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher transceiver speed grade vs E1 variant (vs 10AX090S2F45E1SG)
- Lead-free LG ordering code for global compliance (vs 10AX090S2F45E2SG (non-LG))
- F45 45 mm package provides the largest thermal envelope in the family (vs 10AX090R3F40E2SG (F40 40 mm))
Design Notes
The 1932-ball F45 FCBGA package of the 10AX090S2F45E2LG dissipates 15-25 W typical and up to 35 W worst-case in full-transceiver DSP operation. Estimated: at 20 W ambient 55 C with theta_JA of 0.5 C/W (forced air 200 LFM), junction rises ~10 C. Design requires a heatsink with thermal interface material and 6-9 thermal via array per package thermal pad, connected to internal copper planes in a 16-layer stack-up.
For 14.1 Gbps transceiver channels, use an 8-10 layer stack-up with Megtron-6 or equivalent low-loss dielectric. Reference Intel's AN-528 PCB design guidelines for Arria 10 transceivers: stripline or microstrip differential pairs, 85-100 ohm differential impedance, AC coupling capacitors within 250 mil of TX pins, and continuous reference planes over the entire channel length.
Estimated: full-load VCC core current for 900K-LE Arria 10 is 8-12 A at 0.9 V; VCCIO bank current up to 2 A depending on toggle rate; transceiver PLL analog supply (VCCA_PLL, VCCH_GXB) requires low-noise LDO, not a switching converter. Decouple every VCC pin with 100 nF X7R plus 4.7 uF bulk; add 22 uF polymer on the PCB-side of the regulator plane per the Intel pin connection guidelines.
Do not assume the E2 speed grade provides timing margin for an E1 design - the silicon is binned differently and power is similar. Verify the F45 FCBGA land pattern against the device-specific .pin file, not the generic F45 package drawing, because Intel variants may differ in NC pin assignments. Confirm that your Quartus Prime version supports the device (Pro Edition 17.0 or later recommended).
Place configuration EPCQ-L flash within 2 inches of the FPGA on dedicated routing with reference plane; route JTAG pins with no stubs and pull-ups on TCK/TMS/TDI. Assign transceiver reference clocks from a low-jitter (<300 fs RMS) external oscillator into dedicated REFCLK pins; do not route clock traces over gaps in reference planes or across split ground regions.
Compliance Information
LG suffix indicates lead-free finish per Intel ordering code conventions; RoHS and REACH compliance confirmed per Intel PSG product declarations. AEC-Q100 not applicable - this is an industrial/commercial FPGA. Halogen-free status [DATA_NEEDED].