10AX115S4F45I3LG - Arria 10 GX FPGA 1150K LE | Intel
料号： 10AX115S4F45I3LG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11875 | $118,750.00 |
| 100 | $11250 | $1,125,000.00 |
| 500 | $10625 | $5,312,500.00 |
| 1,000 | $10000 | $10,000,000.00 |
10AX115S4F45I3LG 概述
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the programmable logic device family, which sits above CPLDs in complexity and capability. They consist of configurable logic blocks, programmable interconnects, and I/O blocks, allowing designers to implement complex digital systems without the high NRE costs of ASICs. FPGAs are widely used in prototyping, high-performance computing, and applications requiring hardware flexibility.
The 10AX115S4F45I3LG features 1,150,000 logic elements, 68,857,856 RAM bits, and 624 user I/O pins. It supports a wide range of I/O standards including LVCMOS, LVDS, and high-speed transceivers. The device includes 96 transceivers capable of up to 17.4 Gbps, making it suitable for high-bandwidth communication systems. The 20nm process technology ensures low power consumption while maintaining high performance.
This FPGA is part of the Arria 10 GX family, which integrates a hard processor system (HPS) with dual-core ARM Cortex-A9, enabling system-on-chip (SoC) designs. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down. It also features advanced security features including AES bitstream encryption and tamper detection.
Typical applications include high-performance computing, data center acceleration, 100G optical transport, radar and electronic warfare systems, and broadcast video processing. The 624 user I/O pins and 96 transceivers provide ample connectivity for complex system integration.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (0.9V core, 1.8V, 2.5V, 3.3V) and a robust power distribution network. Adequate cooling is essential due to the high power dissipation of large FPGAs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the 10AX115S4F45I3LG.
直接替换替代料： 10AX115S4F45I3LG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AX115S4F45I3LG （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Embedded Memory, Transceivers, DSP Blocks.
快速对比工具——选择替代料号进行并排对比：
10AX115S4F45E3LG
✅ 直接替换✓ 有现货
$5850 / 个
查看数据手册 →10AX115S3F45I2LG
✅ 直接替换✓ 有现货
$13200 / 个
查看数据手册 →10AX115S2F45I2LG
✅ 直接替换✓ 有现货
$3895 / 个
查看数据手册 →10AX115S4F45E3SG
✅ 直接替换✓ 有现货
$3210 / 个
查看数据手册 →10AX115S3F45E2LG
✅ 直接替换✓ 有现货
$7950 / 个
查看数据手册 →10AX115S2F45E2LG
✅ 直接替换✓ 有现货
$7100 / 个
查看数据手册 →10AX115S4F45I3LG 最大额定值与电气特性
| Family | Arria 10 GX |
| Logic Elements | 1150000 |
| RAM Bits | 68857856 |
| User I/O | 624 |
| Number of Transceivers | 96 |
| Transceiver Speed | 17.4 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 20 nm |
| 封装 | 1932-BBGA, FCBGA (45 x 45 mm) |
| 工作温度 | -40C to +100C (Industrial) |
| 安装类型 | Surface Mount |
| Number of Terminals | 1932 |
| RoHS 状态 | Compliant |
| Grading | Industrial |
| Terminal Form | BALL |
10AX115S4F45I3LG 1932-bbga, fcbga (45 x 45 mm) 引脚配置指南
10AX115S4F45I3LG（1932-bbga, fcbga (45 x 45 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AX115S4F45I3LG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AX115S4F45I3LG 适用于 6 应用s: High-Performance Computing, Data Center Acceleration, 100G Optical Transport, Radar and Electronic Warfare, Broadcast Video Processing, Aerospace and Defense.
High-Performance Computing
The 10AX115S4F45I3LG is ideal for high-performance computing (HPC) applications such as data center acceleration and scientific computing. With 1,150,000 logic elements and 68,857,856 RAM bits, it can implement complex parallel processing algorithms. The 96 transceivers support high-speed interconnects like 100G Ethernet, enabling efficient data movement between FPGAs and CPUs. The 20nm process provides high logic density while maintaining power efficiency, crucial for large-scale HPC systems where power and cooling are limited. Designers can leverage the Arria 10's hard memory controllers and DSP blocks to accelerate workloads such as AI inference, financial modeling, and genomics. The industrial temperature grade ensures reliable operation in demanding environments.
推荐
Data Center Acceleration
In data centers, the 10AX115S4F45I3LG accelerates workloads such as network processing, storage, and AI. Its 96 transceivers support 100G Ethernet and PCIe Gen3, enabling high-throughput data paths. The FPGA's reconfigurability allows dynamic adaptation to changing algorithms, making it ideal for smart NICs and search acceleration. The 68,857,856 RAM bits provide ample buffering for packet processing. The 20nm process reduces power consumption compared to older nodes, critical for dense server deployments. The industrial temperature grade ensures reliability in data center environments with high ambient temperatures. Designers can use the Arria 10's partial reconfiguration to update acceleration logic without downtime.
推荐
100G Optical Transport
The 10AX115S4F45I3LG is well-suited for 100G optical transport systems, including OTN switches and line cards. Its 96 transceivers support up to 17.4 Gbps, enabling 100G and 400G optical modules. The FPGA can implement forward error correction (FEC), framing, and switching functions. The high logic density (1,150,000 LEs) allows integration of multiple channels, reducing board space. The 20nm process provides low power per Gbps, essential for line cards with strict power budgets. The industrial temperature grade ensures operation in central office environments. Designers can use the Arria 10's hard IP for 100G Ethernet and Interlaken to simplify design and reduce latency.
推荐
Radar and Electronic Warfare
The 10AX115S4F45I3LG is used in radar and electronic warfare systems for signal processing and beamforming. Its 1,150,000 logic elements and DSP blocks can implement complex FFTs and digital filters. The 96 transceivers support high-speed ADC/DAC interfaces. The industrial temperature grade (-40C to +100C) is critical for military and aerospace environments. The FPGA's reconfigurability allows adaptation to different waveforms and jamming techniques. The 20nm process provides high performance per watt, important for airborne and ground-based systems. Designers can use the Arria 10's hard memory controllers for efficient data buffering. The device's security features, including AES bitstream encryption, protect intellectual property.
推荐
Broadcast Video Processing
The 10AX115S4F45I3LG is ideal for broadcast video processing, including 4K/8K video switchers, format converters, and image processing. Its high logic density enables implementation of multiple video processing pipelines. The 96 transceivers support SDI and IP video interfaces. The 68,857,856 RAM bits provide line buffers for video processing. The 20nm process reduces power consumption, important for broadcast equipment that runs 24/7. The industrial temperature grade ensures reliability in studio environments. Designers can use the Arria 10's hard IP for video codecs and interfaces to accelerate development. The FPGA's reconfigurability allows support for evolving video standards.
推荐
Aerospace and Defense
The 10AX115S4F45I3LG is used in aerospace and defense systems for mission computers, sensor processing, and secure communications. Its industrial temperature grade and high reliability make it suitable for harsh environments. The 1,150,000 logic elements enable complex processing of radar, EO/IR, and signals intelligence data. The 96 transceivers support high-speed data links. The FPGA's security features, including AES bitstream encryption and tamper detection, protect against IP theft and reverse engineering. The 20nm process provides high performance per watt, critical for size, weight, and power (SWaP) constrained platforms. Designers can use the Arria 10's hard processor system for system management and control.
推荐
推荐产品汇总
工程参考数据： 10AX115S4F45I3LG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AX115S4F45E3LG | 10AX115S3F45I2LG | 10AX115S2F45I2LG |
|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (45 x 45 mm) | 1932-BBGA, FCBGA (45 x 45 mm) | 1932-BBGA, FCBGA (45 x 45 mm) | 1932-BBGA, FCBGA (45 x 45 mm) |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 1150000 | 1150000 | 1150000 | 1150000 |
| RAM Bits | 68857856 | 68857856 | 68857856 | 68857856 |
| User I/O | 624 | 624 | 624 | 624 |
| Speed Grade | 4 | 4 | 3 | 2 |
| Temperature Grade | Industrial (I3) | Extended (E3) | Industrial (I2) | Industrial (I2) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
关键差异点
- Industrial temperature grade (-40C to +100C) （对比 10AX115S4F45E3LG)
- Speed grade 4 (fastest) （对比 10AX115S3F45I2LG)
- Wider temperature range than I2 variants （对比 10AX115S3F45I2LG)
设计说明
The 10AX115S4F45I3LG requires multiple power rails: 0.9V core, 1.8V, 2.5V, and 3.3V. Use a dedicated power management IC to sequence these rails properly. Estimated: For a typical design with 50% logic utilization, core power can be around 20-30W. Ensure adequate decoupling with a mix of bulk and high-frequency capacitors placed close to the FPGA power pins.
The FPGA can dissipate significant power, especially with high transceiver usage. Estimated: With 96 transceivers active at 17.4 Gbps, power dissipation can exceed 50W. Use a heatsink with forced airflow or liquid cooling for high-density designs. The package thermal resistance (theta_JA) is [DATA_NEEDED: theta_JA], so calculate junction temperature to ensure it stays below the maximum rating.
For the 1932-ball FBGA package, use a high-layer-count PCB (at least 16 layers) with controlled impedance for high-speed transceivers. Follow Intel's layout guidelines for transceiver routing, including differential pair spacing and ground vias. Place decoupling capacitors on the bottom side of the board directly under the FPGA to minimize inductance.
合规信息
RoHS compliant per distributor data. Not AEC-Q100 qualified as it is an FPGA, not an automotive component.
