10AX115U4F45I3LG - Arria 10 GX FPGA 1150K LE 1932-FCBGA | Intel
料号： 10AX115U4F45I3LG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $8500 | $8,500.00 |
| 10 | $7820 | $78,200.00 |
| 100 | $7050 | $705,000.00 |
| 500 | $6480 | $3,240,000.00 |
| 1,000 | $5920 | $5,920,000.00 |
10AX115U4F45I3LG 概述
A Field-Programmable Gate Array is a semiconductor device whose digital logic fabric, interconnect, and I/O cells can be reconfigured after manufacture by loading a user-defined bitstream. FPGAs sit at the top of the programmable-logic hierarchy: simple programmable logic devices (SPLDs) and complex PLDs (CPLDs) sit below FPGAs in density, while ASICs and ASSPs sit above them as fixed-function alternatives. The Arria 10 GX family specifically targets mid-range applications that demand integrated high-speed transceivers and floating-point DSP blocks but at lower cost and power than the Stratix 10 flagship family.
Key features of the 10AX115U4F45I3LG include 1,150,000 logic elements, 68,857,856 embedded memory bits, 3,036 embedded 18x18 multipliers, 1,518 variable-precision DSP blocks, 24 phase-locked loops, and 480 maximum user I/O pins. Core voltage is 0.9 V with separate transceiver and auxiliary supplies. The transceiver subsystem supports data rates up to 14.4 Gbps using a hardened PCIe Gen3 x8 and 100G Ethernet IP stack, while the hard floating-point DSP blocks deliver up to 1.5 TFLOPs of single-precision performance.
The device architecture is built around a column-based HyperFlex-like routing fabric, adaptive logic modules (ALMs), and dedicated hard IP for PCIe Gen3, 10/25/40/100 Gigabit Ethernet, Interlaken, and CPRI. The hardened IP blocks offload common interface functions, freeing programmable logic for application-specific processing and dramatically reducing power relative to soft implementations. The part is supplied in a 45 mm x 45 mm 1932-ball FCBGA with 1.0 mm ball pitch, requiring high-density PCB design with HDI stackups and microvia technology.
Typical applications include high-end wireless baseband processing, 4K/8K video broadcast infrastructure, radar and electronic-warfare signal processing, medical imaging accelerators, network packet processing, and high-performance compute (HPC) prototyping. The 14.4 Gbps transceivers make the device especially well-suited for 100G Ethernet line cards and CPRI-observed-radio front-haul aggregation.
When designing with this device, plan the PCB stackup for the 1.0 mm BGA pitch early - at least an 8-layer HDI board with stacked microvias is recommended for power, ground, and signal escape routing. Power-rail sequencing must follow the Intel Arria 10 Power Management User Guide to avoid latch-up; use a dedicated PowerSoC or controller rather than discrete LDOs. Thermal design must handle up to approximately 40 W of typical board power, so a heatsink with 1 to 2 m/s airflow is generally required for industrial-temperature operation in sealed enclosures.
This page synthesizes distributor pricing, same-package pin-compatible alternatives, comparison tables, and PCB-thermal design notes that go well beyond the manufacturer ordering/datasheet summary.
直接替换替代料： 10AX115U4F45I3LG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10AX115U4F45I3LG （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Logic Elements, Mounting Type, Process Technology.
快速对比工具——选择替代料号进行并排对比：
10AX115U4F45I3SG
✅ 直接替换✓ 有现货
$7400 / 个
查看数据手册 →10AX115U4F45E3LG
✅ 直接替换✓ 有现货
$5650 / 个
查看数据手册 →10AX115U4F45E3SG
✅ 直接替换✓ 有现货
$5200 / 个
查看数据手册 →10AX115S4F45I3LG
✅ 直接替换✓ 有现货
$10000 / 个
查看数据手册 →10AX115N4F45I3LG
✅ 直接替换✓ 有现货
$7100 / 个
查看数据手册 →10AX090U4F45I3LG
✅ 直接替换✓ 有现货
$7450 / 个
查看数据手册 →10AX115U4F45I3LG 最大额定值与电气特性
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory (bits) | 68,857,856 |
| Embedded 18x18 Multipliers | 3,036 |
| Variable-Precision DSP Blocks | 1,518 |
| Maximum User I/O | 480 |
| Maximum Transceivers | 96 |
| Transceiver Data Rate | Up to 14.4 Gbps |
| PLLs | 24 |
| Process Technology | TSMC 20 nm |
| Core Voltage (Vcc) | 0.9 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| 封装 | 1932-ball FCBGA (F45), 45 x 45 mm, 1.0 mm pitch |
| RoHS 状态 | Compliant |
10AX115U4F45I3LG 1932-ball fcbga (f45), 45 x 45 mm, 1.0 mm pitch 引脚配置指南
10AX115U4F45I3LG（1932-ball fcbga (f45), 45 x 45 mm, 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10AX115U4F45I3LG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10AX115U4F45I3LG 适用于 6 应用s: 100G Ethernet Line Card / Network Switch, 4K/8K Video Broadcast Infrastructure, Wireless Baseband and CPRI Aggregation, Radar and Electronic Warfare Signal Processing, Medical Imaging Accelerator (CT / MRI / Ultrasound), High-Performance Compute Prototyping and ASIC Emulation.
100G Ethernet Line Card / Network Switch
The 10AX115U4F45I3LG is well suited to 100G Ethernet line-card design thanks to its 96 transceivers at 14.4 Gbps and the hardened 100G MAC and PCS IP. In a typical line card, the FPGA receives 100G traffic via 4x25G or 10x10G optical interfaces, performs packet classification, MACSec encryption at up to 100G, and forwards to a switch ASIC over a 100G or 400G uplink. The 1,150,000 logic elements provide ample room for traffic manager and look-up engine logic, while the 1,518 variable-precision DSP blocks accelerate header parsing and encryption. Unlike smaller Arria 10 devices, the 10AX115 has sufficient logic density to combine multiple 100G ports with the entire packet-processing pipeline on a single device, reducing BOM cost and power.
推荐
4K/8K Video Broadcast Infrastructure
The 10AX115U4F45I3LG supports 4K and 8K video broadcast and production workflows where multi-channel 12G-SDI and IP-based ST 2110 transport must be processed in real time. The 96 transceivers at 14.4 Gbps can carry multiple uncompressed 12G-SDI streams or 25G Ethernet ST 2110 channels, while the 1,518 DSP blocks handle real-time scaling, color space conversion, HDR tone mapping, and deinterlacing at full 8K resolution. The 68.86 Mbit of embedded memory provides frame buffering and lookup tables for color correction. Compared with ASSP broadcast SoCs, the Arria 10 GX allows broadcast OEMs to differentiate through proprietary processing IP and to evolve with changing codec standards.
推荐
Wireless Baseband and CPRI Aggregation
In LTE and 5G NR fronthaul and baseband processing, the 10AX115U4F45I3LG provides the logic density and transceiver count to aggregate multiple CPRI or eCPRI links while running PHY-layer DSP. The 96 transceivers can carry up to 24 CPRI option 9 (9.8 Gbps) links or 48 CPRI option 7 (6.1 Gbps) links from remote radio heads, while the DSP blocks perform FFT/iFFT, channel estimation, and digital pre-distortion for the baseband. The industrial temperature range makes the part suitable for outdoor baseband units. The 1,150,000 logic elements allow the full PHY plus a small MAC to be implemented on a single device, reducing the bill of materials in centralized-RAN deployments.
推荐
Radar and Electronic Warfare Signal Processing
Radar and electronic-warfare systems demand wideband ADC capture, real-time DSP, and high-speed backhaul, all of which the 10AX115U4F45I3LG delivers in a single package. The 96 transceivers accept multi-channel ADC outputs at 10 Gbps and forward pre-processed data to a back-end processor over 100G Ethernet, while the 1,518 DSP blocks perform pulse compression, MTI filtering, and beamforming across thousands of antenna elements. The 68.86 Mbit of embedded memory holds real-time aperture data. Compared with GPU-based processing, the FPGA delivers deterministic latency and lower power for time-critical EW applications, and the -40C to +100C industrial temperature range supports ground-vehicle and shipboard deployment.
推荐
Medical Imaging Accelerator (CT / MRI / Ultrasound)
The 10AX115U4F45I3LG is used in premium medical imaging systems including CT scanners, MRI receivers, and high-end ultrasound to perform back-projection, FFT, and beamforming in real time at low power. The 1,518 variable-precision DSP blocks deliver approximately 1.5 TFLOPs of single-precision performance, sufficient to reconstruct 512-slice CT volumes in real time, while the 96 transceivers accept raw data from hundreds of ultrasound or MRI receiver channels. The 1,150,000 logic elements allow the entire image-processing pipeline, from raw sample to display-ready image, to be implemented on a single FPGA, shortening time-to-market for medical OEMs and enabling field upgrades as new algorithms are validated.
推荐
High-Performance Compute Prototyping and ASIC Emulation
Data-center ASICs and custom accelerators are prototyped and emulated in the 10AX115U4F45I3LG because it offers 1,150,000 logic elements, 3,036 hardware multipliers, and 480 user I/O in a single device. Emulation platforms stack multiple FPGAs to model billion-gate ASICs, while the F45 package's 480 I/O support high-speed chip-to-chip links. The 0.9 V core voltage and Intel's proven Quartus Prime toolchain deliver 2-3x faster compile times than competing FPGA families. The 10AX115U4F45I3LG is frequently used as the 'core' FPGA in multi-FPGA emulation boards because its density allows the largest single-ASIC partition to be mapped, reducing partition count and overall compile time.
推荐
推荐产品汇总
工程参考数据： 10AX115U4F45I3LG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10AX115U4F45I3SG | 10AX115U4F45E3LG | 10AX115U4F45E3SG | 10AX115S4F45I3LG | 10AX115N4F45I3LG | 10AX090U4F45I3LG |
|---|---|---|---|---|---|---|---|
| Package | 1932-ball FCBGA (F45) | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Embedded Memory (bits) | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 68,857,856 | 53,568,000 (-22%) |
| Maximum Transceivers | 96 | 96 | 96 | 96 | 72 (-25%) | 0 (no transceivers) | 96 |
| Transceiver Data Rate | 14.4 Gbps | 14.4 Gbps | 14.4 Gbps | 14.4 Gbps | 14.4 Gbps | N/A (no transceivers) | 14.4 Gbps |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,200 (-21%) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +125C) | Extended (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Packing Format | Tape-and-Reel (L) | Tray (G) | Tape-and-Reel (L) | Tray (G) | Tape-and-Reel (L) | Tape-and-Reel (L) | Tape-and-Reel (L) |
关键差异点
- Highest-density 10AX115 variant with full 96-transceiver complement （对比 10AX090U4F45I3LG)
- Industrial vs Extended temperature grade flexibility within F45 （对比 10AX115U4F45E3LG)
- Identical silicon, alternative packing for production volume （对比 10AX115U4F45I3SG)
设计说明
The 1932-ball F45 FCBGA with 1.0 mm ball pitch requires an HDI PCB stackup with stacked microvias for signal and power escape. Plan the stackup during schematic capture, not after layout, because a 1.0 mm BGA cannot be escaped on a conventional 6-layer board with through vias. Use a minimum 8-layer HDI stackup (4-2-4 or 5-2-5) with 0.5 oz copper in core and 1 oz in outer layers; the FPGA core region typically requires 4-6 dedicated ground and power planes for power integrity. Estimated: at 14.4 Gbps transceiver data rate, total loss budget through the PCB + package + connector must remain below 18 dB, including approximately 6 dB loss in the package itself.
The 10AX115U4F45I3LG requires multiple power rails: 0.9 V core, 0.95 V transceiver supply, 1.8 V auxiliary, 1.2 V/2.5 V/3.0 V I/O banks, and a 1.8 V or 3.3 V configuration supply. Use a dedicated power management controller such as the Intel-recommended Enpirion or similar PowerSoC, with the sequencing shown in the Arria 10 Power Management User Guide. Estimated: at typical utilization the part draws 25-40 W on the 0.9 V core; total board power with 50% transceiver utilization is 40-60 W, requiring a buck converter capable of at least 50 A on the core rail with 1% accuracy.
At 40-60 W total board power, the 10AX115U4F45I3LG requires active cooling. With the 1932-ball F45 FCBGA package, the junction-to-ambient thermal resistance depends heavily on PCB copper area and heatsink design; with a 1 square inch copper pour on the top layer and a low-profile pin-fin heatsink, theta_JA is approximately 1.0-1.5 C/W. Estimated: at 40 W total power, junction temperature rise above ambient is approximately 40-60 C, so for industrial operation up to 100 C ambient the heatsink must keep junction below 100 C, requiring either 1-2 m/s airflow or a large aluminum heatsink. Use the Arria 10 thermal estimator spreadsheet during the design phase.
Three pitfalls are common when designing with the 10AX115U4F45I3LG. First, do not omit the configuration voltage rail or use the wrong pull-up - the FPGA will not configure and the JTAG programmer will appear to hang. Second, do not reuse the Quartus Prime pinout from a previous design without re-running pin-aware fitter; even within the same F45 package, the ball map depends on the speed grade and tier. Third, transceiver reference clock jitter must remain below 300 fs RMS for 14.4 Gbps operation; low-cost crystal oscillators will not meet this - use a dedicated clock generator IC with sub-200 fs RMS jitter.
合规信息
RoHS and REACH compliant per the Altera/Intel product page. AEC-Q100 not applicable - this is an FPGA, not a discrete automotive IC. For automotive under-hood, choose the E3 temperature grade variant.
