10AX115S4F45I3LG - Arria 10 GX FPGA 1150K LE | Intel
부품 번호: 10AX115S4F45I3LG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12500 | $12,500.00 |
| 10 | $11875 | $118,750.00 |
| 100 | $11250 | $1,125,000.00 |
| 500 | $10625 | $5,312,500.00 |
| 1,000 | $10000 | $10,000,000.00 |
10AX115S4F45I3LG 개요
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the programmable logic device family, which sits above CPLDs in complexity and capability. They consist of configurable logic blocks, programmable interconnects, and I/O blocks, allowing designers to implement complex digital systems without the high NRE costs of ASICs. FPGAs are widely used in prototyping, high-performance computing, and applications requiring hardware flexibility.
The 10AX115S4F45I3LG features 1,150,000 logic elements, 68,857,856 RAM bits, and 624 user I/O pins. It supports a wide range of I/O standards including LVCMOS, LVDS, and high-speed transceivers. The device includes 96 transceivers capable of up to 17.4 Gbps, making it suitable for high-bandwidth communication systems. The 20nm process technology ensures low power consumption while maintaining high performance.
This FPGA is part of the Arria 10 GX family, which integrates a hard processor system (HPS) with dual-core ARM Cortex-A9, enabling system-on-chip (SoC) designs. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down. It also features advanced security features including AES bitstream encryption and tamper detection.
Typical applications include high-performance computing, data center acceleration, 100G optical transport, radar and electronic warfare systems, and broadcast video processing. The 624 user I/O pins and 96 transceivers provide ample connectivity for complex system integration.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple power rails (0.9V core, 1.8V, 2.5V, 3.3V) and a robust power distribution network. Adequate cooling is essential due to the high power dissipation of large FPGAs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the 10AX115S4F45I3LG.
드롭인 대체품: 10AX115S4F45I3LG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115S4F45I3LG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Embedded Memory, Transceivers, DSP Blocks.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115S4F45E3LG
✅ 드롭인✓ 재고 있음
$5850 / 개
데이터시트 보기 →10AX115S3F45I2LG
✅ 드롭인✓ 재고 있음
$13200 / 개
데이터시트 보기 →10AX115S2F45I2LG
✅ 드롭인✓ 재고 있음
$3895 / 개
데이터시트 보기 →10AX115S4F45E3SG
✅ 드롭인✓ 재고 있음
$3210 / 개
데이터시트 보기 →10AX115S3F45E2LG
✅ 드롭인✓ 재고 있음
$7950 / 개
데이터시트 보기 →10AX115S2F45E2LG
✅ 드롭인✓ 재고 있음
$7100 / 개
데이터시트 보기 →10AX115S4F45I3LG 최대 정격 & 전기적 특성
| Family | Arria 10 GX |
| Logic Elements | 1150000 |
| RAM Bits | 68857856 |
| User I/O | 624 |
| Number of Transceivers | 96 |
| Transceiver Speed | 17.4 Gbps |
| Core Voltage | 0.9 V |
| Process Technology | 20 nm |
| 패키지 | 1932-BBGA, FCBGA (45 x 45 mm) |
| 동작 온도 | -40C to +100C (Industrial) |
| 실장 유형 | Surface Mount |
| Number of Terminals | 1932 |
| RoHS 상태 | Compliant |
| Grading | Industrial |
| Terminal Form | BALL |
10AX115S4F45I3LG 1932-bbga, fcbga (45 x 45 mm) 핀 구성 가이드
10AX115S4F45I3LG(1932-bbga, fcbga (45 x 45 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115S4F45I3LG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115S4F45I3LG 적합 용도: 6 애플리케이션s: High-Performance Computing, Data Center Acceleration, 100G Optical Transport, Radar and Electronic Warfare, Broadcast Video Processing, Aerospace and Defense.
High-Performance Computing
The 10AX115S4F45I3LG is ideal for high-performance computing (HPC) applications such as data center acceleration and scientific computing. With 1,150,000 logic elements and 68,857,856 RAM bits, it can implement complex parallel processing algorithms. The 96 transceivers support high-speed interconnects like 100G Ethernet, enabling efficient data movement between FPGAs and CPUs. The 20nm process provides high logic density while maintaining power efficiency, crucial for large-scale HPC systems where power and cooling are limited. Designers can leverage the Arria 10's hard memory controllers and DSP blocks to accelerate workloads such as AI inference, financial modeling, and genomics. The industrial temperature grade ensures reliable operation in demanding environments.
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Data Center Acceleration
In data centers, the 10AX115S4F45I3LG accelerates workloads such as network processing, storage, and AI. Its 96 transceivers support 100G Ethernet and PCIe Gen3, enabling high-throughput data paths. The FPGA's reconfigurability allows dynamic adaptation to changing algorithms, making it ideal for smart NICs and search acceleration. The 68,857,856 RAM bits provide ample buffering for packet processing. The 20nm process reduces power consumption compared to older nodes, critical for dense server deployments. The industrial temperature grade ensures reliability in data center environments with high ambient temperatures. Designers can use the Arria 10's partial reconfiguration to update acceleration logic without downtime.
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100G Optical Transport
The 10AX115S4F45I3LG is well-suited for 100G optical transport systems, including OTN switches and line cards. Its 96 transceivers support up to 17.4 Gbps, enabling 100G and 400G optical modules. The FPGA can implement forward error correction (FEC), framing, and switching functions. The high logic density (1,150,000 LEs) allows integration of multiple channels, reducing board space. The 20nm process provides low power per Gbps, essential for line cards with strict power budgets. The industrial temperature grade ensures operation in central office environments. Designers can use the Arria 10's hard IP for 100G Ethernet and Interlaken to simplify design and reduce latency.
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Radar and Electronic Warfare
The 10AX115S4F45I3LG is used in radar and electronic warfare systems for signal processing and beamforming. Its 1,150,000 logic elements and DSP blocks can implement complex FFTs and digital filters. The 96 transceivers support high-speed ADC/DAC interfaces. The industrial temperature grade (-40C to +100C) is critical for military and aerospace environments. The FPGA's reconfigurability allows adaptation to different waveforms and jamming techniques. The 20nm process provides high performance per watt, important for airborne and ground-based systems. Designers can use the Arria 10's hard memory controllers for efficient data buffering. The device's security features, including AES bitstream encryption, protect intellectual property.
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Broadcast Video Processing
The 10AX115S4F45I3LG is ideal for broadcast video processing, including 4K/8K video switchers, format converters, and image processing. Its high logic density enables implementation of multiple video processing pipelines. The 96 transceivers support SDI and IP video interfaces. The 68,857,856 RAM bits provide line buffers for video processing. The 20nm process reduces power consumption, important for broadcast equipment that runs 24/7. The industrial temperature grade ensures reliability in studio environments. Designers can use the Arria 10's hard IP for video codecs and interfaces to accelerate development. The FPGA's reconfigurability allows support for evolving video standards.
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Aerospace and Defense
The 10AX115S4F45I3LG is used in aerospace and defense systems for mission computers, sensor processing, and secure communications. Its industrial temperature grade and high reliability make it suitable for harsh environments. The 1,150,000 logic elements enable complex processing of radar, EO/IR, and signals intelligence data. The 96 transceivers support high-speed data links. The FPGA's security features, including AES bitstream encryption and tamper detection, protect against IP theft and reverse engineering. The 20nm process provides high performance per watt, critical for size, weight, and power (SWaP) constrained platforms. Designers can use the Arria 10's hard processor system for system management and control.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115S4F45I3LG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115S4F45E3LG | 10AX115S3F45I2LG | 10AX115S2F45I2LG |
|---|---|---|---|---|
| Package | 1932-BBGA, FCBGA (45 x 45 mm) | 1932-BBGA, FCBGA (45 x 45 mm) | 1932-BBGA, FCBGA (45 x 45 mm) | 1932-BBGA, FCBGA (45 x 45 mm) |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 1150000 | 1150000 | 1150000 | 1150000 |
| RAM Bits | 68857856 | 68857856 | 68857856 | 68857856 |
| User I/O | 624 | 624 | 624 | 624 |
| Speed Grade | 4 | 4 | 3 | 2 |
| Temperature Grade | Industrial (I3) | Extended (E3) | Industrial (I2) | Industrial (I2) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
주요 차별점
- Industrial temperature grade (-40C to +100C) (vs 10AX115S4F45E3LG)
- Speed grade 4 (fastest) (vs 10AX115S3F45I2LG)
- Wider temperature range than I2 variants (vs 10AX115S3F45I2LG)
설계 노트
The 10AX115S4F45I3LG requires multiple power rails: 0.9V core, 1.8V, 2.5V, and 3.3V. Use a dedicated power management IC to sequence these rails properly. Estimated: For a typical design with 50% logic utilization, core power can be around 20-30W. Ensure adequate decoupling with a mix of bulk and high-frequency capacitors placed close to the FPGA power pins.
The FPGA can dissipate significant power, especially with high transceiver usage. Estimated: With 96 transceivers active at 17.4 Gbps, power dissipation can exceed 50W. Use a heatsink with forced airflow or liquid cooling for high-density designs. The package thermal resistance (theta_JA) is [DATA_NEEDED: theta_JA], so calculate junction temperature to ensure it stays below the maximum rating.
For the 1932-ball FBGA package, use a high-layer-count PCB (at least 16 layers) with controlled impedance for high-speed transceivers. Follow Intel's layout guidelines for transceiver routing, including differential pair spacing and ground vias. Place decoupling capacitors on the bottom side of the board directly under the FPGA to minimize inductance.
규정 준수 정보
RoHS compliant per distributor data. Not AEC-Q100 qualified as it is an FPGA, not an automotive component.
