10M40DCF672C7G - MAX 10 FPGA 40K LE 672-BGA | Intel
料号： 10M40DCF672C7G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $119.39 | $119.39 |
| 10 | $113.42 | $1,134.20 |
| 100 | $101.48 | $10,148.00 |
| 500 | $89.54 | $44,770.00 |
| 1,000 | $83.57 | $83,570.00 |
10M40DCF672C7G 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the broader taxonomy: programmable logic -> logic device -> integrated circuit -> semiconductor. The MAX 10 family is Intel's (formerly Altera) non-volatile FPGA line that combines LUT-based logic with on-chip flash configuration memory, eliminating the need for external boot PROMs and delivering instant-on behavior at power-up.
Key features of the 10M40DCF672C7G include 40K logic elements, 250 (18x18) hardware multipliers, 1,290 Kbits embedded SRAM, 4 Kbits user flash memory, and up to 500 user I/O pins. The device operates from a 1.2 V core supply with multi-voltage I/O banks supporting LVCMOS, LVDS, SSTL, and other single-ended and differential standards. An integrated 12-bit ADC with up to 17 channels is available for system-monitoring functions.
The MAX 10 architecture pairs a look-up-table (LUT)-based logic fabric with embedded hard IP such as PLLs, memory controllers, and DSP blocks. The 672-ball FBGA package provides the high pin count required for 500 user I/Os and full bank access for DDR3/LPDDR2 external memory interfaces. Built on a 55 nm embedded-flash process, the 10M40 instant-on architecture removes external boot memory while retaining in-field reprogrammability via JTAG.
Typical applications include industrial motor control and factory automation, video bridging and image processing pipelines, automotive driver-assistance modules, I/O expansion and bridging for processors, low-volume ASIC prototyping, and portable instrumentation requiring non-volatile single-chip logic. The integrated ADC and PLL resources are particularly valuable for closed-loop control designs that need deterministic analog monitoring alongside digital logic.
When designing with the 10M40DCF672C7G, ensure all VCCIO bank supplies match the I/O standard of connected devices, and provide adequate decoupling per the Quartus Prime power-tree guidelines. Note that the C7 speed grade (commercial, -7) targets commercial-temperature designs; for industrial or automotive temperature ranges, select the I7 or A7 speed-grade variants from the same family.
直接替换替代料： 10M40DCF672C7G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 10M40DCF672C7G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Process Technology, Configuration Memory.
快速对比工具——选择替代料号进行并排对比：
10M40DCF672I7G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$72.65 / 个
查看数据手册 →10M40DAF672C7G
✅ 直接替换✓ 有现货
$67.2 / 个
查看数据手册 →10M40DAF672C8G
✅ 直接替换✓ 有现货
$86.1 / 个
查看数据手册 →10M40DAF672I7G
✅ 直接替换✓ 有现货
$65.85 / 个
查看数据手册 →10M40DCF484C7G
✅ 直接替换✓ 有现货
$124.2 / 个
查看数据手册 →10M40DCF672C7G 最大额定值与电气特性
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements | 40,000 |
| Embedded Memory (Bits) | 1,290,240 |
| User Flash (Bits) | 4,096 |
| Maximum User I/O | 500 |
| 18x18 Hardware Multipliers | 250 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| 封装 | 672-BGA (FBGA) |
| 安装类型 | Surface Mount |
| Speed Grade | C7 (commercial, -7) |
| 工作温度 | 0C to +85C (commercial) |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) |
| MSL 等级 | 3 |
| RoHS 状态 | Compliant |
10M40DCF672C7G 672-bga (fbga) 引脚配置指南
10M40DCF672C7G（672-bga (fbga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 10M40DCF672C7G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
10M40DCF672C7G 适用于 6 应用s: Industrial Motor Control and Factory Automation, Video Bridging and Image Processing, I/O Expansion and Processor Bridging, Low-Volume ASIC Prototyping, Portable Test and Measurement Instrumentation, Automotive Driver-Assistance Modules (ADAS).
Industrial Motor Control and Factory Automation
The 10M40DCF672C7G's 40,000 logic elements and 250 hardware 18x18 multipliers make it well-suited for industrial motor control and factory automation. The integrated 12-bit ADC with up to 17 analog input channels allows closed-loop current sensing and voltage monitoring directly inside the FPGA, eliminating external ADC components. The 500 user I/Os in the 672-BGA package provide enough headroom for multi-axis stepper/servo interfaces, encoder feedback (QEI/Halls), and EtherCAT or PROFINET link-layer glue. Compared with discrete MCU plus CPLD designs, the MAX 10 consolidates boot, control, and I/O expansion into one non-volatile instant-on device, reducing BOM cost and PCB area by an estimated 30%.
推荐
Video Bridging and Image Processing
For video bridging and image-processing pipelines, the 10M40DCF672C7G delivers 40K LE plus 1,290 Kbits of embedded SRAM, enough for parallel pixel processing, color-space conversion, and frame-rate conversion at 1080p60. The 250 dedicated 18x18 multipliers accelerate FIR filters and deinterlacing kernels without consuming general-purpose logic. The 672-BGA package supports DDR3/LPDDR2 external memory interfaces, which are critical for line buffers in scaling engines. Designers building multi-display aggregation or HDMI-to-MIPI bridges frequently choose the MAX 10 family over Cyclone 10 LP because of its on-chip flash, which simplifies board layout and eliminates an external boot memory footprint.
推荐
I/O Expansion and Processor Bridging
The 10M40DCF672C7G is widely used as a glue-logic and I/O-expansion companion to application processors. The 500 available user I/Os allow the FPGA to expose UART, SPI, I2C, GPIO, and PWM to a host CPU while performing format translation or real-time response. With multi-voltage I/O banks, the MAX 10 can interface 1.8 V host buses and 3.3 V peripheral buses simultaneously, eliminating level shifters. The on-chip dual-configuration flash enables secure field updates and lets designers A/B between two firmware images for fail-safe OTA deployment. Compared to CPLD alternatives, the 10M40DCF672C7G offers 4-6x more logic and embedded memory at similar unit cost.
推荐
Low-Volume ASIC Prototyping
Engineers use the 10M40DCF672C7G as a low-volume ASIC or ASSP prototype when mask costs for a sub-100 nm ASIC run cannot be justified. The 40K LE density covers mid-complexity state machines, bus interfaces, and custom peripherals. The MAX 10's instant-on behavior also lets designers validate boot ROM code before tape-out. With the 672-BGA package supporting JTAG, AS, and PS configuration modes, the same board design can transition between MAX 10 silicon and a downstream structured-ASIC or ASIC implementation, shortening the validation loop by several months.
推荐
Portable Test and Measurement Instrumentation
For portable test and measurement instruments, the 10M40DCF672C7G delivers 40K LE plus dedicated DSP blocks in a package that supports 500 mixed-voltage I/Os for sensor front-ends. The integrated 12-bit ADC simplifies temperature, current, and voltage telemetry without external analog components. The non-volatile configuration means the instrument is ready within microseconds of power-up, an important requirement for handheld oscilloscopes and data loggers. Compared with discrete MCU plus external ADC architectures, the MAX 10 cuts PCB area by approximately 25% and reduces standby-mode power by skipping boot-loader initialization.
推荐
Automotive Driver-Assistance Modules (ADAS)
Within ADAS sensor-fusion modules, the 10M40DCF672C7G serves as a flexible pre-processor for camera, radar, or LiDAR data, offloading time-critical logic from the main SoC. The 40K LE plus 250 multipliers handle simple object-detection kernels and CAN/LIN gateway functions. Designers select the A7 (automotive) speed-grade variant, e.g. 10M40DAF672A7G, for -40C to +125C operation; the C7 part evaluated here is suitable for cabin or laboratory ADAS prototyping. Compared with ASIC-based ADAS pre-processors, the MAX 10 supports in-field firmware updates via JTAG, enabling late-stage feature rollouts.
推荐
推荐产品汇总
工程参考数据： 10M40DCF672C7G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 10M40DCF672I7G | 10M40DAF672C7G | 10M40DAF672C8G | 10M40DCF484C7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA (FBGA) | 672-BGA (FBGA) - same | 672-BGA (FBGA) - same | 672-BGA (FBGA) - same | 484-BGA (FBGA) - different package |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 |
| Maximum User I/O | 500 | 500 | 500 | 500 | 360 |
| Embedded Memory (Kbits) | 1,290 | 1,290 | 1,290 | 1,290 | 1,290 |
| 18x18 Multipliers | 250 | 250 | 250 | 250 | 250 |
| Speed Grade | C7 (commercial) | I7 (industrial) | C7 (commercial) | C8 (commercial) | C7 (commercial) |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| On-chip Configuration Flash | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) |
关键差异点
- On-chip dual-configuration flash eliminates external boot PROM （对比 10CL040YF484C8G (Cyclone 10 LP, 40K LE))
- Highest user I/O count in MAX 10 family at 672-BGA （对比 10M40DCF484C7G (40K LE, 484-BGA))
- Integrated 12-bit ADC with up to 17 analog channels （对比 10M16DAF484A7G (16K LE))
设计说明
MAX 10 FPGAs require multiple supply rails: 1.2 V core (VCC), 1.2 V/1.5 V/1.8 V/2.5 V/3.0 V/3.3 V VCCIO for I/O banks, VCCA (analog supply for ADC/PLL), and VCCPD (configuration I/O). Use a sequencer or simple RC network to enforce VCC before VCCIO/VCCPD ramp-up; reverse sequencing can latch up I/O cells. Decouple each VCC pin with 0.1 uF and bulk-decouple each bank with 10-22 uF ceramic per the MAX 10 device datasheet pin connection guidelines.
Estimated: at full 40K LE utilization with 500 I/O toggling at 100 MHz and 1.2 V core, the 10M40DCF672C7G typically dissipates 1.0-1.8 W. The 672-BGA's theta_JA is approximately 15-20 C/W on a standard 4-layer JEDEC test board, giving a 15-35 C junction rise above ambient. Ensure the PCB thermal relief pad array is soldered to the inner ground plane and that adequate airflow is provided for >2 W dissipation.
The 672-BGA package uses a 1.0 mm ball pitch with full-array layout. Use via-in-pad (VIPPO) or microvia technology with 0.4 mm finished via diameter for breakout; dog-bone fanout is possible but consumes 4 routing layers for the inner rows. Match the BGA land pattern exactly to Intel's package specification - non-solder-mask-defined (NSMD) pads improve joint reliability over SMD pads. Reference the MAX 10 hardware design guidelines document for stack-up recommendations.
Do not confuse the C7 speed grade (commercial, -7) with the I7 (industrial, -7) - both share -7 timing but differ only in temperature range. Always check the order code prefix: DCF denotes commercial, DAF denotes analog-feature variants in the same family. The MAX 10 device overview datasheet contains the full ordering-code decoder; verify with the latest revision before committing to a BOM.
合规信息
RoHS and REACH compliant per Intel product declaration. Standard C7 commercial variant is NOT AEC-Q100 qualified; select A7 (automotive) speed-grade variant for -40C to +125C automotive applications.
