10M40DCF672C7G - MAX 10 FPGA 40K LE 672-BGA | Intel
MPN: 10M40DCF672C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $119.39 | $119.39 |
| 10 | $113.42 | $1,134.20 |
| 100 | $101.48 | $10,148.00 |
| 500 | $89.54 | $44,770.00 |
| 1,000 | $83.57 | $83,570.00 |
Drop-in alternatives for 10M40DCF672C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M40DCF672I7G
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$72.65 / Unit
View Datasheet →10M40DAF672C7G
✅ Drop-In✓ In Stock
$67.2 / Unit
View Datasheet →10M40DAF672C8G
✅ Drop-In✓ In Stock
$86.1 / Unit
View Datasheet →10M40DAF672I7G
✅ Drop-In✓ In Stock
$65.85 / Unit
View Datasheet →10M40DCF484C7G
✅ Drop-In✓ In Stock
$124.2 / Unit
View Datasheet →10M40DCF672C7G Maximum Ratings & Electrical Characteristics
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements | 40,000 |
| Embedded Memory (Bits) | 1,290,240 |
| User Flash (Bits) | 4,096 |
| Maximum User I/O | 500 |
| 18x18 Hardware Multipliers | 250 |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Package | 672-BGA (FBGA) |
| Mounting Type | Surface Mount |
| Speed Grade | C7 (commercial, -7) |
| Operating Temperature | 0C to +85C (commercial) |
| Configuration Memory | On-chip dual-configuration flash (non-volatile) |
| MSL Level | 3 |
| RoHS Status | Compliant |
10M40DCF672C7G 672-bga (fbga) Pin Configuration Guide
Complete pinout information for 10M40DCF672C7G (672-bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M40DCF672C7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M40DCF672C7G is suitable for 6 applications: Industrial Motor Control and Factory Automation, Video Bridging and Image Processing, I/O Expansion and Processor Bridging, Low-Volume ASIC Prototyping, Portable Test and Measurement Instrumentation, Automotive Driver-Assistance Modules (ADAS).
Industrial Motor Control and Factory Automation
The 10M40DCF672C7G's 40,000 logic elements and 250 hardware 18x18 multipliers make it well-suited for industrial motor control and factory automation. The integrated 12-bit ADC with up to 17 analog input channels allows closed-loop current sensing and voltage monitoring directly inside the FPGA, eliminating external ADC components. The 500 user I/Os in the 672-BGA package provide enough headroom for multi-axis stepper/servo interfaces, encoder feedback (QEI/Halls), and EtherCAT or PROFINET link-layer glue. Compared with discrete MCU plus CPLD designs, the MAX 10 consolidates boot, control, and I/O expansion into one non-volatile instant-on device, reducing BOM cost and PCB area by an estimated 30%.
Recommended
Video Bridging and Image Processing
For video bridging and image-processing pipelines, the 10M40DCF672C7G delivers 40K LE plus 1,290 Kbits of embedded SRAM, enough for parallel pixel processing, color-space conversion, and frame-rate conversion at 1080p60. The 250 dedicated 18x18 multipliers accelerate FIR filters and deinterlacing kernels without consuming general-purpose logic. The 672-BGA package supports DDR3/LPDDR2 external memory interfaces, which are critical for line buffers in scaling engines. Designers building multi-display aggregation or HDMI-to-MIPI bridges frequently choose the MAX 10 family over Cyclone 10 LP because of its on-chip flash, which simplifies board layout and eliminates an external boot memory footprint.
Recommended
I/O Expansion and Processor Bridging
The 10M40DCF672C7G is widely used as a glue-logic and I/O-expansion companion to application processors. The 500 available user I/Os allow the FPGA to expose UART, SPI, I2C, GPIO, and PWM to a host CPU while performing format translation or real-time response. With multi-voltage I/O banks, the MAX 10 can interface 1.8 V host buses and 3.3 V peripheral buses simultaneously, eliminating level shifters. The on-chip dual-configuration flash enables secure field updates and lets designers A/B between two firmware images for fail-safe OTA deployment. Compared to CPLD alternatives, the 10M40DCF672C7G offers 4-6x more logic and embedded memory at similar unit cost.
Recommended
Low-Volume ASIC Prototyping
Engineers use the 10M40DCF672C7G as a low-volume ASIC or ASSP prototype when mask costs for a sub-100 nm ASIC run cannot be justified. The 40K LE density covers mid-complexity state machines, bus interfaces, and custom peripherals. The MAX 10's instant-on behavior also lets designers validate boot ROM code before tape-out. With the 672-BGA package supporting JTAG, AS, and PS configuration modes, the same board design can transition between MAX 10 silicon and a downstream structured-ASIC or ASIC implementation, shortening the validation loop by several months.
Recommended
Portable Test and Measurement Instrumentation
For portable test and measurement instruments, the 10M40DCF672C7G delivers 40K LE plus dedicated DSP blocks in a package that supports 500 mixed-voltage I/Os for sensor front-ends. The integrated 12-bit ADC simplifies temperature, current, and voltage telemetry without external analog components. The non-volatile configuration means the instrument is ready within microseconds of power-up, an important requirement for handheld oscilloscopes and data loggers. Compared with discrete MCU plus external ADC architectures, the MAX 10 cuts PCB area by approximately 25% and reduces standby-mode power by skipping boot-loader initialization.
Recommended
Automotive Driver-Assistance Modules (ADAS)
Within ADAS sensor-fusion modules, the 10M40DCF672C7G serves as a flexible pre-processor for camera, radar, or LiDAR data, offloading time-critical logic from the main SoC. The 40K LE plus 250 multipliers handle simple object-detection kernels and CAN/LIN gateway functions. Designers select the A7 (automotive) speed-grade variant, e.g. 10M40DAF672A7G, for -40C to +125C operation; the C7 part evaluated here is suitable for cabin or laboratory ADAS prototyping. Compared with ASIC-based ADAS pre-processors, the MAX 10 supports in-field firmware updates via JTAG, enabling late-stage feature rollouts.
Recommended
Recommended Products Summary
Engineering reference data for 10M40DCF672C7G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M40DCF672I7G | 10M40DAF672C7G | 10M40DAF672C8G | 10M40DCF484C7G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-BGA (FBGA) | 672-BGA (FBGA) - same | 672-BGA (FBGA) - same | 672-BGA (FBGA) - same | 484-BGA (FBGA) - different package |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 |
| Maximum User I/O | 500 | 500 | 500 | 500 | 360 |
| Embedded Memory (Kbits) | 1,290 | 1,290 | 1,290 | 1,290 | 1,290 |
| 18x18 Multipliers | 250 | 250 | 250 | 250 | 250 |
| Speed Grade | C7 (commercial) | I7 (industrial) | C7 (commercial) | C8 (commercial) | C7 (commercial) |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| On-chip Configuration Flash | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) |
Key Differentiators
- On-chip dual-configuration flash eliminates external boot PROM (vs 10CL040YF484C8G (Cyclone 10 LP, 40K LE))
- Highest user I/O count in MAX 10 family at 672-BGA (vs 10M40DCF484C7G (40K LE, 484-BGA))
- Integrated 12-bit ADC with up to 17 analog channels (vs 10M16DAF484A7G (16K LE))
Design Notes
MAX 10 FPGAs require multiple supply rails: 1.2 V core (VCC), 1.2 V/1.5 V/1.8 V/2.5 V/3.0 V/3.3 V VCCIO for I/O banks, VCCA (analog supply for ADC/PLL), and VCCPD (configuration I/O). Use a sequencer or simple RC network to enforce VCC before VCCIO/VCCPD ramp-up; reverse sequencing can latch up I/O cells. Decouple each VCC pin with 0.1 uF and bulk-decouple each bank with 10-22 uF ceramic per the MAX 10 device datasheet pin connection guidelines.
Estimated: at full 40K LE utilization with 500 I/O toggling at 100 MHz and 1.2 V core, the 10M40DCF672C7G typically dissipates 1.0-1.8 W. The 672-BGA's theta_JA is approximately 15-20 C/W on a standard 4-layer JEDEC test board, giving a 15-35 C junction rise above ambient. Ensure the PCB thermal relief pad array is soldered to the inner ground plane and that adequate airflow is provided for >2 W dissipation.
The 672-BGA package uses a 1.0 mm ball pitch with full-array layout. Use via-in-pad (VIPPO) or microvia technology with 0.4 mm finished via diameter for breakout; dog-bone fanout is possible but consumes 4 routing layers for the inner rows. Match the BGA land pattern exactly to Intel's package specification - non-solder-mask-defined (NSMD) pads improve joint reliability over SMD pads. Reference the MAX 10 hardware design guidelines document for stack-up recommendations.
Do not confuse the C7 speed grade (commercial, -7) with the I7 (industrial, -7) - both share -7 timing but differ only in temperature range. Always check the order code prefix: DCF denotes commercial, DAF denotes analog-feature variants in the same family. The MAX 10 device overview datasheet contains the full ordering-code decoder; verify with the latest revision before committing to a BOM.
Compliance Information
RoHS and REACH compliant per Intel product declaration. Standard C7 commercial variant is NOT AEC-Q100 qualified; select A7 (automotive) speed-grade variant for -40C to +125C automotive applications.
