5CSEBA5U23C7N - Cyclone V SE SoC FPGA 85K LE | Intel
料号： 5CSEBA5U23C7N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $173.13 | $173.13 |
| 10 | $155.82 | $1,558.20 |
| 100 | $138.5 | $13,850.00 |
| 500 | $121.19 | $60,595.00 |
| 1,000 | $103.88 | $103,880.00 |
5CSEBA5U23C7N 概述
A System-on-Chip FPGA (SoC FPGA) is an integrated circuit that combines a hard processor system (HPS) - typically one or more ARM Cortex-A cores with peripherals and memory controllers - with a programmable FPGA fabric on a single die. This architecture sits in the broader taxonomy of programmable logic devices: SoC FPGA -> FPGA & CPLD -> programmable logic -> digital IC -> integrated circuit -> semiconductor. By merging the processor and the FPGA, SoC FPGAs eliminate the need for a separate companion processor ASIC and provide higher-bandwidth, lower-latency connectivity between software and hardware, which is critical in motor control, industrial Ethernet, and video processing pipelines.
Key features of the 5CSEBA5U23C7N include approximately 85K logic elements, embedded M10K and MLAB memory blocks, variable-precision DSP blocks, and up to 145 user I/O pins. The HPS section integrates dual ARM Cortex-A9 cores, NEON media-processing engine, single- and double-precision floating-point units, L1/L2 caches, hardware accelerators, and a rich peripheral set including Ethernet MAC, USB 2.0 OTG, NAND flash controller, and SDRAM/LPDDR/DDR2/DDR3 memory controllers. The device is built on TSMC's 28 nm low-power process and supports configuration via standard JTAG, Active Serial, or Active Parallel modes.
Typical applications for the 5CSEBA5U23C7N span industrial motor control drives, factory automation controllers, video surveillance and machine-vision systems, automotive driver-assistance platforms, and protocol-bridging industrial gateways where deterministic FPGA hardware acceleration meets a Linux-capable application processor. Designers leverage the HPS for OS-driven networking, HMI, or communication tasks while offloading deterministic DSP and I/O processing to the FPGA fabric.
When designing with this device, pay close attention to power-rail sequencing for the HPS and FPGA domains, thermal dissipation in the UBGAFBGA-672 package, and signal-integrity considerations for DDR3 memory interfaces routed to the HPS. The 23x23 mm package requires a high-layer-count PCB with microvia stack-ups, and the Intel Quartus Prime toolchain is required for synthesis, place-and-route, and HPS software development.
直接替换替代料： 5CSEBA5U23C7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： 5CSEBA5U23C7N （相同外形与封装尺寸） ——差异在于 Logic Elements, Operating Temperature, Package, Embedded Memory, Process Technology.
快速对比工具——选择替代料号进行并排对比：
5CSEBA5U23C6N
✅ 直接替换✓ 有现货
$122.33 / 个
查看数据手册 →5CSEBA5U23A7N
✅ 直接替换✓ 有现货
$205 / 个
查看数据手册 →5CSEBA4U23C7N
✅ 直接替换✓ 有现货
$124.5 / 个
查看数据手册 →5CSEBA5U19C7N
✅ 直接替换✓ 有现货
$99.2 / 个
查看数据手册 →5CSEBA5U23C7N 最大额定值与电气特性
| Series | Cyclone V SE SoC FPGA |
| Logic Elements | 85 K |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| User I/O Pins | 145 |
| 封装 | 672-UBGAFBGA (23x23 mm) |
| 安装类型 | Surface Mount (BGA) |
| 工作温度 | -40C to +85C (industrial) |
| Process Technology | 28 nm low-power |
| Memory Interfaces (HPS) | DDR3, DDR2, LPDDR2, SDRAM |
| Configuration Modes | JTAG, Active Serial, Active Parallel |
| DSP Blocks | Variable-precision, multiply-accumulate |
| Embedded Memory | M10K + MLAB blocks |
| HPS Peripherals | Ethernet MAC, USB 2.0 OTG, NAND, SD/MMC, SPI, I2C, UART |
| RoHS 状态 | Compliant |
5CSEBA5U23C7N 672-ubgafbga (23x23 mm) 引脚配置指南
5CSEBA5U23C7N（672-ubgafbga (23x23 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： 5CSEBA5U23C7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
5CSEBA5U23C7N 适用于 6 应用s: Industrial Motor Control Drives, Factory Automation Controllers (PLC / PAC), Video Surveillance and Machine Vision, Automotive Driver-Assistance (ADAS) Pre-Processing, Industrial Protocol Bridging Gateways, Medical Imaging and Diagnostics Equipment.
Industrial Motor Control Drives
The 5CSEBA5U23C7N is widely used in industrial AC and servo motor drives where its dual-core ARM Cortex-A9 HPS runs the motor-control application stack (vector control, FOC, communication protocols) while the 85K LE FPGA fabric executes deterministic, sub-microsecond current-loop and PWM generation. The hard Ethernet MAC and DDR3 controller in the HPS support real-time EtherCAT, PROFINET, or EtherNet/IP fieldbus communication without external ASICs. Its industrial -40C to +85C operating range suits factory-floor cabinet environments, and the UBGAFBGA-672 package's high pin count accommodates the multi-axis PWM, encoder, and resolver interface signals typical of multi-axis drives.
推荐
Factory Automation Controllers (PLC / PAC)
In PLC and PAC platforms the 5CSEBA5U23C7N's ARM HPS runs a real-time Linux or VxWorks OS hosting IEC 61131-3 soft-PLC execution, while the 85K-logic-element FPGA implements fast digital I/O scanning, high-speed counters, and isolated industrial protocol stacks. The HPS USB 2.0 OTG, Gigabit Ethernet MAC, and SD/MMC peripherals provide connectivity for HMI panels and remote diagnostics. Variable-precision DSP blocks handle PID loops and motion profiles at sample rates exceeding those achievable in software alone. The single-chip SoC architecture reduces BOM cost and PCB area versus a discrete processor + FPGA design.
推荐
Video Surveillance and Machine Vision
The 5CSEBA5U23C7N is well suited for IP video surveillance recorders, multi-channel DVR/NVR, and machine-vision inspection systems. The HPS runs the video management software (ONVIF, RTSP) on its dual Cortex-A9 cores, while the FPGA fabric performs real-time H.264/H.265 preprocessing, image scaling, and object detection pipelines using variable-precision DSP blocks. The HPS DDR3 controller streams pixel data between FPGA frame buffers and main memory at high bandwidth. The 672-UBGAFBGA package provides ample I/O for multi-sensor MIPI CSI-2 or parallel camera interface aggregation, and the industrial temperature range enables outdoor cabinet deployment.
推荐
Automotive Driver-Assistance (ADAS) Pre-Processing
The 5CSEBA5U23C7N integrates multi-camera ADAS pre-processing in body-electronics and entry-level ADAS ECUs. Its FPGA fabric performs sensor-fusion preprocessing (object detection, lane detection) while the dual ARM Cortex-A9 HPS runs the application middleware, vehicle-bus stacks (CAN, Automotive Ethernet), and OTA update logic. Variable-precision DSP blocks accelerate image-processing kernels, and the DDR3 HPS controller buffers multi-megapixel camera frames. Designers choose the 5CSEBA5U23A7N automotive grade variant for AEC-Q100-qualified deployments where the wider -40C to +125C operating range is required, while the standard 5CSEBA5U23C7N fits industrial-grade fleet and aftermarket ADAS.
推荐
Industrial Protocol Bridging Gateways
Industrial protocol gateways leveraging the 5CSEBA5U23C7N convert between Modbus TCP, EtherNet/IP, PROFINET, Modbus RTU, CANopen, and IEC 61850 on a single device. The HPS runs the protocol-conversion middleware with TLS-secured cloud connectivity, while the FPGA fabric handles time-critical bus arbitration and timestamping. The 145 user I/O pins provide interface channels for multiple isolated RS-485, CAN, and SPI fieldbus ports. Industrial -40C to +85C operation is suitable for DIN-rail cabinets and outdoor enclosures.
推荐
Medical Imaging and Diagnostics Equipment
The 5CSEBA5U23C7N is deployed in entry-level medical imaging systems including ultrasound front-ends, patient monitors, and laboratory analyzers. The FPGA fabric performs beamforming, FFT, and signal conditioning at deterministic low latency, while the dual Cortex-A9 HPS hosts the Linux-based user interface, database connectivity, and DICOM stack. The HPS DDR3 controller provides sufficient bandwidth for streaming digitized RF or sample data. The compact UBGAFBGA-672 package fits portable cart-mounted designs, and the -40C to +85C industrial operating range supports clinical environments.
推荐
推荐产品汇总
工程参考数据： 5CSEBA5U23C7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | 5CSEBA5U23C6N | 5CSEBA5U23A7N | 5CSEBA4U23C7N | 5CSEBA5U19C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGAFBGA (23x23) | 672-UBGAFBGA (23x23) - same | 672-UBGAFBGA (23x23) - same | 672-UBGAFBGA (23x23) - same | 484-UBGAFBGA (19x19) - different |
| Logic Elements | 85 K | 85 K | 85 K | ~49 K | 85 K |
| HPS | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz | Dual ARM Cortex-A9 @ 800 MHz |
| Speed Grade | -7 (mid) | -6 (slow) | -7 (mid) | -7 (mid) | -7 (mid) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (automotive) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Series | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC |
关键差异点
- Pin-compatible cost-down option with 85K LE （对比 5CSEBA5U23C6N)
- Pin-compatible automotive-grade variant （对比 5CSEBA5U23A7N)
- Mid-density option at full LE count （对比 5CSEBA4U23C7N)
- Same LE density in smaller footprint （对比 5CSEBA5U19C7N)
设计说明
The UBGAFBGA-672 (23x23 mm) package is a 1.0 mm pitch ball-grid array that requires a high-layer-count PCB (typically 8 to 12 layers) with microvia stack-ups. Route all HPS DDR3 signals as matched-length pairs within the byte groups per the Cyclone V External Memory Interface Handbook. Maintain continuous ground-reference planes under all BGA breakouts and use via-in-pad (VIPPO) with proper plugging/capping for reliable BGA assembly.
Power the 5CSEBA5U23C7N from multiple independent rails: VCCINT for FPGA core, VCCPD for configuration, VCCAUX/VCCA_PLL for analog blocks, and VCC_HPS/VCC_HPS_IO for the ARM HPS subsystem. Per the Cyclone V device datasheet, the HPS and FPGA power rails must be sequenced in a defined order; using a power-management IC with adjustable sequencing (such as an Intel Enpirion EM11x or similar) avoids latch-up and boot failures.
At maximum HPS utilization (both Cortex-A9 cores at 800 MHz) and high FPGA fabric toggle rates, the 5CSEBA5U23C7N can dissipate 3 to 6 W depending on toggle activity. Use the UBGAFBGA thermal pad (if present) and provide sufficient PCB copper area on inner and outer layers for heat spreading. For sealed enclosures with limited airflow, perform thermal simulation with the Altera/Intel PowerPlay Early Power Estimator (EPE) to size heatsinking before committing to layout.
Common pitfalls include: (1) incorrect configuration mode pin strapping (MSEL pins must match JTAG/AS/AP mode), (2) BSDL file mismatch for boundary-scan when the part is in user-mode, (3) HPS EMAC RGMII timing margin errors caused by mismatched trace lengths, and (4) forgetting to instantiate the Quartus pin assignments for unused pins set to tri-state with weak pull-up to avoid floating I/O during board bring-up. Always run the Quartus Pin Planner early in the design cycle.
Keep all HPS clock traces (HPS_CLK1, HPS_CLK2, REF_CLK) short and surrounded by a continuous ground reference. Route FPGA-HPS bridge signals (HPS-to-FPGA AXI bridges) on inner stripline layers with impedance control, and avoid crossing these bridges over noisy power or switcher traces. For the JTAG chain, place a 4.7k pull-up on TCK and TMS, and ensure the JTAG header is accessible for factory programming.
合规信息
RoHS and REACH compliance per Intel/Altera product declaration. Standard industrial-grade - choose 5CSEBA5U23A7N for AEC-Q100 automotive qualification.
