5CSEBA5U23A7N - Cyclone V SE SoC FPGA 85K LE, Dual ARM A9 | Altera
MPN: 5CSEBA5U23A7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $295 | $295.00 |
| 10 | $275 | $2,750.00 |
| 100 | $248 | $24,800.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $205 | $205,000.00 |
Drop-in alternatives for 5CSEBA5U23A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →5CSEBA5U23A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 85 K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| FPGA Fabric Speed Grade | 7 |
| User I/O Count | 145 |
| Embedded Memory | 4,450 Kbits (approximate) |
| DSP Blocks (18x18) | 87 |
| PLLs | 6 (approximate, per device family) |
| Package | 672-UBGA (23x23 mm) |
| Process Technology | 28 nm low-power |
| Configuration Method | Serial (EPCS) or parallel flash with AES-128/256 |
| Operating Temperature Grade | Automotive / -40C to +125C (per Altera ordering code 'A') |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020, typical for BGA packages) |
| RoHS Status | Compliant |
5CSEBA5U23A7N Pin Configuration
| Pin 1 | IO — User I/O - dual function, see U23 pinout file |
| Pin 2 | IO — User I/O - dual function, see U23 pinout file |
| Pin 3 | GND — Ground |
| Pin 4 | VCC — Core supply |
| Pin 5 | IO — User I/O - dual function |
| Pin 6 | IO — User I/O - dual function |
| Pin 7 | VCC_PLL — PLL analog supply |
| Pin 8 | GND_PLL — PLL analog ground |
| Pin 9 | IO — User I/O - dual function |
| Pin 10 | IO — User I/O - dual function |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA5U23A7N is suitable for 6 applications: Industrial Motor Control & Motion Control, Factory Automation PLC & Edge Gateway, Machine Vision & Industrial Image Processing, Automotive Driver-Assistance Pre-Processing, Software-Defined Radio Baseband Pre-Processing, Medical Point-of-Care Instrumentation.
Industrial Motor Control & Motion Control
The 5CSEBA5U23A7N is ideally suited for industrial motor drives and multi-axis motion controllers. The dual ARM Cortex-A9 HPS runs a deterministic Linux or RTOS control loop at up to 925 MHz, while the FPGA fabric implements sub-microsecond current-loop PWM, encoder interfaces (EnDat 2.2, BiSS, Tamagawa, SSI), and field-oriented control (FOC) math. The 87 DSP blocks (18x18 multipliers) and 4,450 Kbits of embedded memory handle FOC transforms and current observers at 50 kHz switching frequency without taxing the ARM cores. Operating temperature grade 'A' supports -40C to +125C, meeting IEC 61800 industrial drive requirements. Isolated gate drivers and Sigma-Delta ADC interfaces connect directly to FPGA fabric I/Os for sub-microsecond sampling of phase currents.
Recommended
Factory Automation PLC & Edge Gateway
For Programmable Logic Controllers (PLCs) and industrial edge gateways, the 5CSEBA5U23A7N combines an HPS running Docker containers or PLC runtimes (CODESYS, Beremiz) with FPGA fabric implementing deterministic industrial protocols. The HPS Gigabit Ethernet MAC supports OPC UA Pub/Sub and MQTT for cloud connectivity, while the FPGA fabric implements EtherCAT master, PROFINET IRT, EtherNet/IP, or Modbus TCP with sub-millisecond cycle times. The 145 user I/Os and 3.3 V LVCMOS/LVTTL support directly connect to 24 V industrial I/O via external opto-isolation. DDR3 with ECC on the HPS side provides reliable memory for long-uptime edge nodes. This integration eliminates the discrete CPU+FPGA SoM, reducing BOM and enabling fanless operation.
Recommended
Machine Vision & Industrial Image Processing
The 5CSEBA5U23A7N's combination of FPGA fabric and ARM Cortex-A9 HPS makes it well suited for machine vision pre-processing at the edge of industrial assembly lines. The FPGA fabric accepts image data from MIPI CSI-2 or parallel LVCMOS camera interfaces at line rates exceeding 1 Gbps, performing Bayer demosaicing, lens distortion correction, and convolutional neural network (CNN) inference accelerators using DSP blocks. The HPS then runs OpenCV-based defect classification algorithms at up to 925 MHz. Variable-precision DSP blocks (configurable as 9x9, 18x18, or 27x27 multipliers) accelerate INT8 quantized CNNs from frameworks like TensorFlow Lite. The 4,450 Kbits embedded memory buffers line-scan or area-scan frames before HPS handoff via the FPGA-to-HPS AXI bridge.
Recommended
Automotive Driver-Assistance Pre-Processing
The 5CSEBA5U23A7N's automotive temperature grade 'A' (-40C to +125C) and dual-core ARM Cortex-A9 HPS make it appropriate for pre-processing sensor data in advanced driver-assistance systems (ADAS). The FPGA fabric aggregates data from multiple automotive cameras and radar sensors via CAN-FD, FlexRay, and Ethernet AVB, performing sensor fusion and object detection before forwarding to the central ADAS processor. Automotive peripherals in the HPS include two CAN 2.0B controllers, SD/SDIO, USB 2.0, and GPIO. Designers targeting AEC-Q100 qualification should confirm the specific part ordering code with Altera (Intel) sales, as the 'A' suffix denotes the automotive grade rather than full AEC-Q100 certification by default.
Recommended
Software-Defined Radio Baseband Pre-Processing
The 5CSEBA5U23A23A7N's 85K logic elements and 87 DSP blocks can implement digital down-conversion (DDC), digital up-conversion (DUC), and baseband modulation/demodulation for software-defined radio (SDR) platforms. Designers can pair the FPGA fabric with an external RF transceiver (such as an AD9361 or AD9371) to build a complete SDR baseband processor. The HPS runs a Linux-based GNU Radio stack or custom DSP code, while the FPGA fabric handles the high-throughput symbol-rate DSP. The 3.3 V LVCMOS/LVTTL user I/Os interface directly to the LVDS or CMOS logic of common transceivers. DDR3 with ECC on the HPS supports long captures of RF data for spectrum analysis applications.
Recommended
Medical Point-of-Care Instrumentation
The 5CSEBA5U23A7N suits medical point-of-care instruments such as portable ultrasound, patient monitors, and lab analyzers. The dual ARM Cortex-A9 HPS runs embedded Linux with a Qt- or web-based user interface, while the FPGA fabric performs real-time signal conditioning, FIR filtering, and beamforming for ultrasound arrays. The 87 variable-precision DSP blocks accelerate envelope detection and I/Q demodulation at ultrasound pulse repetition frequencies. Operating temperature grade 'A' (-40C to +125C) supports clinical environments and IEC 60601-1 isolation requirements when paired with appropriate medical-grade power supplies. DDR3 with ECC on the HPS provides the memory reliability required for FDA Title 21 CFR Part 11 audit trails.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA5U23A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U23C8N | 5CSEBA5U23C6N | 5CSEBA5U19A7N | 5CSEBA4U23A7N |
|---|---|---|---|---|---|
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (19x19 mm) - smaller | 672-UBGA (23x23 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 85 K | 85 K | 85 K | 85 K | ~25 K (5CSEA4 silicon) |
| Speed Grade | A7 (automotive, fastest) | C8 (commercial, ~5-10% slower) | C6 (commercial, ~10-15% slower) | A7 (same) | A7 (same) |
| Temperature Grade | Automotive -40C to +125C | Commercial 0C to +85C | Commercial 0C to +85C | Automotive -40C to +125C (same) | Automotive -40C to +125C (same) |
| HPS (Dual ARM Cortex-A9) | Yes (up to 925 MHz) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| User I/O Count | 145 | 145 | 145 | [DATA_NEEDED] | [DATA_NEEDED] |
| Approx. 1k-Unit Price (USD) | 205.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Automotive temperature grade (-40C to +125C) with fastest timing closure for the silicon (vs 5CSEBA5U23C8N)
- Largest FPGA fabric in the 5CSEBA5 silicon family at 85K LE (vs 5CSEBA4U23A7N)
- U23 (23x23 mm) package maximizes user I/O access and thermal dissipation (vs 5CSEBA5U19A7N)
Design Notes
Estimated: the 5CSEBA5U23A7N core draw at 925 MHz HPS + 85K LE at typical 100 MHz fabric toggling is approximately 3-5 W. Provide separate analog (VCC_PLL, VCC_HPS_PLL) and digital (VCCINT, VCCIO) rails with ferrite-bead isolation. Place 100 nF X7R 0402 decoupling within 100 mil of every supply pin; add 10 uF and 100 uF bulk capacitors adjacent to each regulator output. Use the Quartus Prime Early Power Estimator (EPE) spreadsheet to validate thermal design before PCB commitment.
The 672-UBGA (23x23 mm) package requires a minimum 6-layer PCB stackup with continuous GND and PWR planes to support 1 Gbps DDR3 operation on the HPS. Microvia (laser-drilled) stackups are strongly recommended for BGA breakout; each BGA pad requires a via-in-pad or dog-bone fanout within the first inner layer. Match DDR3 trace lengths to within +/- 25 mil and within a +/- 5 mil intra-byte skew. Series-staggered decoupling (10 nF + 100 nF + 1 uF) per pin minimizes simultaneous switching noise.
Estimated: at 5 W total power dissipation in the 672-UBGA package with theta_JA of approximately 8-12 C/W (typical for large BGAs on a JEDEC 4-layer test board), junction-to-ambient temperature rise is 40-60 C. For automotive -40C to +125C operation, design ambient must stay below 65-85 C. Add a thermal pad array under the BGA center, stitched vias to inner copper planes, and consider a heatsink or forced airflow for sustained high-utilization workloads. Use the Cyclone V PowerPlay thermal model in Quartus for junction temperature estimation.
Route the FPGA-HPS bridges (AXI, FPGA-to-SDRAM, HPS-to-FPGA) on inner signal layers with ground reference planes above and below. Keep HPS boot configuration pins (BSEL, CSEL) accessible for pull-up/pull-down jumper configuration. Reserve at least 4 GPIO pins for JTAG fallback debug. Place the configuration flash (EPCQ64 or compatible) within 2 inches of the MSEL[2:0] pins with short, length-matched traces.
Do not enable HPS boot from NAND flash without verifying on-die ECC support for the specific NAND part. Do not exceed the maximum of 4 DDR3 chip selects without consulting the HPS memory controller errata. Ensure MSEL[2:0] configuration matches the actual boot source, otherwise the device may appear bricked. Validate PLL configuration against the Cyclone V PLL User Guide before committing to pin assignments - some PLL output counter settings are restricted on commercial (C) speed grades.
Compliance Information
RoHS compliant and lead-free per Altera product page. Automotive temperature grade 'A' is supported but full AEC-Q100 qualification status should be confirmed directly with Altera (Intel) sales for each specific ordering code. MSL 3 per JEDEC J-STD-020 is typical for BGA packages of this pin count.
