5CSEBA6U19C8N - Cyclone V SE SoC FPGA, 110K LE, Dual A9 | Intel
MPN: 5CSEBA6U19C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $210.5 | $52,625.00 |
| 500 | $195 | $97,500.00 |
Drop-in alternatives for 5CSEBA6U19C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA6U19C7N
✅ Drop-In✓ In Stock
$155.29 / Unit
View Datasheet →5CSEBA6U19C7SN
✅ Drop-In✓ In Stock
$149.85 / Unit
View Datasheet →5CSEBA6U19C6N
✅ Drop-In✓ In Stock
$194.15 / Unit
View Datasheet →5CSEBA6U19A7N
✅ Drop-In✓ In Stock
$198.4 / Unit
View Datasheet →5CSEBA4U19C8N
✅ Drop-In✓ In Stock
$54.75 / Unit
View Datasheet →XC7Z020-1CLG484C
✅ Drop-In📋 Reference alternative (not in catalog)
5CSEBA6U19C8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock Frequency | 600 MHz |
| Package | 484-UBGA (19x19 mm) |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 8 |
| Lead-Free / RoHS Finish | Yes (N suffix) |
| Process Technology | 28 nm low-power |
| Mounting Type | Surface Mount (BGA) |
| Terminal Form | Ball |
| Terminal Count | 484 |
| Package Code | FBGA / UBG A |
| Package Shape | Square |
| Series | 5CSEA6 (U19) |
5CSEBA6U19C8N square Pin Configuration Guide
Complete pinout information for 5CSEBA6U19C8N (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U19C8N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA6U19C8N is suitable for 6 applications: Industrial Motor Control, Factory Automation Gateways, Video Surveillance Edge Analytics, Machine Vision Pre-Processing, Portable Medical Instrumentation, Embedded Vision and ADAS.
Industrial Motor Control
The 5CSEBA6U19C8N is well suited to industrial motor drives where field-oriented control (FOC) loops demand deterministic microsecond response. Its 110K logic elements plus variable-precision DSP blocks run simultaneous current, speed, and position loops in FPGA fabric while the dual ARM Cortex-A9 HPS @ 600 MHz handles supervisory tasks, EtherCAT/MODBUS stacks, and HMI. Designers typically instantiate SVPWM, encoder decoding, and Clarke/Park transforms in hardware, offloading the HPS and achieving sub-10 microsecond torque loop times. The 28 nm low-power process keeps junction temperatures manageable inside IP65 enclosures without active cooling.
Recommended
Factory Automation Gateways
Industrial gateways consolidate fieldbus (PROFINET, EtherCAT, Modbus TCP) into cloud APIs and benefit from the 5CSEBA6U19C8N's combined Linux-capable HPS and parallel processing fabric. The dual Cortex-A9 runs OPC UA, MQTT, and TLS while FPGA-implemented protocol stacks offload hard-real-time fieldbus MACs. Integrated Gigabit Ethernet MAC and DDR3 controller eliminate external bus chips. Compared with discrete CPU+FPGA solutions, this SoC integration reduces board area by ~40% and BOM cost by ~25% in typical 4-port gateway designs.
Recommended
Video Surveillance Edge Analytics
The 5CSEBA6U19C8N handles multi-channel H.264/H.265 decode plus motion detection and license-plate recognition at the network edge. The 110K logic elements plus dedicated DSP blocks accelerate pixel-pipeline preprocessing (Sobel, optical flow) before passing metadata to the Cortex-A9 for higher-level analytics. DDR3 controller bandwidth handles 4-8 channels of 1080p30 without external memory. A typical 8-camera NVR uses one 5CSEBA6U19C8N plus a SATA controller, replacing a multi-ASIC solution and simplifying firmware development on a single SoC.
Recommended
Machine Vision Pre-Processing
For factory-floor inspection, the 5CSEBA6U19C8N's FPGA fabric accelerates image preprocessing (Gaussian, Sobel, thresholding, morphological ops) at line rate while the ARM cores run classifier inference (TensorFlow Lite, ONNX). MIPI CSI-2 input through FPGA soft cores feeds the pipeline, and DDR3 holds frame buffers. A single SoC typically replaces a CPU + GPU + FPGA 3-board stack, reducing latency by ~5x and enabling closed-loop decisions within 1 frame interval. Industrial Camera Link and GigE Vision protocols are supported via IP cores.
Recommended
Portable Medical Instrumentation
Medical devices such as ultrasound carts, patient monitors, and point-of-care diagnostics benefit from the 5CSEBA6U19C8N's low-power 28 nm process and integrated ARM+FPGA architecture. Beamforming in ultrasound uses FPGA fabric for parallel channel processing while the HPS handles DICOM, user interface, and network. Battery-powered designs leverage the deep-sleep modes of the FPGA fabric (typical <100 mW static). The commercial temperature grade suits clinical environments; medical certification (IEC 60601) is the integrator's responsibility.
Recommended
Embedded Vision and ADAS
The 5CSEBA6U19C8N serves entry-level ADAS front cameras and surround-view ECUs where multiple camera inputs are preprocessed, stitched, and feature-extracted in FPGA fabric. The HPS runs object detection and lane-keeping algorithms. Automotive qualification is achieved with the 'A' grade variant (5CSEBA6U19A7N), which shares the same U19 footprint. Designers typically pair the SoC with an external ISP and external DRAM, using the integrated DDR3 controller to maintain low BOM cost.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U19C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA6U19C7N | 5CSEBA6U19C6N | 5CSEBA6U19A7N | 5CSEBA4U19C8N | XC7Z020-1CLG484C |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | AMD |
| Package | 484-UBGA (19x19 mm) | 484-UBGA (19x19 mm) - same | 484-UBGA (19x19 mm) - same | 484-UBGA (19x19 mm) - same | 484-UBGA (19x19 mm) - same | 484-CLG BGA (19x19 mm) - same footprint, different ball map |
| Logic Elements | 110K | 110K | 110K | 110K | 85K | ~85K logic cells |
| HPS Core | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 600 MHz | Dual Cortex-A9 @ 667 MHz |
| Speed Grade | 8 | 7 | 6 | 7 | 8 | -1 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Automotive (-40C to +125C) | Commercial | Commercial |
| RoHS Compliant | Yes | Yes | Yes | Yes | Yes | Yes |
| Typical Unit Price (qty 1, USD) | 285.00 | ~245 (lower speed) | ~215 (lowest speed) | ~360 (auto grade) | ~210 (lower density) | ~225 |
Key Differentiators
- Highest speed grade in the 5CSEA6 family (vs 5CSEBA6U19C7N)
- Maximum logic density for the 5CSEA6 commercial part (vs 5CSEBA4U19C8N)
- Commercial temperature grade vs automotive (vs 5CSEBA6U19A7N)
Design Notes
Estimated: at 1.0 V core, 110K LE utilization at 75% toggle rate, and 600 MHz HPS activity, the 5CSEBA6U19C8N dissipates roughly 3-5 W. The 484-UBGA package has a typical theta_JA of ~15 C/W with a standard 4-layer JEDEC test board, giving a junction temperature rise of 45-75 C above ambient. For sealed enclosures without airflow, add a thermal pad or copper heat spreader; ensure Tj stays below 100 C for the commercial-grade 'C' temperature variant. The 'I' industrial-grade '5CSEBA6U19I7N' variant (rated to -40C to +100C) is recommended for fanless sealed enclosures operating above 60 C ambient.
The 484-UBGA at 0.8 mm pitch requires laser-drilled microvias on the top layer for fan-out; via-in-pad is recommended for the HPS DDR3 and Gigabit Ethernet signals to maintain signal integrity. Use Intel's Cyclone V device pinout spreadsheet to assign banks: dedicate one I/O bank to DDR3 with its own VCCIO voltage (1.5 V for DDR3), and keep HPS JTAG traces under 50 mm with 50 ohm controlled impedance. Provide decoupling of 100 nF + 10 uF per VCC pin within 2 mm of the ball.
Do not confuse the HPS EMAC with the FPGA fabric EMAC - the HPS uses dedicated PHY interfaces and cannot be remapped to FPGA I/O banks. Configure boot mode pins (MSEL) early in your schematic; defaults are MSEL=010 for AS x4 fast mode. Always include a watchdog timer in HPS software to recover from lockups. For non-volatile storage, configure the QSPI boot flash as 1.8 V or 3.3 V to match the FPGA's configuration voltage - mismatch is a common bring-up failure.
Compliance Information
RoHS compliance confirmed by the 'N' suffix in the OPN per Intel ordering convention. AEC-Q100 qualification is NOT available on this commercial OPN - use 5CSEBA6U19A7N for automotive. REACH compliance inferred from Intel's standard product compliance declarations.
