5CSEBA6U19A7N - Cyclone V SE SoC FPGA 110K LE | Intel
MPN: 5CSEBA6U19A7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $292.67 | $292.67 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245.2 | $24,520.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $198.4 | $198,400.00 |
Drop-in alternatives for 5CSEBA6U19A7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA5U19C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →5CSEBA5U19C8N
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View Datasheet →5CSEBA5U19A7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →5CSEBA6U19C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$155.29 / Unit
View Datasheet →5CSEBA6U19C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195 / Unit
View Datasheet →5CSEBA6U19A7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA6 (U19) |
| Logic Elements | 110,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | 700 MHz |
| Core Voltage | 1.1 V |
| Package | 484-pin UBGFA / UFBGA (19x19 mm) |
| Operating Temperature Grade | Automotive AEC-Q100 |
| Supply Form | Tray |
| Mounting Type | Surface Mount |
| FPGA Architecture | SRAM-based, low-power process |
| Memory Blocks | M10K + MLAB embedded memory |
| DSP Blocks | Variable-precision DSP |
| Peripherals | EMAC, USB, CAN, SPI, I2C, UART, NAND/NOR flash, DDR3 controller with ECC |
| RoHS Status | Compliant |
5CSEBA6U19A7N 484-pin ubgfa / ufbga (19x19 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA6U19A7N (484-pin ubgfa / ufbga (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA6U19A7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA6U19A7N is suitable for 6 applications: Industrial Machine Vision, Automotive Driver Assistance (ADAS), Motor Control and Robotics, Broadcast and Pro-AV Equipment, Factory Automation Controllers, Software-Defined Radio Baseband.
Industrial Machine Vision
The 5CSEBA6U19A7N is well suited for industrial machine vision because the dual ARM Cortex-A9 MPCore at 700 MHz runs Linux image-processing stacks and high-level protocols, while the 110K logic elements deliver deterministic, low-latency pre-processing pipelines for sensor data. The integrated DDR3 controller with ECC handles the high-bandwidth camera frame buffer, and the variable-precision DSP blocks accelerate convolution and filtering without CPU overhead. The AEC-Q100 temperature grade supports factory-floor deployments where ambient temperatures fluctuate widely. Place the device on a multi-layer PCB with short, impedance-matched DDR3 traces and isolate the HPS and FPGA supply domains for clean signal integrity.
Recommended
Automotive Driver Assistance (ADAS)
The 5CSEBA6U19A7N's AEC-Q100 automotive qualification, dual ARM Cortex-A9 HPS, and 110K LE fabric make it a fit for advanced driver assistance systems such as surround view, lane departure warning, and sensor fusion. The Cortex-A9 cores run the AUTOSAR or Linux middleware and Ethernet AVB stack for vehicle networking, while the FPGA fabric implements deterministic sensor pre-processing (radar FFT, lidar clustering, camera rectification) with microsecond latency. Automotive temperature range -40C to +125C ensures operation in cabin and engine-bay environments. Designers should use the Quartus Prime safety-critical design flow and review AN-718 for ASIL decomposition guidance.
Recommended
Motor Control and Robotics
The 5CSEBA6U19A7N combines the deterministic real-time performance of an FPGA fabric with the high-level motion-planning capability of the dual ARM Cortex-A9 HPS, ideal for multi-axis motor control and robotic arm controllers. The FPGA fabric implements field-oriented control (FOC) loops with sub-microsecond PWM update rates, while the HPS runs trajectory planning, inverse kinematics, and EtherCAT master stacks. On-chip peripherals (EMAC, SPI, UART, I2C) connect to absolute encoders, resolver-to-digital converters, and motor-driver gate drivers. The AEC-Q100 grade supports harsh industrial environments and the 700 MHz HPS provides sufficient throughput for multi-axis kinematic computations.
Recommended
Broadcast and Pro-AV Equipment
Broadcast video routers, switchers, and pro-AV signal processors benefit from the 5CSEBA6U19A7N's combination of high-speed FPGA fabric I/O and an embedded ARM subsystem for control and IP networking. The FPGA fabric handles real-time SDI/HDMI up-down-cross conversion and color-space transforms, while the Cortex-A9 HPS manages the IP-based control plane (NMOS IS-04/05, Dante, AES67). Integrated DDR3 with ECC enables large frame-buffer storage for video processing pipelines. The low-power Cyclone V process reduces thermal load in rack-mounted equipment compared with higher-end FPGA families.
Recommended
Factory Automation Controllers
Programmable Logic Controllers (PLCs) and PAC (Programmable Automation Controllers) built around the 5CSEBA6U19A7N integrate deterministic I/O scanning in the FPGA fabric with high-level application logic (ladder logic, structured text, motion profiles) on the dual Cortex-A9 HPS. The HPS runs CODESYS or similar IEC 61131-3 runtimes, while the FPGA implements fast input scan, pulse-train output, and direct control of industrial buses. Integrated Ethernet, USB, and CAN peripherals reduce the need for external bridge ICs, lowering BOM cost. The AEC-Q100 grade and industrial temperature range suit control cabinets with elevated ambient temperatures.
Recommended
Software-Defined Radio Baseband
Software-defined radio platforms benefit from the 5CSEBA6U19A7N's high DSP block count in the FPGA fabric, which can implement baseband modulation, demodulation, channel coding, and FFT pipelines for LTE, WiMAX, or proprietary waveforms. The dual ARM Cortex-A9 MPCore runs the protocol stack, packet processing, and network-side applications. The DDR3 controller with ECC supports high-bandwidth sample buffering for wideband receivers. The combination of deterministic FPGA latency and Linux-capable HPS in a single device eliminates the inter-chip communication bottleneck common in two-chip SDR architectures.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA6U19A7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA5U19C7N | 5CSEBA5U19C8N | 5CSEBA5U19A7N | 5CSEBA6U19C7N |
|---|---|---|---|---|---|
| Package | 484-pin UBGFA / UFBGA (U19, 19x19 mm) | 484-pin UBGFA / UFBGA (U19, 19x19 mm) - same | 484-pin UBGFA / UFBGA (U19, 19x19 mm) - same | 484-pin UBGFA / UFBGA (U19, 19x19 mm) - same | 484-pin UBGFA / UFBGA (U19, 19x19 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 110,000 | 85,000 (-23%) | 85,000 (-23%) | 85,000 (-23%) | 110,000 (same) |
| HPS Processor | Dual ARM Cortex-A9 700 MHz | Dual ARM Cortex-A9 [DATA_NEEDED: exact MHz] | Dual ARM Cortex-A9 [DATA_NEEDED: exact MHz] | Dual ARM Cortex-A9 700 MHz | Dual ARM Cortex-A9 [DATA_NEEDED: exact MHz] |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Temperature Grade | Automotive AEC-Q100 | Commercial | Commercial | Automotive AEC-Q100 | Commercial |
| Speed Grade | A7 (automotive, 7) | C7 | C8 | A7 | C7 |
| 1-piece Reference Price (USD) | ~$292.67 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Mid-density 110K logic elements with SoC HPS (vs 5CSEBA5U19A7N (85K LE, automotive))
- Automotive AEC-Q100 qualification (vs 5CSEBA6U19C7N (commercial grade))
- Lower power vs higher-end SoC FPGAs (vs Xilinx Zynq-7000 family)
Design Notes
The 5CSEBA6U19A7N requires multiple independent supply rails: VCCINT (1.1 V core), VCCAUX/VCCA_FPLL (2.5 V), VCCPD (3.0 V), VCCIO (1.2-3.3 V per bank), and dedicated HPS supplies (VCC_HPS, VCC_HPS_IO, VCC_HPS_PLL). Power-on sequencing must follow the order specified in the Cyclone V Device Handbook - typically VCCIO/VCCPD before VCCINT - to avoid latch-up. Use the Intel Enpirion power-family EN63A0QA or equivalent high-efficiency buck converters for VCCINT, and place input/output bulk capacitors within 100 mils of each pin pair.
Estimated: at typical industrial ambient of 55 C, full 110K LE utilization, 80% toggle rate, and DDR3 active on the HPS, the device can dissipate approximately 4-6 W. The UBGFA package requires a thermal pad on the PCB for heat spreading. Use 2 oz copper and a 4-layer stackup with continuous inner ground planes to keep theta_JA below 15 C/W. For enclosed enclosures with limited airflow, consider a small heatsink or thermal interface material bonded to a chassis wall.
Use at least a 4-layer PCB with a dedicated ground plane beneath the BGA to control return paths. Route DDR3 traces to the HPS at 50-ohm single-ended impedance, matched within +/-25 mils, with length-matched DQS-to-DQ skew under 20 ps. Keep high-speed FPGA fabric I/O (LVDS, DDR3 user interfaces) routed on the opposite side of the board from HPS DDR3 to minimize crosstalk. The 484-ball UBGFA footprint requires 0.8 mm or 1.0 mm pitch BGA fanout - confirm the exact pitch from the package datasheet before final layout.
Do not assume the 5CSEBA6U19A7N and 5CSEBA6U23A7N are drop-in compatible - they share the silicon family but use different BGA packages (U19 vs U23) with non-identical ball maps. Also confirm the HPS boot configuration: the device boots from flash via SD/MMC, NAND, or QSPI depending on MSEL pin strapping. Misconfigured MSEL pins are a common cause of 'no boot' debug sessions. Always validate the configuration image in JTAG mode before committing to flash programming.
Compliance Information
AEC-Q100 qualified per the 'A' designator in the OPN. RoHS and REACH compliance status carried over from Intel / Altera Cyclone V product family declarations.
