A3P600-2FGG484I - ProASIC3 FPGA 600K 235 I/O | Microchip
料号： A3P600-2FGG484I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $42.6 | $42.60 |
| 10 | $39.5 | $395.00 |
| 100 | $36.2 | $3,620.00 |
| 500 | $34 | $17,000.00 |
| 1,000 | $31.8 | $31,800.00 |
A3P600-2FGG484I 概述
A flash-based FPGA is a type of programmable logic device that stores its configuration in on-chip non-volatile flash memory rather than the volatile SRAM used by most FPGA architectures. Within the programmable logic hierarchy, the ProASIC3 family sits as a mid-density, single-chip solution: FPGA -> flash FPGA -> programmable logic device -> semiconductor. Because configuration data is stored on-chip, ProASIC3 devices need no external configuration PROM, reduce bill-of-materials cost, and offer instant-on operation at power-up with inherent resistance to configuration corruption.
Key features include single-chip, low total-cost-of-ownership operation, reprogrammability in-system, support for low-power modes, and a rich I/O capability of 235 user I/Os in the 484-ball package. The device contains 110592 bits of on-chip resources as listed in distributor data, and the ProASIC3 fabric supports common single-ended and differential I/O standards for system integration.
Architecturally, the ProASIC3 fabric is built from a sea-of-gates array of versatile logic elements with flash switches, so no configuration loading time or volatile configuration memory is required. Microchip (formerly Microsemi and Actel) documents in its migration application note that A3P600 devices use four I/O banks with dedicated VCCIBx bank supplies, allowing only electrically compatible I/O standards to share a bank.
Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace subsystems, and test equipment, where instant-on, secure, single-chip programmable logic is valued.
A key design consideration is I/O bank planning: assign I/O standards to banks by voltage compatibility before floorplanning, since VCCIBx supplies are bank-specific.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3P600-2FGG484I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3P600-2FGG484I （相同外形与封装尺寸） ——差异在于 Configuration Memory, Package, Technology, Core Supply Voltage, Core Voltage.
快速对比工具——选择替代料号进行并排对比：
A3P600L-FGG484I
✅ 直接替换✓ 有现货
$41.35 / 个
查看数据手册 →A3P600-1FGG484
✅ 直接替换✓ 有现货
$52.4 / 个
查看数据手册 →A3P600L-FG484I
✅ 直接替换✓ 有现货
$45.6 / 个
查看数据手册 →A3P600L-1FGG484I
✅ 直接替换✓ 有现货
$17.1 / 个
查看数据手册 →A3P1000-2FGG484M
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$75.44 / 个
查看数据手册 →A3P1000L-1FGG484I
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$28.8 / 个
查看数据手册 →A3P600-2FGG484I 最大额定值与电气特性
| Family | ProASIC3 |
| System Gates | 600000 |
| User I/O | 235 |
| On-chip Resource Bits | 110592 |
| Speed Grade | -2 (25% faster than standard) |
| 封装 | 484-BGA (FGG484) |
| 安装类型 | Surface Mount |
| Configuration Memory | Flash (non-volatile, single-chip) |
| 工作温度 | -40C to +100C (industrial, I suffix) |
| I/O Banks | 4 (dedicated VCCIBx per bank) |
| Reprogrammability | Yes, in-system |
| Lead Free | Yes (per PCB Electronics: LEAD FREE) |
| Architecture | CMOS flash-based FPGA sea-of-gates |
A3P600-2FGG484I 484-bga (fgg484) 引脚配置指南
A3P600-2FGG484I（484-bga (fgg484) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3P600-2FGG484I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3P600-2FGG484I 适用于 6 应用s: Industrial Automation Controllers, Communications and Networking Line Cards, Medical Instrumentation, Aerospace and Defense Subsystems, Test and Measurement Equipment, Secure Embedded Control Systems.
Industrial Automation Controllers
The A3P600-2FGG484I fits industrial PLC and motor-control interface logic because its 600K-gate flash fabric integrates glue logic, encoder interfaces, and safety interlocks in a single non-volatile chip. The -2 speed grade provides 25% faster timing than standard, supporting multi-MHz control loops, while the industrial -40C to +100C rating covers factory-floor temperature extremes. Because configuration lives in on-chip flash, the controller powers up functional immediately after a brown-out with no boot sequence from external memory. Its 235 user I/Os across four voltage banks let 3.3V field sensors and 2.5V backplane signals coexist on one device, reducing board layer count and total system cost.
推荐
Communications and Networking Line Cards
In networking line cards, the A3P600-2FGG484I implements backplane interface bridging, framing logic, and status aggregation where instant-on operation matters: the flash-based fabric is active within microseconds of power application, unlike SRAM FPGAs that wait for bitstream loading. The -2 speed grade gives timing headroom for parallel bus interfaces, and 235 user I/Os handle wide parallel data paths to PHYs and framers. The four I/O banks with dedicated VCCIBx supplies allow mixing 3.3V management and 2.5V data interfaces without level shifters. The industrial temperature rating suits uncooled telecom remotes, and the single-chip design eliminates configuration PROM failures - a known field-reliability issue in SRAM-based line-card designs.
推荐
Medical Instrumentation
Medical diagnostic devices benefit from the A3P600-2FGG484I's deterministic instant-on behavior and single-chip security profile. Sensor front-end sequencing, filter control, and display interface logic fit comfortably in the 600K-gate fabric, while the 110592-bit on-chip resource pool supports small lookup tables and calibration constants in non-volatile storage. Because the configuration is in on-chip flash rather than an external PROM, the design reduces component count in sterilizable, space-constrained probe heads. The -2 speed grade supports real-time signal path control at microsecond latencies. Designers should verify IEC 60601 isolation architecture at board level, assigning the FPGA's I/O banks to match the isolation barrier voltage plan.
推荐
Aerospace and Defense Subsystems
Flash-based ProASIC3 devices were widely adopted in aerospace payloads and avionics because the non-volatile configuration is inherently resistant to configuration upset compared with SRAM FPGAs, and no configuration readback exposes the bitstream. The A3P600-2FGG484I's industrial -40C to +100C range supports many airborne and ground-segment environments, and its -2 speed grade provides the timing margin needed for telemetry formatting and bus bridging. The 235 user I/Os handle redundant MIL-STD-style parallel interfaces, and the four-bank voltage architecture simplifies mixed-voltage subsystem integration. For higher-reliability screening requirements, consult Microchip for aerospace-grade ordering options of the same ProASIC3 die.
推荐
Test and Measurement Equipment
Bench and automated test instruments use the A3P600-2FGG484I for channel sequencing, trigger logic, and instrument bus interfacing. The 600K-gate fabric absorbs timer/counter arrays and protocol generators, while the -2 speed grade (25% faster than standard) supports ns-class trigger timing. The 235 user I/Os enable dense per-channel control across switch matrices and relays, and instant-on flash configuration means the instrument is ready the moment power is applied - valuable in rack systems that are power-cycled frequently. The industrial temperature range suits production-floor environments, and the single-chip design improves mean-time-between-failures by removing the external configuration PROM from the reliability calculation.
推荐
Secure Embedded Control Systems
Applications requiring design IP protection - smart meters, access control, proprietary motion systems - choose the A3P600-2FGG484I because flash FPGAs do not require exposing the bitstream to external memory, and Microchip ProASIC3 devices provide on-chip flash lock security features. The 600K-gate fabric implements control state machines plus cryptographic helper logic, while the 110592-bit resource pool stores key material and tables on-chip. The -40C to +100C industrial range and low total cost of ownership (single-chip, no PROM) suit high-volume deployed products. Designers should enable the flash security lock in Libero SoC during programming and plan I/O bank voltages around the fixed supply architecture.
推荐
推荐产品汇总
工程参考数据： A3P600-2FGG484I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3P600L-FGG484I | A3P600-1FGG484 | A3P1000-2FGG484M | A3P1000L-1FGG484I |
|---|---|---|---|---|---|
| Package | 484-BGA (FGG484) | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 1000000 | 1000000 |
| Configuration Memory | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash | On-chip Flash |
| Power Profile | Standard | Low power (L variant) | Standard | Standard | Low power (L variant) |
关键差异点
- Fastest standard-family speed grade （对比 A3P600-1FGG484)
- Lower static power option exists without footprint change （对比 A3P600L-FGG484I)
- Right-sized density vs same-footprint A3P1000 （对比 A3P1000-2FGG484M)
设计说明
Power the FPGA core and I/O banks from separate regulators with independent sequencing control. Per Microchip's migration application note, the A3P600 has four I/O banks, each with a dedicated VCCIBx supply - bank voltages must match the I/O standards assigned to that bank. Estimated: with 235 I/Os switching, allocate I/O supply current budget per bank rather than globally, and place 100 nF ceramic decoupling per bank supply pin pair plus bulk 10 uF per bank.
The 484-ball BGA requires a minimum 6-layer PCB with signal layers routed to all four BGA quadrants. Use via-in-pad or dog-bone escape for the inner ball rows, and define the land pattern per the Microchip FGG484 package drawing. Plan bank voltage domains in the schematic BEFORE pin assignment: moving an I/O across banks after layout forces a respin. Reserve at least 15% unassigned I/Os per bank for late design changes.
Do not assume cross-family migration is automatic: A3P600 and A3P1000 share the FG484 footprint and four-bank architecture per Microchip's migration note, but pin functions within banks can differ, so re-run the migration checker in Libero SoC and re-verify I/O bank compatibility before adopting an A3P1000 drop-in. Also confirm speed grade timing: replacing -2 with -1 gives up ~10% performance margin.
合规信息
PCB Electronics Supply Chain lists A3P600-2FGG484I as LEAD FREE. FGG package suffix denotes Pb-free ball metallurgy in Microchip/Microsemi nomenclature. Formal RoHS/REACH certificates not present in retrieved data - request CoC from Microchip.
