A3P600-FGG144 - 600K-Gate ProASIC3 Flash FPGA | Microchip
料号： A3P600-FGG144 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $58.9 | $5,890.00 |
| 500 | $54.1 | $27,050.00 |
| 1,000 | $49.8 | $49,800.00 |
A3P600-FGG144 概述
A flash-based FPGA (field-programmable gate array) stores its configuration in on-chip flash cells rather than SRAM, eliminating the need for an external boot PROM and greatly improving design security. Within the programmable logic hierarchy, the A3P600 sits in the mid-density tier of the ProASIC3 family, above the A3P250 and below the A3P1000, and belongs to the broader category of programmable logic devices that also includes CPLDs and antifuse FPGAs.
Key features include nonvolatile flash programming for a true single-chip solution, reprogrammability with no external configuration device, low total cost of ownership as highlighted by Microchip, and a compact 144-ball footprint with 1.00 mm ball pitch suitable for surface-mount assembly. The device provides 97 usable I/Os distributed across four I/O banks whose VCCIBx supplies are bank-independent, allowing mixed-voltage I/O standards on one package.
Architecturally, the ProASIC3 fabric consists of VersaTiles implementing sequential or combinable logic, supported by embedded flash blocks for on-chip nonvolatile storage. Optional soft ARM capability in the family enables embedded processor designs on the same fabric. CMOS flash technology yields low static power versus SRAM FPGAs of similar density.
Typical applications include industrial control, motor drive interface logic, bridging and glue logic consolidation, secure single-chip designs where bitstream theft is a concern, and portable or battery-powered systems benefiting from low standby power.
Design consideration: assign I/Os bank-aware, since only I/Os with compatible voltage standards may share a VCCIBx bank, per the Microchip migration application note.
This page synthesizes distributor pricing, drop-in same-package alternatives from the ProASIC3 family, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3P600-FGG144 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3P600-FGG144 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Configuration, Process Technology, Family.
快速对比工具——选择替代料号进行并排对比：
A3P600-FGG144I
✅ 直接替换✓ 有现货
$27.2 / 个
查看数据手册 →A3P600-2FGG144
✅ 直接替换✓ 有现货
$30.4 / 个
查看数据手册 →A3P600-2FGG144I
✅ 直接替换✓ 有现货
$44.6 / 个
查看数据手册 →A3P600L-FGG144
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3P600L-FGG144I
✅ 直接替换✓ 有现货
$33.95 / 个
查看数据手册 →A3P600-1FGG144Y
✅ 直接替换📋 参考替代料（不在目录中）
A3P600-FGG144 最大额定值与电气特性
| System Gates | 600000 gates |
| Logic Cells (CLBs) | 13824 CLBs |
| User I/O | 97 |
| Configuration Memory | 110592 bits |
| Technology | CMOS flash-based FPGA, nonvolatile |
| Family | ProASIC3 (Actel/Microchip) |
| 封装 | 144-FBGA / 144-LBGA (FGG144) |
| Ball Pitch | 1.00 mm |
| 安装类型 | Surface Mount |
| Maximum Frequency | 350 MHz (per distributor listing) |
| I/O Banks | 4 (A3P1000/A3P600/A3P400) |
| Speed Grade Designation | Standard (unmarked suffix in MPN) |
| Temperature Grade | Commercial (I suffix denotes industrial -40C to +100C) |
| Configuration | Instant-On, single-chip, no external boot device |
A3P600-FGG144 144-fbga / 144-lbga (fgg144) 引脚配置指南
A3P600-FGG144（144-fbga / 144-lbga (fgg144) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3P600-FGG144.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3P600-FGG144 适用于 6 应用s: Industrial Control and Automation, Secure Single-Chip Designs, Glue Logic Consolidation, Motor Drive and Motion Interface, Portable and Low-Power Systems, Communications Bridging and Backplane Interface.
Industrial Control and Automation
The A3P600-FGG144 fits industrial control well because its 97 user I/Os across four independently supplied VCCIBx banks let one chip interface 3.3V sensors, 2.5V transceivers, and 1.8V logic simultaneously. The 600K-gate fabric (13,824 CLBs) absorbs state machines, encoders, and protocol bridging that would otherwise need several ASSPs, cutting BOM count. Its flash configuration survives the power interruptions common on factory floors - the design reconfigures Instant-On with no boot PROM, so a machine restarts without a configuration reload sequence. Place the FPGA between a PLC backplane and local actuators with decoupling per bank; the trade-off versus an MCU is lower per-pin drive configurability, so check datasheet I/O standards per bank before pin assignment.
推荐
Secure Single-Chip Designs
For designs where bitstream theft or cloning is a concern, the A3P600-FGG144 is a strong choice: its configuration resides in on-chip nonvolatile flash, so the bitstream never traverses an external bus as it must on SRAM FPGAs that load from a boot PROM. The 600K gates and 97 I/Os are sufficient to consolidate proprietary glue logic, encryption wrappers, and board-level security functions into one package, and the 144-FBGA footprint keeps the physical attack surface small on a 1.00 mm-pitch assembly. Instant-On startup also removes the window during which an SRAM FPGA sits unconfigured. The trade-off is that flash FPGAs of this generation lack modern crypto-boot features, so threat models requiring authenticated updates should consider newer Microchip PolarFire families.
推荐
Glue Logic Consolidation
The A3P600-FGG144 replaces dozens of 7400-series parts, PALs, and CPLDs with a single 600K-gate flash FPGA, reducing board area, inventory lines, and rework cost - Microchip markets this as low total cost of ownership (TOC). With 97 I/Os and four voltage banks, address decoding, bus bridging, and interface translation between legacy 5V-tolerant-adjacent standards and modern 1.8V logic can coexist in one 144-FBGA package. Because the device is reprogrammable in-system, late ECOs that once demanded a PCB respin become a firmware update. Estimated benefit: consolidating 20-40 small logic ICs typically saves 30-50% of the associated board area, though the 1.00 mm-pitch BGA requires at least a six-layer board for breakout, unlike through-hole glue logic.
推荐
Motor Drive and Motion Interface
Motor-drive systems need deterministic parallel handling of PWM inputs, encoder quadrature decoding, and fault interlocks - tasks where the A3P600-FGG144's fabric excels because each of its 13,824 CLBs operates without software scheduling jitter. The 97 user I/Os let one chip capture multiple encoder channels, generate PWM gate commands, and implement hardware-based dead-time and brake interlocks, while the four VCCIBx banks bridge 3.3V controller logic to isolated gate-driver front ends. Flash configuration means the drive is operational within microseconds of power-up, satisfying safety requirements for immediate enable/disable states. The limitation versus dedicated motor SoCs is the absence of hardware DSP multiply-accumulate blocks of newer families, so implement control-loop math carefully within the fabric.
推荐
Portable and Low-Power Systems
CMOS flash technology gives the A3P600-FGG144 low static power compared with same-density SRAM FPGAs, and the elimination of the external configuration flash further reduces system standby draw - valuable in portable instruments and battery-backed data loggers. The compact 144-FBGA (about 1.00 mm pitch) suits dense portable PCBs, and Instant-On behavior lets the system capture events immediately after wake. For maximum power savings, pair the standard part with the A3P600L-FGG144 low-power core variant in the same footprint, which allows a power-optimized second source without PCB change. Estimated: battery-powered designs should budget total power from the datasheet power calculator, since fabric utilization dominates dynamic draw more than the package choice.
推荐
Communications Bridging and Backplane Interface
The A3P600-FGG144 serves as a bridge FPGA between communication backplanes and local processing: 97 I/Os in four banks support mixed-voltage line-card interfaces, and 600K gates implement parallel-to-serial framers, status aggregation, and hot-swap control logic. Distributor listings cite operation up to 350 MHz, adequate for wide parallel buses and fast status multiplexing. Because configuration is nonvolatile, a blade regains its bridge function instantly on insertion or restart without waiting for configuration from a host - an operational advantage over SRAM FPGA bridges on shared power domains. Design consideration: honor the Microchip migration note that only I/Os with compatible voltage standards share a bank, so plan backplane signaling standards before pinning out the 144 balls.
推荐
推荐产品汇总
工程参考数据： A3P600-FGG144 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3P600-FGG144I | A3P600-2FGG144 | A3P600L-FGG144 |
|---|---|---|---|---|
| Package | 144-FBGA (FGG144) | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 |
| CLBs | 13824 | 13824 | 13824 | 13824 |
| User I/O | 97 | 97 | 97 | 97 |
| Speed Grade | Standard | Standard | -2 (faster) | Standard (low-power core) |
| Temperature Grade | Commercial | Industrial (I suffix) | Commercial | Commercial |
| Core Supply | Standard core voltage | Standard core voltage | Standard core voltage | Low-power core voltage (L) |
| Configuration | On-chip flash, Instant-On | On-chip flash, Instant-On | On-chip flash, Instant-On | On-chip flash, Instant-On |
关键差异点
- Industrial temperature option in identical footprint （对比 A3P600-FGG144I)
- Faster timing margin available without PCB change （对比 A3P600-2FGG144)
- Standard core voltage for legacy boards （对比 A3P600L-FGG144)
设计说明
The A3P600 has four I/O banks, each with dedicated VCCIBx supplies; per the Microchip migration application note (a3p1000_migration_hbs), only I/Os with compatible voltage standards may be assigned to the same bank. Plan your bank voltage map (e.g., 3.3V bank for backplane, 2.5V bank for memory, 1.8V bank for high-speed I/O) before pin assignment in Libero IDE, because re-banking late in layout can force a pinout respin. Decouple each VCCIBx bank independently with bulk plus 0.1uF ceramic capacitors at the 144-FBGA balls.
The 144-FBGA with 1.00 mm ball pitch requires controlled-impedance breakout; a six-layer stack (signal-GND-signal-PWR-signal-signal or similar) is a practical minimum to escape inner balls without via-in-pad on every net. Keep core and I/O power planes split cleanly and avoid routing fast signals across plane splits. BGA rework on 1.00 mm pitch is feasible but costly - verify ball-out against the ProASIC3 datasheet package table before fabrication.
Do not confuse suffix semantics: FGG144I is the industrial temperature grade, the -1/-2 digits are speed grades, and the L in A3P600L denotes a different core supply voltage. Ordering an L variant for a standard-core board will leave the fabric unpowered or over-stressed. Also, ProASIC3 devices are flash-based and need no configuration PROM, but JTAG programming voltage and programmer (Microchip Libero toolchain) must be provisioned on the board for field updates.
合规信息
Compliance fields not stated in the provided web data for the base commercial MPN. Mouser lists the A3P600-FGG144I as lead free; verify per-order compliance certificates with the distributor.
