A3P600-FGG144 - 600K-Gate ProASIC3 Flash FPGA | Microchip
MPN: A3P600-FGG144 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $58.9 | $5,890.00 |
| 500 | $54.1 | $27,050.00 |
| 1,000 | $49.8 | $49,800.00 |
Drop-in alternatives for A3P600-FGG144 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600-FGG144I
✅ Drop-In✓ In Stock
$27.2 / Unit
View Datasheet →A3P600-2FGG144
✅ Drop-In✓ In Stock
$30.4 / Unit
View Datasheet →A3P600-2FGG144I
✅ Drop-In✓ In Stock
$44.6 / Unit
View Datasheet →A3P600L-FGG144
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3P600L-FGG144I
✅ Drop-In✓ In Stock
$33.95 / Unit
View Datasheet →A3P600-1FGG144Y
✅ Drop-In📋 Reference alternative (not in catalog)
A3P600-FGG144 Maximum Ratings & Electrical Characteristics
| System Gates | 600000 gates |
| Logic Cells (CLBs) | 13824 CLBs |
| User I/O | 97 |
| Configuration Memory | 110592 bits |
| Technology | CMOS flash-based FPGA, nonvolatile |
| Family | ProASIC3 (Actel/Microchip) |
| Package | 144-FBGA / 144-LBGA (FGG144) |
| Ball Pitch | 1.00 mm |
| Mounting Type | Surface Mount |
| Maximum Frequency | 350 MHz (per distributor listing) |
| I/O Banks | 4 (A3P1000/A3P600/A3P400) |
| Speed Grade Designation | Standard (unmarked suffix in MPN) |
| Temperature Grade | Commercial (I suffix denotes industrial -40C to +100C) |
| Configuration | Instant-On, single-chip, no external boot device |
A3P600-FGG144 144-fbga / 144-lbga (fgg144) Pin Configuration Guide
Complete pinout information for A3P600-FGG144 (144-fbga / 144-lbga (fgg144) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600-FGG144.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-FGG144 is suitable for 6 applications: Industrial Control and Automation, Secure Single-Chip Designs, Glue Logic Consolidation, Motor Drive and Motion Interface, Portable and Low-Power Systems, Communications Bridging and Backplane Interface.
Industrial Control and Automation
The A3P600-FGG144 fits industrial control well because its 97 user I/Os across four independently supplied VCCIBx banks let one chip interface 3.3V sensors, 2.5V transceivers, and 1.8V logic simultaneously. The 600K-gate fabric (13,824 CLBs) absorbs state machines, encoders, and protocol bridging that would otherwise need several ASSPs, cutting BOM count. Its flash configuration survives the power interruptions common on factory floors - the design reconfigures Instant-On with no boot PROM, so a machine restarts without a configuration reload sequence. Place the FPGA between a PLC backplane and local actuators with decoupling per bank; the trade-off versus an MCU is lower per-pin drive configurability, so check datasheet I/O standards per bank before pin assignment.
Recommended
Secure Single-Chip Designs
For designs where bitstream theft or cloning is a concern, the A3P600-FGG144 is a strong choice: its configuration resides in on-chip nonvolatile flash, so the bitstream never traverses an external bus as it must on SRAM FPGAs that load from a boot PROM. The 600K gates and 97 I/Os are sufficient to consolidate proprietary glue logic, encryption wrappers, and board-level security functions into one package, and the 144-FBGA footprint keeps the physical attack surface small on a 1.00 mm-pitch assembly. Instant-On startup also removes the window during which an SRAM FPGA sits unconfigured. The trade-off is that flash FPGAs of this generation lack modern crypto-boot features, so threat models requiring authenticated updates should consider newer Microchip PolarFire families.
Recommended
Glue Logic Consolidation
The A3P600-FGG144 replaces dozens of 7400-series parts, PALs, and CPLDs with a single 600K-gate flash FPGA, reducing board area, inventory lines, and rework cost - Microchip markets this as low total cost of ownership (TOC). With 97 I/Os and four voltage banks, address decoding, bus bridging, and interface translation between legacy 5V-tolerant-adjacent standards and modern 1.8V logic can coexist in one 144-FBGA package. Because the device is reprogrammable in-system, late ECOs that once demanded a PCB respin become a firmware update. Estimated benefit: consolidating 20-40 small logic ICs typically saves 30-50% of the associated board area, though the 1.00 mm-pitch BGA requires at least a six-layer board for breakout, unlike through-hole glue logic.
Recommended
Motor Drive and Motion Interface
Motor-drive systems need deterministic parallel handling of PWM inputs, encoder quadrature decoding, and fault interlocks - tasks where the A3P600-FGG144's fabric excels because each of its 13,824 CLBs operates without software scheduling jitter. The 97 user I/Os let one chip capture multiple encoder channels, generate PWM gate commands, and implement hardware-based dead-time and brake interlocks, while the four VCCIBx banks bridge 3.3V controller logic to isolated gate-driver front ends. Flash configuration means the drive is operational within microseconds of power-up, satisfying safety requirements for immediate enable/disable states. The limitation versus dedicated motor SoCs is the absence of hardware DSP multiply-accumulate blocks of newer families, so implement control-loop math carefully within the fabric.
Recommended
Portable and Low-Power Systems
CMOS flash technology gives the A3P600-FGG144 low static power compared with same-density SRAM FPGAs, and the elimination of the external configuration flash further reduces system standby draw - valuable in portable instruments and battery-backed data loggers. The compact 144-FBGA (about 1.00 mm pitch) suits dense portable PCBs, and Instant-On behavior lets the system capture events immediately after wake. For maximum power savings, pair the standard part with the A3P600L-FGG144 low-power core variant in the same footprint, which allows a power-optimized second source without PCB change. Estimated: battery-powered designs should budget total power from the datasheet power calculator, since fabric utilization dominates dynamic draw more than the package choice.
Recommended
Communications Bridging and Backplane Interface
The A3P600-FGG144 serves as a bridge FPGA between communication backplanes and local processing: 97 I/Os in four banks support mixed-voltage line-card interfaces, and 600K gates implement parallel-to-serial framers, status aggregation, and hot-swap control logic. Distributor listings cite operation up to 350 MHz, adequate for wide parallel buses and fast status multiplexing. Because configuration is nonvolatile, a blade regains its bridge function instantly on insertion or restart without waiting for configuration from a host - an operational advantage over SRAM FPGA bridges on shared power domains. Design consideration: honor the Microchip migration note that only I/Os with compatible voltage standards share a bank, so plan backplane signaling standards before pinning out the 144 balls.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-FGG144 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-FGG144I | A3P600-2FGG144 | A3P600L-FGG144 |
|---|---|---|---|---|
| Package | 144-FBGA (FGG144) | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same | 144-FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 |
| CLBs | 13824 | 13824 | 13824 | 13824 |
| User I/O | 97 | 97 | 97 | 97 |
| Speed Grade | Standard | Standard | -2 (faster) | Standard (low-power core) |
| Temperature Grade | Commercial | Industrial (I suffix) | Commercial | Commercial |
| Core Supply | Standard core voltage | Standard core voltage | Standard core voltage | Low-power core voltage (L) |
| Configuration | On-chip flash, Instant-On | On-chip flash, Instant-On | On-chip flash, Instant-On | On-chip flash, Instant-On |
Key Differentiators
- Industrial temperature option in identical footprint (vs A3P600-FGG144I)
- Faster timing margin available without PCB change (vs A3P600-2FGG144)
- Standard core voltage for legacy boards (vs A3P600L-FGG144)
Design Notes
The A3P600 has four I/O banks, each with dedicated VCCIBx supplies; per the Microchip migration application note (a3p1000_migration_hbs), only I/Os with compatible voltage standards may be assigned to the same bank. Plan your bank voltage map (e.g., 3.3V bank for backplane, 2.5V bank for memory, 1.8V bank for high-speed I/O) before pin assignment in Libero IDE, because re-banking late in layout can force a pinout respin. Decouple each VCCIBx bank independently with bulk plus 0.1uF ceramic capacitors at the 144-FBGA balls.
The 144-FBGA with 1.00 mm ball pitch requires controlled-impedance breakout; a six-layer stack (signal-GND-signal-PWR-signal-signal or similar) is a practical minimum to escape inner balls without via-in-pad on every net. Keep core and I/O power planes split cleanly and avoid routing fast signals across plane splits. BGA rework on 1.00 mm pitch is feasible but costly - verify ball-out against the ProASIC3 datasheet package table before fabrication.
Do not confuse suffix semantics: FGG144I is the industrial temperature grade, the -1/-2 digits are speed grades, and the L in A3P600L denotes a different core supply voltage. Ordering an L variant for a standard-core board will leave the fabric unpowered or over-stressed. Also, ProASIC3 devices are flash-based and need no configuration PROM, but JTAG programming voltage and programmer (Microchip Libero toolchain) must be provisioned on the board for field updates.
Compliance Information
Compliance fields not stated in the provided web data for the base commercial MPN. Mouser lists the A3P600-FGG144I as lead free; verify per-order compliance certificates with the distributor.
