A3P600-FGG144I - 600K Gate ProASIC3 FPGA | Microchip
MPN: A3P600-FGG144I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $42.5 | $42.50 |
| 10 | $38.25 | $382.50 |
| 100 | $34 | $3,400.00 |
| 500 | $30.6 | $15,300.00 |
| 1,000 | $27.2 | $27,200.00 |
Drop-in alternatives for A3P600-FGG144I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P600L-FGG144I
β Drop-Inβ In Stock
$33.95 / Unit
View Datasheet βA3P600-FGG144
β Drop-Inβ In Stock
$49.8 / Unit
View Datasheet βA3P600-FGG256I
β Drop-Inβ In Stock
$96.23 / Unit
View Datasheet βA3P600L-1FGG144I
β Drop-Inβ In Stock
$59.8 / Unit
View Datasheet βA3P600L-FGG144
β Drop-Inβ In Stock
Contact for price
View Datasheet βA3P600-FGG144I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 600000 |
| Logic Modules (Tiles) | 13824 |
| RAM Bits | 110592 |
| User I/Os | 97 |
| Core Voltage | 1.5 V |
| Maximum System Performance | 231 MHz |
| Package | 144-pin FBGA (FGG144) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +100C (industrial) |
| Process Technology | 130nm flash |
| PLLs | 3 |
| I/O Standards | LVCMOS, LVTTL, PCI, etc. |
| RoHS Status | Compliant (lead-free) |
| Standard Package | 160 (tray) |
A3P600-FGG144I Pin Configuration
| Pin 1 | IO β User I/O pin |
| Pin 2 | IO β User I/O pin |
| Pin 3 | IO β User I/O pin |
| Pin 4 | IO β User I/O pin |
| Pin 5 | IO β User I/O pin |
| Pin 6 | IO β User I/O pin |
| Pin 7 | IO β User I/O pin |
| Pin 8 | IO β User I/O pin |
| Pin 9 | IO β User I/O pin |
| Pin 10 | IO β User I/O pin |
| Pin 11 | IO β User I/O pin |
| Pin 12 | IO β User I/O pin |
| Pin 13 | IO β User I/O pin |
| Pin 14 | IO β User I/O pin |
| Pin 15 | IO β User I/O pin |
| Pin 16 | IO β User I/O pin |
| Pin 17 | IO β User I/O pin |
| Pin 18 | IO β User I/O pin |
| Pin 19 | IO β User I/O pin |
| Pin 20 | IO β User I/O pin |
| Pin 21 | IO β User I/O pin |
| Pin 22 | IO β User I/O pin |
| Pin 23 | IO β User I/O pin |
| Pin 24 | IO β User I/O pin |
| Pin 25 | IO β User I/O pin |
| Pin 26 | IO β User I/O pin |
| Pin 27 | IO β User I/O pin |
| Pin 28 | IO β User I/O pin |
| Pin 29 | IO β User I/O pin |
| Pin 30 | IO β User I/O pin |
| Pin 31 | IO β User I/O pin |
| Pin 32 | IO β User I/O pin |
| Pin 33 | IO β User I/O pin |
| Pin 34 | IO β User I/O pin |
| Pin 35 | IO β User I/O pin |
| Pin 36 | IO β User I/O pin |
| Pin 37 | IO β User I/O pin |
| Pin 38 | IO β User I/O pin |
| Pin 39 | IO β User I/O pin |
| Pin 40 | IO β User I/O pin |
| Pin 41 | IO β User I/O pin |
| Pin 42 | IO β User I/O pin |
| Pin 43 | IO β User I/O pin |
| Pin 44 | IO β User I/O pin |
| Pin 45 | IO β User I/O pin |
| Pin 46 | IO β User I/O pin |
| Pin 47 | IO β User I/O pin |
| Pin 48 | IO β User I/O pin |
| Pin 49 | IO β User I/O pin |
| Pin 50 | IO β User I/O pin |
| Pin 51 | IO β User I/O pin |
| Pin 52 | IO β User I/O pin |
| Pin 53 | IO β User I/O pin |
| Pin 54 | IO β User I/O pin |
| Pin 55 | IO β User I/O pin |
| Pin 56 | IO β User I/O pin |
| Pin 57 | IO β User I/O pin |
| Pin 58 | IO β User I/O pin |
| Pin 59 | IO β User I/O pin |
| Pin 60 | IO β User I/O pin |
| Pin 61 | IO β User I/O pin |
| Pin 62 | IO β User I/O pin |
| Pin 63 | IO β User I/O pin |
| Pin 64 | IO β User I/O pin |
| Pin 65 | IO β User I/O pin |
| Pin 66 | IO β User I/O pin |
| Pin 67 | IO β User I/O pin |
| Pin 68 | IO β User I/O pin |
| Pin 69 | IO β User I/O pin |
| Pin 70 | IO β User I/O pin |
| Pin 71 | IO β User I/O pin |
| Pin 72 | IO β User I/O pin |
| Pin 73 | IO β User I/O pin |
| Pin 74 | IO β User I/O pin |
| Pin 75 | IO β User I/O pin |
| Pin 76 | IO β User I/O pin |
| Pin 77 | IO β User I/O pin |
| Pin 78 | IO β User I/O pin |
| Pin 79 | IO β User I/O pin |
| Pin 80 | IO β User I/O pin |
| Pin 81 | IO β User I/O pin |
| Pin 82 | IO β User I/O pin |
| Pin 83 | IO β User I/O pin |
| Pin 84 | IO β User I/O pin |
| Pin 85 | IO β User I/O pin |
| Pin 86 | IO β User I/O pin |
| Pin 87 | IO β User I/O pin |
| Pin 88 | IO β User I/O pin |
| Pin 89 | IO β User I/O pin |
| Pin 90 | IO β User I/O pin |
| Pin 91 | IO β User I/O pin |
| Pin 92 | IO β User I/O pin |
| Pin 93 | IO β User I/O pin |
| Pin 94 | IO β User I/O pin |
| Pin 95 | IO β User I/O pin |
| Pin 96 | IO β User I/O pin |
| Pin 97 | IO β User I/O pin |
| Pin 98 | VCC β Core power supply (1.5V) |
| Pin 99 | GND β Ground |
| Pin 100 | VCC β Core power supply (1.5V) |
| Pin 101 | GND β Ground |
| Pin 102 | VCC β Core power supply (1.5V) |
| Pin 103 | GND β Ground |
| Pin 104 | VCC β Core power supply (1.5V) |
| Pin 105 | GND β Ground |
| Pin 106 | VCC β Core power supply (1.5V) |
| Pin 107 | GND β Ground |
| Pin 108 | VCC β Core power supply (1.5V) |
| Pin 109 | GND β Ground |
| Pin 110 | VCC β Core power supply (1.5V) |
| Pin 111 | GND β Ground |
| Pin 112 | VCC β Core power supply (1.5V) |
| Pin 113 | GND β Ground |
| Pin 114 | VCC β Core power supply (1.5V) |
| Pin 115 | GND β Ground |
| Pin 116 | VCC β Core power supply (1.5V) |
| Pin 117 | GND β Ground |
| Pin 118 | VCC β Core power supply (1.5V) |
| Pin 119 | GND β Ground |
| Pin 120 | VCC β Core power supply (1.5V) |
| Pin 121 | GND β Ground |
| Pin 122 | VCC β Core power supply (1.5V) |
| Pin 123 | GND β Ground |
| Pin 124 | VCC β Core power supply (1.5V) |
| Pin 125 | GND β Ground |
| Pin 126 | VCC β Core power supply (1.5V) |
| Pin 127 | GND β Ground |
| Pin 128 | VCC β Core power supply (1.5V) |
| Pin 129 | GND β Ground |
| Pin 130 | VCC β Core power supply (1.5V) |
| Pin 131 | GND β Ground |
| Pin 132 | VCC β Core power supply (1.5V) |
| Pin 133 | GND β Ground |
| Pin 134 | VCC β Core power supply (1.5V) |
| Pin 135 | GND β Ground |
| Pin 136 | VCC β Core power supply (1.5V) |
| Pin 137 | GND β Ground |
| Pin 138 | VCC β Core power supply (1.5V) |
| Pin 139 | GND β Ground |
| Pin 140 | VCC β Core power supply (1.5V) |
| Pin 141 | GND β Ground |
| Pin 142 | VCC β Core power supply (1.5V) |
| Pin 143 | GND β Ground |
| Pin 144 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-FGG144I is suitable for 6 applications: Industrial Automation, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Electronics, IoT and Smart Home.
Industrial Automation
The A3P600-FGG144I is ideal for industrial automation due to its 600K gates, 97 I/Os, and 231 MHz performance, enabling real-time motor control, sensor interfacing, and PLC logic. Its flash-based architecture provides instant-on and high reliability in harsh environments. The device's low power consumption and wide temperature range (-40C to +100C) make it suitable for factory floor applications. With 110,592 bits of RAM, it can handle data buffering and state machines. The 3 PLLs support clock generation for various industrial protocols. Compared to SRAM-based FPGAs, the A3P600-FGG144I does not require external configuration memory, reducing BOM cost and board space. Its security features protect IP from unauthorized copying, which is critical in competitive industrial markets. The device can interface with sensors, actuators, and communication buses like EtherCAT and PROFIBUS. Overall, it provides a cost-effective, reliable solution for industrial control systems.
Recommended
Automotive Electronics
In automotive electronics, the A3P600-FGG144I supports infotainment, driver assistance, and body control modules. Its 600K gates and 97 I/Os allow implementation of CAN/LIN interfaces, sensor fusion, and display control. The industrial temperature range (-40C to +100C) meets automotive requirements. Flash-based configuration ensures instant-on for safety-critical functions like airbag control. The device's low power consumption reduces heat generation in enclosed spaces. With 3 PLLs, it can generate multiple clock domains for different subsystems. The A3P600-FGG144I's security features prevent unauthorized modifications, enhancing vehicle cybersecurity. Its 110,592 bits of RAM support data logging and buffering. The device is AEC-Q100 qualified? [DATA_NEEDED: AEC-Q100 qualification status]. However, its reliability and long-term availability make it a trusted choice for automotive designs. Compared to ASICs, it offers flexibility for design changes without respinning silicon.
Recommended
Communications Infrastructure
The A3P600-FGG144I is well-suited for communications infrastructure, including base stations, routers, and switches. Its 600K gates and 97 I/Os enable protocol processing, packet buffering, and interface bridging. The device supports various I/O standards like LVCMOS and LVTTL, facilitating connection to PHYs and MACs. With 110,592 bits of RAM, it can implement FIFOs and queues. The 3 PLLs provide clock synthesis for high-speed serial links. Flash-based configuration ensures secure and reliable operation in remote locations. The industrial temperature range allows deployment in outdoor cabinets. The device's low power consumption reduces cooling requirements. Compared to ASSPs, it offers customization for proprietary protocols. Its instant-on capability is crucial for rapid system startup. The A3P600-FGG144I can also handle protocol conversion between different standards, making it a versatile component in communication systems.
Recommended
Aerospace and Defense
The A3P600-FGG144I is designed for aerospace and defense applications due to its flash-based architecture, which provides immunity to single-event upsets (SEU) and instant-on capability. Its 600K gates and 97 I/Os support avionics data processing, flight control, and secure communications. The device operates over the industrial temperature range and is available in a lead-free package. Flash-based configuration is non-volatile, ensuring the design is retained even without power. The security features prevent reverse engineering, protecting sensitive IP. With 110,592 bits of RAM, it can handle telemetry data. The 3 PLLs generate stable clocks for critical systems. The A3P600-FGG144I's low power consumption is essential for space-constrained platforms. Compared to SRAM-based FPGAs, it does not require external configuration memory, reducing weight and complexity. Its reliability in radiation environments makes it a preferred choice for satellite and missile systems.
Recommended
Medical Electronics
In medical electronics, the A3P600-FGG144I is used in diagnostic imaging, patient monitoring, and therapeutic devices. Its 600K gates and 97 I/Os enable real-time signal processing, data acquisition, and control. The device's low power consumption is critical for battery-operated portable devices. Flash-based configuration provides instant-on and secure operation, essential for patient safety. The industrial temperature range ensures reliable performance in clinical environments. With 110,592 bits of RAM, it can buffer high-speed sensor data. The 3 PLLs generate precise clocks for analog-to-digital converters. The A3P600-FGG144I supports various I/O standards, interfacing with sensors and displays. Its security features protect patient data and device firmware. Compared to microcontrollers, it offers higher parallelism for real-time processing. The device's long-term availability is crucial for medical device certification. Overall, it provides a reliable and flexible platform for medical innovations.
Recommended
IoT and Smart Home
The A3P600-FGG144I is suitable for IoT and smart home applications, providing 600K gates for edge processing, protocol bridging, and sensor fusion. Its low power consumption is ideal for battery-powered devices. Flash-based configuration enables secure over-the-air updates. The device's 97 I/Os allow connection to various sensors and actuators. With 110,592 bits of RAM, it can handle data buffering and local decision-making. The 3 PLLs generate clocks for wireless transceivers. The industrial temperature range supports outdoor smart home devices. Compared to microcontrollers, it offers more logic resources for complex algorithms. The A3P600-FGG144I's instant-on capability ensures quick response to user commands. Its security features protect against hacking. The device can implement custom communication protocols for smart home ecosystems. Overall, it provides a flexible and secure platform for IoT innovation.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-FGG144I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600L-FGG144I | A3P600-FGG144 | A3P600-FGG256I | A3P600L-1FGG144I |
|---|---|---|---|---|---|
| Package | 144-pin FBGA (FGG144) | 144-pin FBGA (FGG144) - same | 144-pin FBGA (FGG144) - same | 256-pin FBGA (FGG256) - different | 144-pin FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 |
| User I/Os | 97 | 97 | 97 | 157 | 97 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Max System Performance | 231 MHz | 231 MHz | 231 MHz | 231 MHz | 231 MHz |
| Temperature Range | -40C to +100C | -40C to +100C | 0C to +85C | -40C to +100C | -40C to +100C |
Key Differentiators
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Industrial temperature range (vs A3P600-FGG144 (commercial))
- Low power consumption (vs A3P600-FGG144 (standard))
Design Notes
The A3P600-FGG144I requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple. Place 0.1uF and 10uF decoupling capacitors close to each VCC pin. The total core current depends on logic utilization and toggle rate; estimate using the Microchip power calculator. Ensure the power supply can handle peak current during configuration and operation.
For the 144-pin FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route I/O signals with controlled impedance if using high-speed interfaces. Follow the footprint and routing guidelines in the ProASIC3 datasheet. Use via-in-pad for the center ground pad if present. Keep trace lengths matched for differential pairs.
The A3P600-FGG144I's power dissipation depends on logic utilization and I/O activity. For high-density designs, ensure adequate airflow or a heatsink. The FBGA package has a thermal resistance of approximately [DATA_NEEDED: theta_JA] C/W. Estimate junction temperature using Tj = Ta + (theta_JA * P). Keep Tj below 125C for reliability.
Compliance Information
Lead-free per Mouser listing. RoHS compliant per product page. AEC-Q100 not applicable for FPGA.
