A3P600L-FG484 - ProASIC3L Low Power FPGA 600K Gates | Microchip
부품 번호: A3P600L-FG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $118.5 | $118.50 |
| 10 | $109.2 | $1,092.00 |
| 100 | $98.6 | $9,860.00 |
| 500 | $91.4 | $45,700.00 |
| 1,000 | $85.9 | $85,900.00 |
A3P600L-FG484 개요
A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) interconnected by programmable interconnects. Unlike SRAM-based FPGAs, the ProASIC3L family uses non-volatile flash technology, meaning the configuration is stored on-chip and no external boot flash or configuration controller is required - simplifying the bill of materials and improving system boot security. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and are used to implement digital logic, glue logic, interfaces, and accelerators.
Key features of the A3P600L include 110,592 bits of embedded flash RAM, a core supply range of 1.14 V to 1.575 V (1.2 V nominal), support for up to 350 MHz internal performance per the device family datasheet, and Microsemi Flash*Freeze technology that allows near-zero-power standby without losing state. The L-suffix denotes the low-power 1.2 V core variant of the ProASIC3 family, reducing static power significantly compared with the standard A3P600.
Architecturally, the device integrates VersTiles (fine-grained logic tiles), embedded block RAM, and I/O banks supporting multiple single-ended and differential standards. The flash-based fabric also provides inherent security advantages because the bitstream is not exposed at power-up, unlike SRAM FPGAs that download configuration from external memory.
Typical applications include portable and battery-powered instrumentation, industrial control, aerospace and defense subsystems, secure embedded controllers, and low-power bridging logic where single-chip, non-volatile configuration is valuable.
Design consideration: the verified distributor data lists RoHS status as non-compliant for this exact ordering code, so confirm environmental requirements and consider the lead-free FGG484 sibling where regulations demand it.
This page adds value beyond the datasheet by synthesizing distributor pricing tiers, drop-in family alternatives, package compatibility notes, and practical design guidance in one place.
드롭인 대체품: A3P600L-FG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P600L-FG484 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Supply Voltage, Family, System Gates, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P600L-FG484I
✅ 드롭인✓ 재고 있음
$45.6 / 개
데이터시트 보기 →A3P600L-FGG484I
✅ 드롭인✓ 재고 있음
$41.35 / 개
데이터시트 보기 →A3P600L-1FGG484I
✅ 드롭인✓ 재고 있음
$17.1 / 개
데이터시트 보기 →A3P1000-FG484M
✅ 드롭인✓ 재고 있음
$47.95 / 개
데이터시트 보기 →A3P1000-1FGG484T
✅ 드롭인✓ 재고 있음
$33.9 / 개
데이터시트 보기 →A3P1000-2FGG484M
✅ 드롭인✓ 재고 있음
$75.44 / 개
데이터시트 보기 →A3P600L-FG484 최대 정격 & 전기적 특성
| Family | ProASIC3L (Flash FPGAs) |
| System Gates | 600000 |
| Logic Cells / CLBs | 13824 |
| Total RAM Bits | 110592 |
| User I/Os | 235 |
| Core Supply Voltage | 1.14 V to 1.575 V |
| Max Operating Frequency | 350 MHz (family rating) |
| Technology | CMOS, non-volatile flash based |
| 패키지 | 484-FBGA (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0C to +85C (TJ) |
| Special Features | Flash*Freeze low-power standby technology |
| Configuration | Single-chip, on-chip flash (no external boot device) |
| Packaging | Tray |
| RoHS 상태 | Non-compliant (per Microchip USA listing) |
| Manufacturer Lead Time | 8 weeks |
| Product Status | Active |
A3P600L-FG484 484-fbga (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) 핀 구성 가이드
A3P600L-FG484(484-fbga (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3P600L-FG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3P600L-FG484 적합 용도: 6 애플리케이션s: Portable and Battery-Powered Instruments, Industrial Control and Automation, Secure Embedded Controllers, Aerospace and Defense Subsystems, Low-Power Bridge and Glue Logic, Test and Measurement Equipment.
Portable and Battery-Powered Instruments
The A3P600L-FG484 fits battery-powered instruments because its 1.2 V low-power core and Flash*Freeze technology cut static consumption dramatically versus 1.5 V ProASIC3 parts and SRAM FPGAs that must retain configuration continuously. With 600,000 gates, 13,824 logic cells, and 235 user I/Os, one device can integrate measurement sequencing, display interfacing, and sensor buses that would otherwise need several ASICs or microcontrollers. Flash*Freeze lets the design idle with state retained and wake in milliseconds for a spot measurement, which suits handheld test gear, portable medical analyzers, and field data loggers where duty cycling directly extends battery life.
추천
Industrial Control and Automation
In industrial controllers, the A3P600L-FG484 provides deterministic glue logic, machine-safe I/O expansion, and protocol bridging with 235 user I/Os - enough for parallel fieldbus interfaces, encoder channels, and multiple UART/SPI/I2C banks in one chip. The non-volatile flash configuration means the PLC or drive board powers up functional instantly with no external boot device, improving uptime and eliminating a common single point of failure. The 0C to +85C (TJ) commercial grade covers typical cabinet environments; for unheated outdoor panels specify the A3P600L-FG484I industrial variant, which shares the identical footprint and lets one PCB layout serve both temperature grades.
추천
Secure Embedded Controllers
Flash-based ProASIC3L devices are favored for secure embedded controllers because the bitstream never appears on an external bus: unlike SRAM FPGAs that download configuration at every power-up (an interception point), the A3P600L stores its configuration in on-chip flash and boots as a single chip. The 600,000-gate capacity implements custom encryption interfaces, tamper-response logic, and secure boot glue around a host processor. The 1.14 V to 1.575 V core tolerance eases power-supply design in racks with shared rails, and 110,592 embedded RAM bits buffer sensitive data on-chip rather than in external memory, shrinking the physical attack surface of point-of-sale terminals, access-control panels, and authentication modules.
추천
Aerospace and Defense Subsystems
ProASIC3L flash FPGAs have a long heritage in aerospace and defense payloads, avionics glue logic, and secure communications boards. The single-chip, non-volatile configuration reduces component count and improves reliability predictions compared to SRAM FPGA solutions requiring external configuration PROMs. The A3P600L-FG484's 484-FBGA offers abundant I/O for redundant bus interfaces (MIL-STD-style parallel links, ARINC-style channels implemented in logic), and Flash*Freeze supports duty-cycled satellite or UAV payloads. For flight programs, select the temperature-qualified variants of the same die and consult Microchip hi-rel flows; this commercial-grade MPN suits prototyping, lab validation, and ground equipment where 0C to +85C suffices.
추천
Low-Power Bridge and Glue Logic
Many modern boards must bridge legacy parallel interfaces to serial buses, or voltage domains between processor and peripherals. The A3P600L-FG484 handles this class of work with 13,824 logic cells - ample for bus translators, arbitration logic, FIFOs using the 110,592-bit embedded RAM, and timing adaptation up to the family's 350 MHz performance class. Because configuration is on-chip, a bridge implemented in this device appears live at power-up with no loader software, simplifying bring-up on mixed-vendor platforms. Its low 1.2 V core also keeps bridge quiescent power low in always-on infrastructure such as network line cards, storage backplanes, and test-fixture interfacing.
추천
Test and Measurement Equipment
Bench and rack instruments exploit the A3P600L-FG484 for timing generation, trigger logic, pattern generators, and data-path formatting. The 235 user I/Os enable dense channel counts for digital pattern capture, while the flash fabric supports field-updatable instrument personalities without external boot infrastructure. Family performance up to 350 MHz covers high-rate counting and data formatting, and the 484-FBGA's 1.0 mm pitch eases routing of wide buses on 8-12 layer instrument boards. Combined with precision analog front ends, one FPGA consolidates control-plane and data-plane logic, cutting BOM cost in oscilloscope front-end modules, logic analyzers, and automated test fixtures.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3P600L-FG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P600L-FG484I | A3P600L-FGG484I | A3P600L-1FGG484I | A3P1000-FG484M | A3P1000-2FGG484M |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (23 x 23 mm) | 484-FBGA - same | 484-FBGA (FGG) - same footprint | 484-FBGA (FGG) - same footprint | 484-FBGA - same | 484-FBGA (FGG) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 1000000 | 1000000 |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V low-power) | 1.14 V to 1.575 V (1.2 V) | 1.14 V to 1.575 V (1.2 V) | 1.14 V to 1.575 V (1.2 V) | 1.5 V core (standard family) | 1.5 V core (standard family) |
| Speed Grade | Standard | Standard | Standard | -1 (slower) | Standard | -2 (faster) |
| Flash*Freeze Technology | Yes | Yes (ProASIC3L) | Yes (ProASIC3L) | Yes (ProASIC3L) | No (standard ProASIC3) | No (standard ProASIC3) |
주요 차별점
- Low-power 1.2 V core with Flash*Freeze (vs A3P1000-FG484M)
- Identical footprint with industrial temperature option (vs A3P600L-FG484I)
- Lead-free compliance path without respin (vs A3P600L-FGG484I)
설계 노트
Power the 1.2 V core from a rail held within 1.14 V to 1.575 V under all load transients. The A3P600L differs from standard A3P600 parts (1.5 V core), so never swap the L and non-L parts on a fixed 1.5 V rail without re-verifying the regulator - doing so can exceed the low-power core rating. Sequence core, I/O, and auxiliary rails per the family datasheet power-up requirements, and use Flash*Freeze in duty-cycled systems to cut standby power while retaining state.
The 484-FBGA uses a 1.0 mm ball pitch on a 23 x 23 mm body. Use an via-in-pad or dog-bone breakout on at least a 10-layer board for 235 user I/Os, and dedicate solid planes for core and I/O bank returns. The exposed die requires the land pattern from the manufacturer's package drawing - do not rescale. For x-ray inspection and rework, follow BGA reflow profiles from IPC-recommended practice and confirm ball composition, since the FGG variants use lead-free balls with different reflow peak temperatures.
Three common mistakes: (1) ordering the base FG484 code when RoHS compliance is mandatory - the verified listing marks this exact MPN non-compliant, so specify FGG484 for lead-free builds; (2) assuming drop-in substitution across the family without checking the speed-grade suffix (-1 parts are slower, -2 parts faster) and temperature suffix (I = industrial); (3) ignoring I/O banking rules - assign standards per bank as documented in the ProASIC3L datasheet before pin-locking the design in Libero SoC.
Estimated: thermal performance of the 484-FBGA on a typical board is adequate for low-power ProASIC3L designs because the 1.2 V core reduces dynamic power roughly in proportion to V squared versus 1.5 V operation (about 36% less). Still, compute junction temperature as TJ = TA + P_total x theta_JA using the theta_JA value for your stackup from the family datasheet package chapter, and verify TJ stays within the 0C to +85C (TJ) commercial rating or choose the -I grade.
규정 준수 정보
Microchip USA listing states RoHS non-compliant for this exact ordering code; product status Active, packaging Tray, manufacturer lead time 8 weeks. Select FGG484 suffix variants for lead-free builds.
