A3P600L-FG484 - ProASIC3L Low Power FPGA 600K Gates | Microchip
MPN: A3P600L-FG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $118.5 | $118.50 |
| 10 | $109.2 | $1,092.00 |
| 100 | $98.6 | $9,860.00 |
| 500 | $91.4 | $45,700.00 |
| 1,000 | $85.9 | $85,900.00 |
Drop-in alternatives for A3P600L-FG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600L-FG484I
✅ Drop-In✓ In Stock
$45.6 / Unit
View Datasheet →A3P600L-FGG484I
✅ Drop-In✓ In Stock
$41.35 / Unit
View Datasheet →A3P600L-1FGG484I
✅ Drop-In✓ In Stock
$17.1 / Unit
View Datasheet →A3P1000-FG484M
✅ Drop-In✓ In Stock
$47.95 / Unit
View Datasheet →A3P1000-1FGG484T
✅ Drop-In✓ In Stock
$33.9 / Unit
View Datasheet →A3P1000-2FGG484M
✅ Drop-In✓ In Stock
$75.44 / Unit
View Datasheet →A3P600L-FG484 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Flash FPGAs) |
| System Gates | 600000 |
| Logic Cells / CLBs | 13824 |
| Total RAM Bits | 110592 |
| User I/Os | 235 |
| Core Supply Voltage | 1.14 V to 1.575 V |
| Max Operating Frequency | 350 MHz (family rating) |
| Technology | CMOS, non-volatile flash based |
| Package | 484-FBGA (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (TJ) |
| Special Features | Flash*Freeze low-power standby technology |
| Configuration | Single-chip, on-chip flash (no external boot device) |
| Packaging | Tray |
| RoHS Status | Non-compliant (per Microchip USA listing) |
| Manufacturer Lead Time | 8 weeks |
| Product Status | Active |
A3P600L-FG484 484-fbga (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) Pin Configuration Guide
Complete pinout information for A3P600L-FG484 (484-fbga (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600L-FG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600L-FG484 is suitable for 6 applications: Portable and Battery-Powered Instruments, Industrial Control and Automation, Secure Embedded Controllers, Aerospace and Defense Subsystems, Low-Power Bridge and Glue Logic, Test and Measurement Equipment.
Portable and Battery-Powered Instruments
The A3P600L-FG484 fits battery-powered instruments because its 1.2 V low-power core and Flash*Freeze technology cut static consumption dramatically versus 1.5 V ProASIC3 parts and SRAM FPGAs that must retain configuration continuously. With 600,000 gates, 13,824 logic cells, and 235 user I/Os, one device can integrate measurement sequencing, display interfacing, and sensor buses that would otherwise need several ASICs or microcontrollers. Flash*Freeze lets the design idle with state retained and wake in milliseconds for a spot measurement, which suits handheld test gear, portable medical analyzers, and field data loggers where duty cycling directly extends battery life.
Recommended
Industrial Control and Automation
In industrial controllers, the A3P600L-FG484 provides deterministic glue logic, machine-safe I/O expansion, and protocol bridging with 235 user I/Os - enough for parallel fieldbus interfaces, encoder channels, and multiple UART/SPI/I2C banks in one chip. The non-volatile flash configuration means the PLC or drive board powers up functional instantly with no external boot device, improving uptime and eliminating a common single point of failure. The 0C to +85C (TJ) commercial grade covers typical cabinet environments; for unheated outdoor panels specify the A3P600L-FG484I industrial variant, which shares the identical footprint and lets one PCB layout serve both temperature grades.
Recommended
Secure Embedded Controllers
Flash-based ProASIC3L devices are favored for secure embedded controllers because the bitstream never appears on an external bus: unlike SRAM FPGAs that download configuration at every power-up (an interception point), the A3P600L stores its configuration in on-chip flash and boots as a single chip. The 600,000-gate capacity implements custom encryption interfaces, tamper-response logic, and secure boot glue around a host processor. The 1.14 V to 1.575 V core tolerance eases power-supply design in racks with shared rails, and 110,592 embedded RAM bits buffer sensitive data on-chip rather than in external memory, shrinking the physical attack surface of point-of-sale terminals, access-control panels, and authentication modules.
Recommended
Aerospace and Defense Subsystems
ProASIC3L flash FPGAs have a long heritage in aerospace and defense payloads, avionics glue logic, and secure communications boards. The single-chip, non-volatile configuration reduces component count and improves reliability predictions compared to SRAM FPGA solutions requiring external configuration PROMs. The A3P600L-FG484's 484-FBGA offers abundant I/O for redundant bus interfaces (MIL-STD-style parallel links, ARINC-style channels implemented in logic), and Flash*Freeze supports duty-cycled satellite or UAV payloads. For flight programs, select the temperature-qualified variants of the same die and consult Microchip hi-rel flows; this commercial-grade MPN suits prototyping, lab validation, and ground equipment where 0C to +85C suffices.
Recommended
Low-Power Bridge and Glue Logic
Many modern boards must bridge legacy parallel interfaces to serial buses, or voltage domains between processor and peripherals. The A3P600L-FG484 handles this class of work with 13,824 logic cells - ample for bus translators, arbitration logic, FIFOs using the 110,592-bit embedded RAM, and timing adaptation up to the family's 350 MHz performance class. Because configuration is on-chip, a bridge implemented in this device appears live at power-up with no loader software, simplifying bring-up on mixed-vendor platforms. Its low 1.2 V core also keeps bridge quiescent power low in always-on infrastructure such as network line cards, storage backplanes, and test-fixture interfacing.
Recommended
Test and Measurement Equipment
Bench and rack instruments exploit the A3P600L-FG484 for timing generation, trigger logic, pattern generators, and data-path formatting. The 235 user I/Os enable dense channel counts for digital pattern capture, while the flash fabric supports field-updatable instrument personalities without external boot infrastructure. Family performance up to 350 MHz covers high-rate counting and data formatting, and the 484-FBGA's 1.0 mm pitch eases routing of wide buses on 8-12 layer instrument boards. Combined with precision analog front ends, one FPGA consolidates control-plane and data-plane logic, cutting BOM cost in oscilloscope front-end modules, logic analyzers, and automated test fixtures.
Recommended
Recommended Products Summary
Engineering reference data for A3P600L-FG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600L-FG484I | A3P600L-FGG484I | A3P600L-1FGG484I | A3P1000-FG484M | A3P1000-2FGG484M |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (23 x 23 mm) | 484-FBGA - same | 484-FBGA (FGG) - same footprint | 484-FBGA (FGG) - same footprint | 484-FBGA - same | 484-FBGA (FGG) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 1000000 | 1000000 |
| User I/Os | 235 | 235 | 235 | 235 | [DATA_NEEDED] | [DATA_NEEDED] |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V low-power) | 1.14 V to 1.575 V (1.2 V) | 1.14 V to 1.575 V (1.2 V) | 1.14 V to 1.575 V (1.2 V) | 1.5 V core (standard family) | 1.5 V core (standard family) |
| Speed Grade | Standard | Standard | Standard | -1 (slower) | Standard | -2 (faster) |
| Temperature Grade | 0C to +85C (TJ) | Industrial (-40C to +85C/+100C) | Industrial | Industrial | [DATA_NEEDED] | [DATA_NEEDED] |
| RoHS / Lead-Free | Non-compliant (per listing) | [DATA_NEEDED] | Lead-free (FGG suffix) | Lead-free (FGG suffix) | [DATA_NEEDED] | Lead-free (FGG suffix) |
| Flash*Freeze Technology | Yes | Yes (ProASIC3L) | Yes (ProASIC3L) | Yes (ProASIC3L) | No (standard ProASIC3) | No (standard ProASIC3) |
Key Differentiators
- Low-power 1.2 V core with Flash*Freeze (vs A3P1000-FG484M)
- Identical footprint with industrial temperature option (vs A3P600L-FG484I)
- Lead-free compliance path without respin (vs A3P600L-FGG484I)
Design Notes
Power the 1.2 V core from a rail held within 1.14 V to 1.575 V under all load transients. The A3P600L differs from standard A3P600 parts (1.5 V core), so never swap the L and non-L parts on a fixed 1.5 V rail without re-verifying the regulator - doing so can exceed the low-power core rating. Sequence core, I/O, and auxiliary rails per the family datasheet power-up requirements, and use Flash*Freeze in duty-cycled systems to cut standby power while retaining state.
The 484-FBGA uses a 1.0 mm ball pitch on a 23 x 23 mm body. Use an via-in-pad or dog-bone breakout on at least a 10-layer board for 235 user I/Os, and dedicate solid planes for core and I/O bank returns. The exposed die requires the land pattern from the manufacturer's package drawing - do not rescale. For x-ray inspection and rework, follow BGA reflow profiles from IPC-recommended practice and confirm ball composition, since the FGG variants use lead-free balls with different reflow peak temperatures.
Three common mistakes: (1) ordering the base FG484 code when RoHS compliance is mandatory - the verified listing marks this exact MPN non-compliant, so specify FGG484 for lead-free builds; (2) assuming drop-in substitution across the family without checking the speed-grade suffix (-1 parts are slower, -2 parts faster) and temperature suffix (I = industrial); (3) ignoring I/O banking rules - assign standards per bank as documented in the ProASIC3L datasheet before pin-locking the design in Libero SoC.
Estimated: thermal performance of the 484-FBGA on a typical board is adequate for low-power ProASIC3L designs because the 1.2 V core reduces dynamic power roughly in proportion to V squared versus 1.5 V operation (about 36% less). Still, compute junction temperature as TJ = TA + P_total x theta_JA using the theta_JA value for your stackup from the family datasheet package chapter, and verify TJ stays within the 0C to +85C (TJ) commercial rating or choose the -I grade.
Compliance Information
Microchip USA listing states RoHS non-compliant for this exact ordering code; product status Active, packaging Tray, manufacturer lead time 8 weeks. Select FGG484 suffix variants for lead-free builds.
