A3PE3000-2FGG324I - 3M-Gate ProASIC3E Flash FPGA | Microchip
Référence : A3PE3000-2FGG324I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1 | $1,00 |
| 10 | $1 | $10,00 |
| 100 | $1 | $100,00 |
| 500 | $1 | $500,00 |
| 1 000 | $1 | $1 000,00 |
A3PE3000-2FGG324I Présentation
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that implements digital logic through configurable logic blocks and programmable interconnect. The ProASIC3E family belongs to the flash-based FPGA category, distinct from SRAM FPGAs because configuration is stored in on-chip nonvolatile flash cells, removing the need for an external boot flash and improving single-chip security and instant-on behavior.
Key features of the A3PE3000-2FGG324I include its flash-based single-chip architecture (low total cost of ownership, no configuration PROM), 221 user I/Os supporting single-ended and differential standards, embedded 516,096-bit flash memory, and reprogrammability with secure design storage. The -2 speed grade and industrial temperature range make it suitable for harsh-environment deployments.
Technically, the device is fabricated in 130nm flash CMOS process technology with a 1.5V core. The ProASIC3E fabric combines VersaTiles (logic modules), embedded RAM blocks, and flash configuration cells, supporting the Cortex-M1 soft processor and typical FPGA design flows in Libero SoC.
Typical applications include industrial automation and motor control, aerospace and defense subsystems, communications and networking line cards, and secure single-chip control logic where nonvolatile, tamper-resistant configuration is required.
A key design consideration is power: the 1.425V-1.575V core rail must be tightly regulated, and the 324-ball BGA requires careful PCB fanout and a dedicated power/ground ball pattern for signal integrity.
This page synthesizes verified distributor data, drop-in alternative cross-references, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour A3PE3000-2FGG324I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE3000-2FGG324I (même facteur de forme et même empreinte) — différant par Package, Process Technology, Family, System Gates, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE3000-FGG324I
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →A3PE3000-2FGG324
✅ Remplacement direct✓ En stock
$216 / unité
Voir la fiche technique →A3PE3000-2FG324I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000L-FGG324I
✅ Remplacement direct✓ En stock
$62.65 / unité
Voir la fiche technique →A3PE3000-FG324I
✅ Remplacement direct✓ En stock
$1 / unité
Voir la fiche technique →A3PE3000-2FGG324I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 3000000 |
| Number of I/Os | 221 |
| Embedded Memory | 516096 bit |
| Speed Grade | -2 |
| Tension d'alimentation | 1.425 V to 1.575 V |
| Température de fonctionnement | -40C to +100C (TJ) |
| Grade | Industrial |
| Boîtier | 324-BGA (FBGA, 19x19 mm) |
| Type de montage | Surface Mount |
| Technology | 130 nm Flash CMOS |
| Configuration | On-chip flash (nonvolatile, single chip) |
| Programmability | Reprogrammable (In-circuit) |
| Packaging | Tray |
| Statut RoHS | ROHS3 Compliant |
| Product Status | Active |
| Manufacturer Lead Time | 8 weeks |
Guide de configuration des broches du A3PE3000-2FGG324I 324-bga (fbga, 19x19 mm)
Configuration des broches du A3PE3000-2FGG324I (boîtier 324-bga (fbga, 19x19 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE3000-2FGG324I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE3000-2FGG324I convient pour 6 applications: Industrial Automation and Motor Control, Aerospace and Defense Subsystems, Communications and Networking Line Cards, Secure Embedded Control, Test and Measurement Instrumentation, Battery-Powered and Low-Power Portable Systems.
Industrial Automation and Motor Control
The A3PE3000-2FGG324I fits industrial automation because its 3M-gate fabric integrates state machines, PWM generators, and encoder interfaces in one chip, while its -40C to +100C industrial rating survives factory-floor thermal extremes. Its 221 user I/Os drive multiple motor-drive axes, and instant-on flash configuration means drives and PLC I/O modules are ready at power-up with no configuration controller. Used as the glue-logic and sequencing hub between an MCU or the Cortex-M1 soft core and IGBT gate drivers, it processes encoder feedback and generates gate-timing signals with deterministic latency. The trade-off versus an MCU is higher power at the 1.5V core rail, so budget switching activity in Libero SoC power analysis.
Recommandé
Aerospace and Defense Subsystems
Aerospace and defense designs choose the A3PE3000-2FGG324I because flash-based configuration resists readback and bit-flip-induced reconfiguration of the kind that affects SRAM FPGAs, and the single-chip nonvolatile architecture eliminates a boot PROM that would add failure modes. The -40C to +100C industrial junction range covers most avionics bay environments, and the 19x19 mm FGG324 BGA supports vibration-tolerant, high-usage solder attachment. Typical roles include sensor-interface formatting, bus bridging, and payload sequencing with the 516 kbit embedded flash storing calibration or mission data. Verify program-level qualification and radiation requirements directly with Microchip, as standard industrial grading does not by itself imply TID or SEE character.
Recommandé
Communications and Networking Line Cards
In networking line cards, the A3PE3000-2FGG324I bridges backplane buses, implements framing and statistics logic, and sequences PHYs, leveraging the -2 speed grade's roughly 310 MHz system performance for high-throughput paths. Its 221 I/Os support LVDS and other differential standards for high-speed interconnect, and nonvolatile startup means a line card initializes immediately when hot-plugged without waiting for a configuration download. The 516 kbit flash stores board serials and microcode. Design consideration: the FGG324's 221 I/O must be budgeted across banks to match VCCI rails of attached PHYs, and signal-integrity simulation is recommended for edges faster than 500 MHz.
Recommandé
Secure Embedded Control
Secure control applications - encryption key storage lifecycles, authentication nodes, anti-tamper logic - benefit from the A3PE3000-2FGG324I's on-chip flash configuration: the bitstream is not externally readable at power-up the way SRAM FPGA bitstreams are, and no external flash device exposes the design on a readable bus. The 516,096-bit embedded flash provides on-chip nonvolatile storage for keys or IDs, and the 3M-gate fabric implements cryptographic cores such as AES or SHA engines with margin. The industrial temperature range suits unattended field equipment. Trade-off: flash FPGAs offer fewer hard security primitives than newer families, so layer board-level tamper detection alongside the FPGA logic.
Recommandé
Test and Measurement Instrumentation
Bench and automated test equipment uses the A3PE3000-2FGG324I as timing-controller and pattern-generator logic: the -2 speed grade and 130nm fabric deliver precise, deterministic trigger and sampling strobes, while 221 I/Os interface with relays, ADC front-ends, and host backplanes. Instant-on flash configuration lets an instrument be ready within milliseconds of power-up - a measurable advantage in rack systems that power-cycle channels frequently. The embedded flash stores calibration constants per unit. Design note: use Libero SoC timing constraints to keep trigger-path skew under 1 ns and route trigger I/O on matched-length traces from the FGG324 balls.
Recommandé
Battery-Powered and Low-Power Portable Systems
For portable and battery-backed systems needing programmable logic, the A3PE3000-2FGG324I offers flash FPGAs' hallmark advantage over SRAM parts: zero configuration current at power-up and no boot device. The 1.5V core with 1.425V-1.575V tolerance suits efficient point-of-load regulation from a single-cell Li-ion via a buck converter. Where battery budget is dominant, the pin-compatible low-power variant A3PE3000L-FGG324I runs at reduced core voltage for further savings. Use the 516 kbit flash for event logs and the fabric for sensor-fusion preprocessing. Estimated: at 100 MHz with moderate utilization, core dynamic power is typically in the hundreds of milliwatts - run Libero power analysis with your actual toggle rates.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE3000-2FGG324I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE3000-FGG324I | A3PE3000-2FGG324 | A3PE3000-2FG324I | A3PE3000L-FGG324I | A3PE3000-FG324I |
|---|---|---|---|---|---|---|
| Package | 324-FBGA (FGG324, 19x19 mm) | 324-FBGA (FGG324) - same footprint | 324-FBGA (FGG324) - same footprint | 324-BGA (FG324, standard pitch) | 324-FBGA (FGG324) - same footprint | 324-BGA (FG324, standard pitch) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 221 | 221 | 221 | 221 | 221 | 221 |
| Embedded Flash | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit | 516,096 bit |
| Operating Temperature | -40C to +100C (TJ, industrial) | Industrial (-40C to +100C) | Commercial | Industrial (-40C to +100C) | Industrial | Industrial (-40C to +100C) |
| RoHS | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Principaux différenciateurs
- Fastest -2 speed grade in the FGG324 industrial family (vs A3PE3000-FGG324I)
- Industrial temperature rating on the fine-pitch FGG324 footprint (vs A3PE3000-2FGG324)
- Single-chip flash configuration (vs SRAM-based competitor FPGAs)
- Trade-off: higher power than the L low-power variant (vs A3PE3000L-FGG324I)
Notes de conception
The 1.5V core rail must stay within 1.425V-1.575V under all load transients. Use a point-of-load buck converter with at least 3 A headroom and bulk capacitance local to the FGG324 power balls; I/O bank VCCI rails must be sequenced with or before the core per the ProASIC3E datasheet (DS0098) power-up specification. Verify per-bank I/O standards early in Libero SoC because bank VCCI choices (2.5V/3.3V) constrain which standards can be placed in each bank.
The 324-ball 19x19 mm FGG324 uses fine-pitch balls: design your land pattern strictly per the DS0098 mechanical drawing and confirm whether your footprint is FGG (fine pitch) or FG (standard pitch) - the A3PE3000-2FGG324I will NOT fit an FG324 pattern. Plan fanout with via-in-pad or dog-bone escapes, and reserve solid power/ground ball grids for low-inductance return paths. Do not route high-speed signals under the package without a reference plane.
For differential I/O pairs (LVDS and similar standards), maintain matched intra-pair lengths within a few millimeters and observe the datasheet note that each used differential I/O pair reduces available single-ended I/Os by two - budget your 221 I/Os accordingly. Note the DS0098 limitation that on A3PE1500/A3PE3000 devices usage of certain I/O standards is restricted; check the standards table before committing your pin assignment.
Lead time is 8 weeks from the manufacturer, so qualify a drop-in alternative (e.g., A3PE3000-FGG324I at standard speed grade) as a supply-risk hedge and verify timing closure at the slower grade in Libero SoC before approving the swap. Also confirm temperature grade codes: the non-'I' suffix part (A3PE3000-2FGG324) is commercial grade and must not be used in -40C industrial systems despite identical footprint.
Informations de conformité
ROHS3 Compliant per Microchip USA product data. Lead-free consistent with ROHS3. REACH, halogen-free, and conflict-minerals status not stated in provided data.
