A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip
料号： A3PE3000L-FG896I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
A3PE3000L-FG896I 概述
A flash FPGA is a field-programmable gate array that stores its configuration in on-chip flash memory rather than an external configuration ROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> semiconductor), flash FPGAs such as the ProASIC3L family offer a true single-chip solution: no external boot device is required, configuration is instant-on at power-up, and the device is reprogrammable in-system.
Key features of the ProASIC3L family include 1.2V to 1.5V core voltage operation, I/O operation as low as 1.2V, and Flash*Freeze technology that dramatically reduces dynamic power consumption by up to 40% and static power by 50% compared with the equivalent standard ProASIC3 device, according to the Microchip ProASIC3L datasheet (DS50003268). The low total cost of ownership, reprogrammability, and small-footprint packaging make the family attractive for cost- and power-sensitive designs.
Architecturally, the A3PE3000L combines fine-grained Versatile logic elements with embedded flash and SRAM resources, supporting high-performance single-chip designs in industrial, communications, and aerospace/defense systems. The -FG896I designation indicates the industrial temperature variant in the 896-ball package with 620 available I/O.
Typical applications include industrial automation and control, medical equipment, communications infrastructure, and military/aerospace systems where nonvolatile, secure, low-power programmable logic is required.
Design consideration: because the -I suffix denotes the industrial temperature grade, verify soldering and assembly processes; this specific grade is listed by some sources as RoHS non-compliant and lead-containing, so confirm compliance requirements for your end market.
This page synthesizes distributor availability, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet, with pricing referenced as of 2026-09-02.
直接替换替代料： A3PE3000L-FG896I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE3000L-FG896I （相同外形与封装尺寸） ——差异在于 Package, Family, Operating Temperature, Configuration Memory, Process Technology.
快速对比工具——选择替代料号进行并排对比：
A3PE3000L-FGG896I
✅ 直接替换✓ 有现货
$139.9 / 个
查看数据手册 →A3PE3000L-1FGG896I
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE3000L-FG896
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE3000L-1FGG896YM
✅ 直接替换📋 参考替代料（不在目录中）
M1A3PE3000L
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
A3PE3000L-FG896I 最大额定值与电气特性
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 |
| Logic Cells | 75264 |
| User I/O | 620 |
| Core Voltage | 1.2 V to 1.5 V |
| I/O Voltage (minimum) | 1.2 V |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) |
| Low Power Feature | Flash*Freeze technology (40% dynamic / 50% static power reduction) |
| 封装 | 896-BGA (FBGA-896) |
| 安装类型 | Surface Mount |
| Temperature Grade | Industrial (-I suffix) |
| Reprogrammability | Yes (in-system reprogrammable) |
| RoHS 状态 | RoHS Non-Compliant (per distributor listing) |
| Lead Free Status | Contains Lead (per distributor listing) |
A3PE3000L-FG896I 896-bga (fbga-896) 引脚配置指南
A3PE3000L-FG896I（896-bga (fbga-896) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE3000L-FG896I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE3000L-FG896I 适用于 6 应用s: Industrial Automation and Control, Medical and Diagnostic Equipment, Communications Infrastructure, Military and Aerospace Systems, Test and Measurement Instrumentation, Battery-Powered and Low-Power Embedded Systems.
Industrial Automation and Control
The A3PE3000L-FG896I fits industrial automation nodes that aggregate many sensor, encoder, and fieldbus signals into one programmable fabric. Its 620 user I/Os allow glueless interfacing to PLC backplanes, motor controllers, and industrial Ethernet MACs without external fan-out logic, while the industrial (-I) temperature grade covers -40C-class factory-floor environments. The on-chip flash configuration keeps the design single-chip and instant-on at power-up, important for machinery that must resume deterministic operation after power cycles. In systems with idle periods, Flash*Freeze mode trims dynamic power by up to 40% versus the equivalent standard ProASIC3, reducing cabinet heat. Designers typically pair the FPGA with isolated transceivers and supervisors, using the fabric for protocol bridging, safety interlocks, and high-resolution PWM generation.
推荐
Medical and Diagnostic Equipment
Medical imaging and diagnostic instruments benefit from the A3PE3000L-FG896I's combination of high I/O count, reprogrammability, and nonvolatile single-chip configuration. Front-end boards in ultrasound, digital radiography, and laboratory analyzers use the 620 I/Os to connect multi-channel ADC arrays and detector lines, with the fabric handling timing, framing, and interface conversion. Flash-based configuration avoids external boot memory, reducing BOM and improving uptime behavior at instrument power-on, which matters in clinical workflows. The ProASIC3L's 1.2V-1.5V core and Flash*Freeze mode help meet thermal and battery-backup constraints in portable or cart-based systems. Because compliance targets in medical devices often require RoHS-conformant assemblies, designers can drop in the pin-compatible A3PE3000L-FGG896I variant on the same 896-ball PCB footprint without re-routing.
推荐
Communications Infrastructure
Line cards, backplane adapters, and network processing assists use the A3PE3000L-FG896I as flexible logic glue between PHYs, framers, and host processors. The 620 user I/Os accommodate wide parallel data buses, multiple low-voltage differential interfaces, and bank voltages down to 1.2V, matching modern chip-to-chip signaling. The ProASIC3L fabric's deterministic timing supports framing, deskew, and status aggregation tasks that would otherwise consume several ASSP devices, cutting total cost of ownership as Microchip emphasizes for the family. Because designs in this domain iterate rapidly, the flash FPGA's in-system reprogrammability allows feature updates in deployed units without hardware changes. Engineering teams should verify speed-grade timing against link rates and consider the faster A3PE3000L-1FGG896I drop-in when static timing analysis is marginal at the standard grade.
推荐
Military and Aerospace Systems
Flash FPGAs are a staple in defense electronics because on-chip flash configuration offers inherent resistance to configuration upsets compared with SRAM fabrics, and no configuration bitstream travels an exposed bus at boot. The A3PE3000L-FG896I's industrial grading, single-chip instant-on startup, and reprogrammability suit avionics interface boards, radar pre-processing, and secure communications equipment. The 896-ball FBGA provides dense, solder-bump-reliable mounting for high-vibration platforms, while the 620 I/Os map to redundant sensor buses and MIL-STD-style discrete interfaces aggregated in one device. Flash*Freeze allows duty-cycled battery- or vehicle-powered systems to cut dynamic power up to 40% during quiet phases and resume instantly. Long-lifecycle support from Microchip's FPGA portfolio also aligns with multi-decade platform service requirements common in this sector.
推荐
Test and Measurement Instrumentation
Bench and modular instruments use the A3PE3000L-FG896I for trigger engines, timing generators, and bus-interface logic across 620 available I/Os. Flash configuration means the instrument is functional the instant power is applied, avoiding SRAM-FPGA boot latency that can delay measurement readiness. The ProASIC3L architecture supports bridging between acquisition front ends and embedded processors, with bank I/O voltages down to 1.2V matching modern probe and digitizer silicon. In-system reprogrammability lets manufacturers ship one hardware platform and deliver instrument capabilities via firmware, reducing SKU proliferation. Power-sensitive battery-operated field instruments exploit Flash*Freeze to cut dynamic power up to 40% between acquisitions. For designs pushed to timing limits, the pin-compatible A3PE3000L-1FGG896I provides a faster speed grade without PCB changes.
推荐
Battery-Powered and Low-Power Embedded Systems
Duty-cycled systems such as portable data loggers, battery-backed controllers, and remote monitoring nodes exploit the ProASIC3L family's defining feature: Flash*Freeze technology. According to the Microchip ProASIC3L datasheet (DS50003268), the family reduces dynamic power by 40% and static power by 50% versus the equivalent standard ProASIC3 device, and Flash*Freeze preserves the entire logic state while clocks and I/O are frozen, so the system wakes instantly without reconfiguration. The A3PE3000L-FG896I's 1.2V-1.5V core operation and 1.2V-capable I/O banks reduce rail power, while single-chip flash configuration removes boot ROM current and area. Designers should budget wake/exit timing from the datasheet and verify the industrial (-I) grade if the system operates outdoors; the FGG896I variant offers the same footprint with Pb-free finishing for compliant products.
推荐
推荐产品汇总
工程参考数据： A3PE3000L-FG896I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE3000L-FGG896I | A3PE3000L-1FGG896I | A3PE3000L-FG896 | A3PE3000L-1FGG896YM |
|---|---|---|---|---|---|
| Package | 896-BGA (FBGA-896) | 896-BGA (FBGA-896) - same footprint | 896-BGA (FBGA-896) - same footprint | 896-BGA (FBGA-896) - same footprint | PBGA896 - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| User I/O Count | 620 | 620 | 620 | 620 | 620 |
| Logic Cells | 75264 | 75264 | 75264 | 75264 | 75264 |
| Speed Grade | Standard | Standard | -1 (faster) | Standard | -1 (faster) |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Configuration Memory | On-chip Flash (single-chip) | On-chip Flash (single-chip) | On-chip Flash (single-chip) | On-chip Flash (single-chip) | On-chip Flash (single-chip) |
关键差异点
- Nonvolatile single-chip flash configuration （对比 SRAM-based FPGAs of similar density)
- Flash*Freeze low-power mode （对比 A3PE3000 (standard ProASIC3))
- 620 user I/Os in a dense 896-ball footprint （对比 A3PE3000L-FGG484I)
- Lead-containing finish can be a liability （对比 A3PE3000L-FGG896I)
设计说明
An 896-ball FBGA with 620 used I/Os demands careful fan-out planning: escape routing typically requires microvias or at minimum 0.15 mm drill vias under the array, and power/ground ball allocation must follow the Microchip ProASIC3L packaging document (DS50003268 companion pinout tables). Confirm the exact ball map before routing - do not copy layouts from FG484/FGG484 variants of the same family, as the 896-ball map differs. Plan I/O bank voltages early since banks support operation down to 1.2V; mixing 3.3V and 1.2V banks requires bank-level supply planning on the PCB.
Estimated: core rails at 1.2V to 1.5V for a 75264-cell fabric can draw significant current at high utilization; size the core regulator and decoupling network from a power estimation run in Libero SoC (Microchip's design suite) rather than from a fixed figure. The Flash*Freeze mode can reduce dynamic power by up to 40% and static power by 50% versus standard ProASIC3, per DS50003268, so implement the Flash*Freeze control pin in your power-management scheme for duty-cycled systems. Provide adequate bulk capacitance near the 896-ball package for simultaneous switching noise on 620 I/Os.
Do not assume RoHS compliance: this -I FG variant is listed as lead-containing/RoHS non-compliant in verified distributor data, which can block shipments into RoHS markets. Use the pin-compatible A3PE3000L-FGG896I for green/RoHS builds - same footprint, same die - and verify the compliance declaration on the Microchip product page. Also match speed grade to timing closure: if static timing fails at the standard grade, move to the A3PE3000L-1FGG896I (-1 grade) rather than re-architecting, since it is pin-to-pin compatible.
合规信息
Distributor listing (digichip.com) states Lead Free Status: Contains Lead; RoHS Status: RoHS Non-Compliant. Pin-compatible Pb-free variant A3PE3000L-FGG896I exists for compliant builds. Verify current declarations on the Microchip product page.
