A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip
MPN: A3PE3000L-FG896 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for A3PE3000L-FG896 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-FG896I
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View Datasheet βA3PE3000L-FG896M
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000L-1FGG896
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$255 / Unit
View Datasheet βA3PE3000L-1FG896
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000L-FG896 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L |
| System Gates | 3,000,000 |
| User I/O | 620 |
| Logic Cells | 75,264 |
| Core Voltage | 1.2 V to 1.5 V |
| Technology | 130 nm nonvolatile flash |
| Configuration Memory | Nonvolatile flash (single-chip, Instant On) |
| Package | 896-ball FBGA |
| Mounting Type | Surface Mount |
| Low Power Feature | Flash*Freeze technology |
| Operating Temperature Suffix | Commercial (unmarked suffix; -I grade is industrial) |
| RoHS Status | unknown |
| Programmability | In-system reprogrammable |
A3PE3000L-FG896 896-ball fbga Pin Configuration Guide
Complete pinout information for A3PE3000L-FG896 (896-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-FG896.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-FG896 is suitable for 6 applications: Industrial Control and Automation, Portable and Battery-Powered Instrumentation, Secure Single-Chip Logic, Board-Level Glue Logic Consolidation, Medical and Test Equipment, Communications and Networking Line Cards.
Industrial Control and Automation
The A3PE3000L-FG896 suits industrial controllers that need large I/O counts and deterministic, instant-on logic. Its 620 user I/Os in an 896-ball FBGA can absorb PLC I/O expansion, motor-control sequencing, and sensor interfacing that would otherwise require several smaller devices, reducing BOM and board area. Because configuration resides in nonvolatile on-chip flash, the FPGA is active immediately at power-up - important for factory equipment with strict startup sequences. The 1.2 V to 1.5 V core and low static flash power help in sealed enclosures with limited airflow. Designers typically pair the FPGA with an MCU handling communications while the FPGA manages timing-critical I/O.
Recommended
Portable and Battery-Powered Instrumentation
Battery-powered instruments benefit directly from the ProASIC3L family's low static and dynamic power plus Flash*Freeze technology, which drops power dramatically while retaining SRAM state and I/O context. The A3PE3000L-FG896's 3M gates and 75,264 logic cells provide enough capacity for data acquisition sequencers, display driving, and signal pre-processing in handheld testers and field analyzers. The nonvolatile flash configuration removes the boot-time and board-area cost of external configuration flash. With a 1.2 V to 1.5 V core, the device fits multi-rail battery systems; designers should place the FPGA in Flash*Freeze during idle intervals to extend battery runtime.
Recommended
Secure Single-Chip Logic
ProASIC3L's nonvolatile flash technology makes the A3PE3000L-FG896 a strong fit for secure, single-chip logic where the bitstream must never appear on a board-level configuration bus, as happens with SRAM FPGAs at every power-up. Applications include secure communications equipment, licensing enforcement logic, and anti-tamper designs. The device is Instant On - active within microseconds of supply ramp - so security functions need not wait for configuration. With 3M gates and 620 I/Os, designers can consolidate security logic, bus bridging, and custom peripherals into one 896-BGA device, shrinking the attack surface relative to multi-chip solutions.
Recommended
Board-Level Glue Logic Consolidation
The A3PE3000L-FG896 excels at replacing collections of ASSPs, CPLDs, and discrete glue logic across a PCB. Its 620 user I/Os and 896-ball FBGA footprint provide the connectivity to interface memory buses, backplanes, and mixed-voltage peripherals in one reprogrammable device. Reprogrammability allows board spins to be absorbed in firmware rather than PCB rework, cutting total cost of ownership - a headline feature on Microchip's product page. Because configuration is nonvolatile and Instant On, the consolidated logic meets power-up timing without external boot memory. Verify I/O banking and voltage standards in the datasheet when migrating legacy discrete interfaces.
Recommended
Medical and Test Equipment
Medical diagnostic devices and bench instrumentation need predictable power-up behavior, flexible I/O, and long field life - all ProASIC3L strengths. The A3PE3000L-FG896's 3M gates implement acquisition front-end control, filter engines, and display/communication interfaces, while Flash*Freeze mode keeps standby power low between measurements. Nonvolatile configuration means the instrument is operational the instant power is applied, simplifying self-test sequences. The large FBGA package suits rack and cart-based equipment where board space is less constrained than in wearables. Field upgrades are performed by reprogramming flash in-system, enabling feature updates over service life.
Recommended
Communications and Networking Line Cards
Line cards and control planes in networking gear use the A3PE3000L-FG896 for bus bridging, LED/status control, hot-swap supervision, and board management. The 620 I/O budget covers wide parallel interfaces to PHYs and switch fabric devices, and the 896-BGA delivers the ball count those interfaces demand. Instant On nonvolatile configuration lets the card signal ready states to the chassis manager before software loads, and reprogrammability supports in-field feature updates. Designers should budget core and I/O rail sequencing with the chassis power-good scheme and use Flash*Freeze during card standby to cut slot power, an increasingly important metric in dense chassis.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-FG896 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-FG896I | A3PE3000L-FG896M | A3PE3000L-1FGG896 | A3PE3000L-1FG896 |
|---|---|---|---|---|---|
| Package | 896-ball FBGA | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA (FGG) - same footprint | 896-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip (Microsemi legacy) | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 620 | 620 | 620 | 620 | 620 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V (per FindIC listing) | 1.2 V to 1.5 V |
| Speed Grade | Standard (no dash suffix) | Standard (I = industrial temp) | [DATA_NEEDED] | -1 (faster timing grade) | -1 (faster timing grade) |
| Temperature Grade | Commercial (no suffix) | Industrial (I suffix) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Low Power Feature | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash |
Key Differentiators
- Lowest-risk drop-in replacement option (vs A3PE3000L-FG896I)
- Faster timing headroom (vs A3PE3000L-1FGG896)
- Single-chip nonvolatile configuration (vs SRAM-based FPGAs of similar density)
Design Notes
Budget two power domains: the 1.2 V to 1.5 V core rail and the I/O bank rails. Per the Microchip product page, the ProASIC3L family emphasizes low dynamic and static power, but actual consumption depends heavily on I/O loading and toggle rates. Enter the design into Microchip Libero and run the power calculator early with realistic switching activity, then apply Flash*Freeze mode in idle states to capture the family's headline power savings.
The 896-ball FBGA requires careful fan-out planning. Use a microvia or sequential build-up stackup to escape the ball field, and define via-in-pad with fill for power/ground balls. Follow the Microchip ProASIC3L datasheet (DS50003268) PCB land-pattern and reflow guidance; the datasheet's ball map sections define VCC, GND, and NC ball assignments that govern your power-plane segmentation. Simulate or follow datasheet derating for signal integrity on high-speed I/O banks.
Do not confuse the -FG896 and -FGG896 package suffixes, or commercial vs -I industrial temperature grades, when ordering or cross-referencing: they share the same die and footprint but differ in ordering data and, for speed-grade dashes (-1), timing. Verify the exact suffix against your environmental and timing requirements before substitution, even though these variants are pin-to-pin compatible within the same 896-ball package.
Compliance Information
Compliance status not stated in the provided verified web data. Consult the Microchip product page or distributor environmental data for current RoHS/REACH declarations.
