A3PE600-2FG256 - 600K-Gate Flash FPGA, 165 I/O | Microchip
料号： A3PE600-2FG256 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $47.5 | $47.50 |
| 10 | $43.2 | $432.00 |
| 100 | $38.9 | $3,890.00 |
| 500 | $35.6 | $17,800.00 |
| 1,000 | $32.8 | $32,800.00 |
A3PE600-2FG256 概述
A field-programmable gate array (FPGA) is a semiconductor device that implements user-defined digital logic through configurable logic blocks, interconnect routing, and I/O cells programmed after manufacturing. The ProASIC3E family sits within Microchip's broader FPGA hierarchy, below the ProASIC3L and Igloo2 families, and is distinguished by its flash-based programming technology rather than SRAM.
Key features include flash-based, nonvolatile configuration that provides live-at-power-up (Level 0) operation without an external configuration device, enabling true single-chip solutions. The 130-nm, 7-layer metal (6 copper) flash-based CMOS process delivers low total cost of ownership. The -2 speed grade supports system-level performance suitable for glue logic, control, and interface bridging functions, and the device is reprogrammable in-system.
Technically, the ProASIC3E architecture uses VersaTiles as its universal logic element, with embedded block SRAM organized as true dual-port memory for FIFOs and buffering. On-chip flash switching and routing remove the need for boot PROMs, improving board reliability and startup time compared with SRAM FPGAs. Supply voltage is a 1.5 V core, with commercial operating temperature of 0C to +70C for this standard (non-I) variant.
Typical applications include industrial control, communication line cards, test and measurement instrumentation, motor control interfaces, and secure single-chip logic replacement of ASICs and gate arrays in low-to-medium volume production.
Design consideration: because configuration is nonvolatile flash, no configuration SPI flash is required, but I/O bank voltage rules and 1.0 mm pitch BGA routing (typically requiring a minimum 6-layer PCB) must be respected in layout.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3PE600-2FG256 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE600-2FG256 （相同外形与封装尺寸） ——差异在于 Package, Configuration Memory, Process Technology, RoHS Status, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
A3PE600-2FG256I
✅ 直接替换✓ 有现货
$26.4 / 个
查看数据手册 →A3PE600-2FGG256
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$33.15 / 个
查看数据手册 →A3PE600-FG256
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$33.5 / 个
查看数据手册 →A3PE600-FG256I
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$44.6 / 个
查看数据手册 →A3PE600-FGG256
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$19.6 / 个
查看数据手册 →A3PE600-FGG256I
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$41.8 / 个
查看数据手册 →A3PE600-2FG256 最大额定值与电气特性
| Family | ProASIC3E |
| System Gates | 600000 |
| Logic Elements / Cells | 13824 |
| User I/Os | 165 |
| Embedded Memory | 110592 bits true dual-port SRAM |
| Speed Grade | -2 |
| Core Supply Voltage | 1.5 V |
| Technology | 130-nm 7-layer metal (6 copper) flash-based CMOS |
| Configuration Memory | Flash-based, nonvolatile, live-at-power-up Level 0 |
| 工作温度 | 0C to +70C |
| 封装 | 256-ball FBGA (LBGA), 1.0 mm pitch |
| 安装方式 | SMD/SMT |
| Logic Family | CMOS |
| 引脚数 | 256 |
| Packaging | Tray |
| Reprogrammability | In-system reprogrammable |
A3PE600-2FG256 256-ball fbga (lbga), 1.0 mm pitch 引脚配置指南
A3PE600-2FG256（256-ball fbga (lbga), 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE600-2FG256.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE600-2FG256 适用于 6 应用s: Industrial Control and Automation, Communication Line Cards, Test and Measurement Instrumentation, EOL ASIC and Gate Array Replacement, Secure Embedded Systems, Aerospace and Defense Control Logic.
Industrial Control and Automation
The A3PE600-2FG256 fits industrial control applications because its 600,000 system gates, 13824 logic cells, and 110592 bits of true dual-port SRAM absorb PLC I/O glue logic, motor-control sequencers, and fieldbus protocol bridges in a single 256-ball FBGA. Its flash-based, live-at-power-up configuration means control logic is active the instant 1.5 V core power is applied - critical for machinery safety interlocks that cannot wait for bitstream loading. The 165 user I/Os handle sensor, encoder, and actuator interfaces, and in-system reprogrammability allows field firmware updates without desoldering. The 0C to +70C rating suits indoor cabinets; select the -I variant for outdoor or cold-storage installations.
推荐
Communication Line Cards
ProASIC3E devices were explicitly marketed for communication systems, and the A3PE600-2FG256 suits line-card functions such as framing, backplane interface bridging, and packet-buffer management. The 110,592 bits of true dual-port SRAM implement FIFOs between different clock domains, while the -2 speed grade meets timing on moderate-throughput serial interfaces. The flash fabric draws no configuration current from an external device at power-up, improving availability metrics in redundant telecom shelves, and the single-chip solution reduces the board area consumed by control logic on dense cards. For shelves with -40C to +85C ambient requirements, use the identical A3PE600-2FG256I variant on the same PCB footprint.
推荐
Test and Measurement Instrumentation
In bench instruments and automated test equipment, the A3PE600-2FG256 implements timing generators, trigger logic, and interface translation between USB/LAN modules and analog front ends. Its 600,000 gates provide enough capacity for multi-channel state machines, and the true dual-port SRAM of 110,592 bits buffers captured waveform data before offload. The live-at-power-up Level 0 behavior means measurement trigger chains are armed as soon as power is stable, avoiding missed events during startup - a real advantage over SRAM FPGAs that are unconfigured for tens to hundreds of milliseconds. The 256-ball FBGA's 1.0 mm pitch eases rework in instrument prototypes compared with finer-pitch BGA alternatives.
推荐
EOL ASIC and Gate Array Replacement
The A3PE600-2FG256 is a proven replacement path for obsolete ASICs and gate arrays. Its 600,000 system gates and 13824 logic cells absorb moderate ASIC netlists, and the 110592 bits of embedded dual-port SRAM replaces on-chip ASIC RAM blocks. Because configuration is nonvolatile flash, the replacement replicates ASIC power-up behavior - logic is functional immediately at power-on with no boot device and no configuration-readback security exposure. In-system reprogrammability eliminates expensive mask respins for bug fixes, and the 256-ball FBGA footprint can be designed to match legacy ASIC pad frames in new layouts. For extended-temperature legacy military or industrial systems, the pin-identical A3PE600-2FG256I is the recommended drop-in.
推荐
Secure Embedded Systems
Security-focused designs benefit from the A3PE600-2FG256's flash-based architecture: unlike SRAM FPGAs, the bitstream never traverses an external bus, removing the primary interception point for configuration cloning. The live-at-power-up operation eliminates the configuration window in which SRAM FPGAs are blank, a state exploitable in some boot-supply attacks. The 600K gates implement encryption engines such as AES or custom authentication state machines with the 110,592-bit dual-port SRAM serving key or packet buffers, and 165 I/Os cover smart-card readers, secure network ports, and tamper-detection interfaces. Designers should additionally follow Microchip's ProASIC3E security application notes for JTAG lock and flash protection settings.
推荐
Aerospace and Defense Control Logic
Microchip's (formerly Actel/Microsemi) flash FPGAs have a long heritage in aerospace and defense, and the A3PE600-2FG256 class of devices is used for satellite payload control, avionics interface conversion, and radiation-tolerant system glue logic in non-critical roles. The flash fabric provides high immunity to configuration upset because there is no volatile configuration memory to corrupt, and the single-chip, live-at-power-up solution simplifies redundancy schemes. The 165 I/Os handle legacy MIL-STD interface translation, while 110,592 bits of dual-port SRAM supports buffering. Note this commercial-grade part is rated 0C to +70C; for flight programs, evaluate Microchip's dedicated military/RT ProASIC3 variants and QML-qualified flows rather than the standard commercial MPN.
推荐
推荐产品汇总
工程参考数据： A3PE600-2FG256 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE600-2FG256I | A3PE600-2FGG256 | A3PE600-FG256 | A3PE600-FGG256I |
|---|---|---|---|---|---|
| Package | 256-ball FBGA (FG256), 1.0 mm pitch | 256-ball FBGA (FG256) - same | 256-ball FBGA (FGG256) - same footprint, lead-free | 256-ball FBGA (FG256) - same | 256-ball FBGA (FGG256) - same footprint, lead-free |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| User I/Os | 165 | 165 | 165 | 165 | 165 |
| Speed Grade | -2 | -2 | -2 | -1 (standard) | -1 (standard) |
| Operating Temperature | 0C to +70C | -40C to +85C | 0C to +70C | 0C to +70C | -40C to +85C |
| Embedded SRAM | 110,592 bits | 110,592 bits | 110,592 bits | 110,592 bits | 110,592 bits |
| Configuration | Flash, live-at-power-up Level 0 | Flash, live-at-power-up Level 0 | Flash, live-at-power-up Level 0 | Flash, live-at-power-up Level 0 | Flash, live-at-power-up Level 0 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Package Compliance | Standard RoHS package (FG) | Standard package (FG) | Green, lead-free (FGG) | Standard package (FG) | Green, lead-free (FGG) |
关键差异点
- Live-at-power-up flash configuration （对比 Xilinx Spartan-3 (SRAM FPGA))
- Single-chip BOM savings （对比 A3PE600-2FG256I)
- Speed-grade upgrade path on same footprint （对比 A3PE600-FG256)
设计说明
The 256-ball FBGA with 1.0 mm ball pitch requires careful fanout planning. For a design using a significant fraction of the 165 user I/Os, plan a minimum 6-layer PCB with dedicated power and ground planes. Use 0.3 mm drill via-in-pad or dog-bone fanout on the 1.0 mm grid, and verify Microchip's ProASIC3E package mechanical drawing for exact ball map before routing. Provide JTAG trace access to the TMS/TCK/TDI/TDO balls for in-system programming with FlashPro hardware.
The ProASIC3E core runs from a 1.5 V supply with separate I/O bank rails. Size the 1.5 V regulator for the worst-case switching activity of the fabric rather than typical power estimates - use Libero power analysis on your actual netlist. Decouple each supply ball with 0.1 uF ceramic capacitors placed within 2 mm of the package, plus bulk 10 uF per rail. Because configuration is flash-based, there is no configuration inrush current spike at power-up.
Do not confuse the commercial A3PE600-2FG256 (0C to +70C) with the industrial A3PE600-2FG256I (-40C to +85C) in outdoor or uncontrolled-temperature products - thermal margin violations manifest as intermittent timing failures. Also remember the 165-I/O limit of the FG256 package: if a design revision needs more I/Os, the same die is available in the FG484 package with up to 616 I/Os, but that requires a PCB redesign, so validate final I/O budgets before layout release.
合规信息
The FGG package suffix (e.g., A3PE600-2FGG256) denotes Microchip's green, lead-free, halogen-free variant; compliance details for the standard FG256 ordering code were not captured in the verified data - confirm on the official Microchip product page.
