A3PE600-2FG256I - ProASIC3E FPGA 600K Gates | Microchip
料号： A3PE600-2FG256I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.9 | $3,190.00 |
| 500 | $28.75 | $14,375.00 |
| 1,000 | $26.4 | $26,400.00 |
A3PE600-2FG256I 概述
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that the designer configures after manufacturing. The ProASIC3E family sits within the broader hierarchy of programmable logic devices: FPGA -> flash-based FPGA -> single-chip, non-volatile FPGA. Unlike SRAM FPGAs, ProASIC3E devices store their configuration in on-chip flash, so they power up instantly, require no external configuration ROM, and offer higher resistance to configuration tampering.
Key features include the third-generation VersaTile architecture, where each tile functions as a three-input LUT, a D-flip-flop, or a latch with enable, enabling highly efficient fabric utilization. The -2 speed grade balances performance and cost, supporting designs up to 310 MHz. The flash fabric also delivers low total cost of ownership through single-chip integration and reprogrammability.
Built on a 130nm flash process, the device integrates embedded memory (110,592 bits per distributor listing as fabric RAM capacity) and supports the ProASIC3E I/O features for interfacing with common single-ended and differential standards. Microchip's Libero SoC design suite supports synthesis, place-and-route, and simulation for this family.
Typical applications include industrial automation control, communications line-card glue logic and bridging, aerospace/defense systems favoring non-volatile instant-on FPGAs, and medical instrumentation where configuration flash simplifies the power-up sequence.
A key design consideration: distributor data (chipdig) lists this exact speed-grade/temperature suffix as RoHS non-compliant and containing lead. Designers with RoHS mandates should verify the -FGG256 lead-bump variant before finalizing the BOM.
This page synthesizes distributor pricing tiers, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3PE600-2FG256I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE600-2FG256I （相同外形与封装尺寸） ——差异在于 Package, Family, Process Technology, Configuration Memory, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
A3PE600-FG256I
✅ 直接替换✓ 有现货
$44.6 / 个
查看数据手册 →A3PE600-FGG256I
✅ 直接替换✓ 有现货
$41.8 / 个
查看数据手册 →A3PE600-2FGG256
✅ 直接替换✓ 有现货
$33.15 / 个
查看数据手册 →M7AFS600-2FGG256I
✅ 直接替换✓ 有现货
$389.6 / 个
查看数据手册 →M1AFS600-2FGG256
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →A3PE600-2FG256I 最大额定值与电气特性
| Family | ProASIC3E (Flash FPGA) |
| System Gates | 600000 gates |
| Number of I/O | 165 |
| Embedded Memory (RAM bits) | 110592 bits |
| Maximum System Frequency | 310 MHz |
| Speed Grade | -2 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm |
| Configuration Technology | Flash (non-volatile, single-chip) |
| 工作温度 | -40C to +85C (industrial) |
| 封装 | 256-LBGA / FBGA (FG256) |
| Package Height | 1.80 mm |
| 安装类型 | Surface Mount |
| RoHS 状态 | RoHS Non-Compliant (contains lead, per distributor data) |
| Lead Free Status | Contains Lead |
| Total Cost of Ownership Feature | Low TOC, single-chip solution, reprogrammable |
A3PE600-2FG256I 1.80 mm 引脚配置指南
A3PE600-2FG256I（1.80 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE600-2FG256I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE600-2FG256I 适用于 6 应用s: Industrial Automation Control, Communications Line Cards and Bridging, Aerospace and Defense Electronics, Medical Instrumentation, Test and Measurement Equipment, Legacy Design Refresh and Obsolescence Bridging.
Industrial Automation Control
The A3PE600-2FG256I fits industrial control boards because its industrial -40C to +85C rating and flash-based instant-on configuration eliminate boot delays in PLC backplanes and motor-control cards. Its 165 user I/Os interface encoders, fieldbus PHYs, and sensor arrays, while the 310 MHz -2 speed grade handles real-time control loops and protocol state machines. Placed as the glue-logic and sequencing hub between an MCU and power drivers, the single-chip flash fabric removes the external configuration SPI device, cutting BOM cost and improving uptime in electrically noisy factory environments where configuration corruption must be impossible.
推荐
Communications Line Cards and Bridging
In telecom and networking line cards, the A3PE600-2FG256I serves as backplane interface bridging, deserializer framing, and system glue logic. The -2 grade supports up to 310 MHz internal operation, sufficient for many parallel LVCMOS data-path aggregation tasks, and the 256-ball FBGA concentrates 165 I/Os in a compact area for dense card layouts. Because the ProASIC3E fabric is flash-based, line cards power up operational within microseconds - important for hot-swap and redundant-architecture systems. Total cost of ownership is low since no external configuration flash or microcontroller supervises bitstream loading during every power cycle.
推荐
Aerospace and Defense Electronics
Microchip (Actel) flash FPGAs are widely trusted in defense and space-adjacent systems because the configuration is stored on-chip, reducing single-event and tamper exposure compared with SRAM FPGAs that reload from external memory. The A3PE600-2FG256I provides 600K gates of VersaTile fabric for custom interfaces, bus bridges, and payload sequencing logic with instant-on behavior required by power-critical avionics. The industrial temperature rating and FBGA mechanical format suit ruggedized boards, and the family's longevity supports long program lifecycles. Designers should review Microchip's radiation and military-grade ordering options for extreme-environment deployments.
推荐
Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the A3PE600-2FG256I's deterministic, instant-on power-up: sensors, front-end timing, and safety interlock logic are active the moment power is applied, with no configuration-load window that could delay alarms or measurements. The 165 I/Os connect ADC front ends, display interfaces, and communication ports, while flash configuration removes the external boot device from the BOM - one less component to qualify under regulatory design-control processes. The 310 MHz capability covers real-time filtering and data-path functions, and in-field reprogrammability via JTAG supports firmware-controlled feature upgrades on deployed units.
推荐
Test and Measurement Equipment
Bench instruments, data-acquisition chassis, and automated test systems use the A3PE600-2FG256I for timing generation, trigger logic, and channel aggregation. The -2 speed grade sustains state machines and counters at rates up to 310 MHz, matching the demands of trigger arbitration and timestamping, and 110,592 bits of embedded memory implement small FIFOs that decouple acquisition and processing clocks. The flash fabric ensures the instrument is logic-ready at power-up, improving perceived startup time, and the industrial temperature range tolerates variable lab and field conditions. Libero SoC's timing-driven flow keeps setup margins predictable across process corners.
推荐
Legacy Design Refresh and Obsolescence Bridging
Engineers maintaining legacy Actel ProASIC3E designs use the A3PE600-2FG256I to bridge end-of-life gaps in mature products such as industrial drives and avionics LRUs. Because the die, VersaTile fabric, and FG256 pinout are unchanged within the family, existing Libero projects recompile without RTL modifications, and the footprint accepts speed-grade or G-bump (lead-free) variants - A3PE600-FG256I, A3PE600-FGG256I, A3PE600-2FGG256 - on the same PCB. This lets procurement dual-source within Microchip and respond to allocation cycles, while the non-volatile configuration guarantees the original single-chip architecture is preserved through the refresh.
推荐
推荐产品汇总
工程参考数据： A3PE600-2FG256I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE600-FG256I | A3PE600-FGG256I | A3PE600-2FGG256 | M7AFS600-2FGG256I | M1AFS600-2FGG256 |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (FG256) | 256-FBGA (FG256) - same | 256-FBGA (FGG256) - same footprint | 256-FBGA (FGG256) - same footprint | 256-FBGA (FGG256) - same footprint | 256-FBGA (FGG256) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K class | 600K class |
| Speed Grade | -2 (up to 310 MHz) | Standard | Standard | -2 | -2 | -2 |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | 0C to +70C (commercial) | -40C to +85C | 0C to +70C (commercial) |
| RoHS / Lead Status | Non-compliant (contains lead) | Lead-bump (verify) | Lead-free (G bump) | Lead-free (G bump) | Lead-free (G bump) | Lead-free (G bump) |
| Fabric Family | ProASIC3E (flash, VersaTile) | ProASIC3E - identical | ProASIC3E - identical | ProASIC3E - identical | AFS / ProASIC3L (recompile needed) | Fusion/AFS (recompile needed) |
关键差异点
- Fastest speed grade in the 256-ball FG256 industrial family （对比 A3PE600-FG256I)
- Industrial temperature rating （对比 A3PE600-2FGG256)
- True single-chip flash configuration （对比 SRAM FPGAs (e.g., Xilinx equivalents))
- Path to lead-free compliance （对比 A3PE600-2FGG256 / A3PE600-FGG256I)
设计说明
The 256-ball FBGA requires controlled fan-out: plan for a 0.8 mm ball pitch (per ProASIC3E FG256 package) with via-in-pad or dog-bone escape on outer rows, and verify your fabricator's capability for the microvia geometry before routing 165 user I/Os. Follow Microchip's ProASIC3E PCB layout guidelines for ball-map assignment - reserve VCC/GND balls per datasheet and do not reassign power balls in Libero. Estimate: confirm land-pattern dimensions against the datasheet package drawing rather than generic IPC calculators, since ball diameter and mask opening are family-specific.
The A3PE600-2FG256I uses a 1.5V core with separate I/O supply rails selected per bank. Provide decoupling per the Microchip power-supply design note for ProASIC3E: bulk capacitance at each rail plus local 0.1 uF ceramics distributed across the die's power balls. Because configuration flash is on-chip, there is no configuration-rail sequencing burden as with SRAM FPGAs, but observe datasheet power-up ramp-rate requirements to guarantee reliable flash read at reset release. Estimated core current depends on toggle rate - use Libero's power estimator before finalizing the regulator.
Two frequent mistakes with this MPN: (1) assuming RoHS compliance - distributor data lists the -FG256I lead-bump suffix as containing lead; aerospace customers may accept this, but consumer/industrial RoHS programs must switch to FGG256 (G-bump) variants. (2) Neglecting speed-grade timing closure - migrating between -2 and standard grade parts changes timing; always re-run static timing analysis in Libero after any suffix change. Also verify the 'I' industrial suffix is required; commercial variants are cheaper but unqualified below 0C.
合规信息
Distributor specification data (chipdig) lists A3PE600-2FG256I as RoHS non-compliant with lead-free status 'contains lead'. Lead-free G-bump variants (FGG256) exist in the same family. REACH, halogen-free, and conflict-minerals status not found in provided data - verify on Microchip product page.
