A3PE600L-FG484M - 600K-Gate Flash FPGA, 484-FBGA | Microchip
料号： A3PE600L-FG484M ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.1 | $621.00 |
| 100 | $55.4 | $5,540.00 |
| 500 | $49.8 | $24,900.00 |
| 1,000 | $44.9 | $44,900.00 |
A3PE600L-FG484M 概述
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration PROM or SRAM boot device. Within the programmable logic hierarchy - FPGA -> programmable logic device -> digital logic IC - flash FPGAs occupy the single-chip, instant-on niche, making them distinct from SRAM FPGAs that require a boot sequence.
Key features include Live-at-Power-Up (Level 0) operation, true single-chip integration with no external configuration device, up to 504 kbits of true dual-port SRAM, and Flash*Freeze technology for ultra-low static power consumption. Reprogrammability without a configuration flash streamlines board design and reduces total cost of ownership (TOC), a headline benefit Microchip emphasizes for the ProASIC3 family.
Technically, the ProASIC3EL fabric uses fine-grained VersaTiles with flash switching elements, delivering ASIC-like security because the bitstream is stored invisibly on-chip. The 130-nm process with copper interconnect balances density, speed, and low static power. The 'M' suffix in the part number designates the commercial temperature grade of 0 to 70 C, and the 'L' suffix denotes the low-power core option.
Typical applications include industrial automation controllers, military and aerospace low-power logic integration, communications line cards, and medical instrumentation where instant-on, secure, single-chip programmable logic is required.
A key design consideration is power-rail sequencing: the 1.2 V/1.5 V core and 3.3 V I/O banks should be provisioned per the datasheet, although flash FPGAs tolerate any power-up order. For harsh environments, consider the RT ProASIC3 radiation-tolerant variant instead.
This page synthesizes distributor inventory, drop-in alternatives, pricing context, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3PE600L-FG484M ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE600L-FG484M （相同外形与封装尺寸） ——差异在于 Package, Family, Technology, Configuration, Configuration Memory.
快速对比工具——选择替代料号进行并排对比：
A3PE600L-FGG484M
✅ 直接替换✓ 有现货
$79.9 / 个
查看数据手册 →A3PE600L-1FGG484M
✅ 直接替换📋 参考替代料（不在目录中）
A3PE600L-1FG484M
✅ 直接替换📋 参考替代料（不在目录中）
A3PE600L-FGG484M
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$79.9 / 个
查看数据手册 →A3PE600L-FG484
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
A3PE600-FGG484I
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$44.03 / 个
查看数据手册 →A3PE600L-FG484M 最大额定值与电气特性
| Family | ProASIC3EL (ProASIC3 Low Power) |
| System Gates | 600000 |
| Logic Elements (LEs) | 110592 |
| User I/Os | 270 (device max 616) |
| Embedded Memory | Up to 504 kbits True Dual-Port SRAM (family) |
| Technology | 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process |
| Core Voltage | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | 1.5 V |
| Configuration | Flash-based, single-chip, Live-at-Power-Up Level 0 |
| Low Power Feature | Flash*Freeze Technology |
| Logic Family | CMOS |
| 封装 | 484-Ball FBGA (FG484), 1 mm pitch |
| Pins / Balls | 484 |
| 工作温度 | 0 to 70 C |
| 安装类型 | Surface Mount |
| Reprogrammability | Yes (in-system, nonvolatile flash) |
| Security | ASIC-level flash security (on-chip bitstream storage) |
A3PE600L-FG484M 484-ball fbga (fg484), 1 mm pitch 引脚配置指南
A3PE600L-FG484M（484-ball fbga (fg484), 1 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE600L-FG484M.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE600L-FG484M 适用于 6 应用s: Industrial Automation and Control, Military and Defense Electronics, Communications Line Cards and Networking, Medical Instrumentation, Secure Embedded Systems and Anti-Tamper Designs, Battery-Powered and Low-Power Portable Systems.
Industrial Automation and Control
The A3PE600L-FG484M suits industrial automation controllers that demand deterministic, instant-on logic at power-up. Its Live-at-Power-Up Level 0 operation means motion-control sequencing, safety interlocks, and I/O polling are active the instant 1.2 V/1.5 V core and I/O rails settle - no configuration boot delay that could miss a start event. The 600K-gate fabric with up to 504 kbits of true dual-port SRAM handles encoder interpolation, PWM generation, and fieldbus protocol bridges (e.g., CAN or UART framing) on one chip, while Flash*Freeze cuts static power during machine idle. The 270 user I/Os in the 484-FBGA connect sensors, actuators, and backplanes without glue logic, and the flash fabric's on-chip bitstream storage protects proprietary control IP on the factory floor.
推荐
Military and Defense Electronics
The ProASIC3EL family originated in Actel's military FPGA line, and the A3PE600L-FG484M datasheet is titled 'Military ProASIC3/EL Low-Power Flash FPGAs with Flash*Freeze Technology.' Defense designs value the single-chip, instant-on architecture: there is no external configuration bitstream to intercept or corrupt, and the on-chip flash provides ASIC-level resistance to cloning and overbuilding. The 600K-gate fabric implements bus interfaces, radiation-mitigated wrappers, and sensor aggregation, while the 1.2 V/1.5 V low-power core and Flash*Freeze reduce thermal load in conduction-cooled enclosures. The 0 to 70 C 'M' grade fits ground-based and sheltered platforms; for extended environments, pair with the industrial-grade A3PE600-FGG484I or move to RT ProASIC3 for space-flight qualification.
推荐
Communications Line Cards and Networking
In communications equipment, the A3PE600L-FG484M works as a line-card bridge and control-plane fabric. The 110,592 logic elements implement framing, DES/encryption wrappers, clock-domain crossing FIFOs using the family's up-to-504-kbit true dual-port SRAM, and backplane interface glue between MACs, PHYs, and processors. Instant-on operation lets the card respond to system management at hot-swap insertion before a host can poll it - something SRAM FPGAs still configuring from external flash cannot do. The 270 user I/Os cover multiple I/O banks at 1.5 V for dense signal connection in the 1 mm-pitch 484-FBGA, and low static power helps fit line cards into restrictive thermal budgets typical of telecom shelves.
推荐
Medical Instrumentation
Medical diagnostic equipment - patient monitors, imaging front ends, lab analyzers - benefits from the A3PE600L-FG484M's combination of quiet, low-power flash fabric and single-chip integration. There is no configuration boot delay, so acquisition chains are live the moment the device powers, supporting fast startup requirements in point-of-care instruments. The 600K-gate capacity handles ADC sequencing, digital filtering, and USB/UART interface bridging, while Flash*Freeze allows the instrument to hold state in low-power standby between measurements, important for battery-backed portables. On-chip flash bitstream storage protects embedded algorithm IP, and reprogrammability in the field lets manufacturers deliver certified firmware updates without changing hardware.
推荐
Secure Embedded Systems and Anti-Tamper Designs
Because ProASIC3EL stores its bitstream in on-chip nonvolatile flash, the A3PE600L-FG484M is a natural fit for secure embedded systems that must resist readback, cloning, and unauthorized reprogramming. Unlike SRAM FPGAs that load a bitstream from external flash at every power-up - exposing the design at the bus - this device requires no external configuration image at all, eliminating that attack surface entirely. Designers implement AES wrappers, key-storage logic, and secure-boot roots of trust in the 600K-gate fabric, with instant-on operation ensuring security logic is active from power application (Level 0). This makes it a common choice in defense, payment, and DRM-adjacent equipment where design IP protection is a procurement requirement.
推荐
Battery-Powered and Low-Power Portable Systems
The 'L' low-power designation and Flash*Freeze technology make the A3PE600L-FG484M well suited to battery-powered equipment such as portable test instruments, handheld field terminals, and unmanned-vehicle control boards. The 1.2 V core option reduces dynamic power across the 110,592-element fabric, and Flash*Freeze allows the device to enter an ultra-low static power state while retaining register and SRAM state - wake-up is immediate because configuration is nonvolatile. With 270 user I/Os available in the 484-FBGA, one chip can consolidate sensor interfaces, display drivers, and radio-module glue logic, removing multiple discrete devices and their quiescent budgets. The commercial 0 to 70 C grade covers typical portable operating environments.
推荐
推荐产品汇总
工程参考数据： A3PE600L-FG484M ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE600L-FGG484M | A3PE600L-1FGG484M | A3PE600L-1FG484M | A3PE600-FGG484I |
|---|---|---|---|---|---|
| Package | 484-Ball FBGA (FG484), 1 mm pitch | 484-Ball FBGA (FGG484) - same footprint, lead-free balls | 484-Ball FBGA (FGG484) - same footprint | 484-Ball FBGA (FG484) - same footprint | 484-Ball FBGA (FGG484) - same footprint, industrial grade |
| Brand | Microchip Technology (Actel/Microsemi legacy) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Speed Grade | Standard | Standard | -1 (faster certified) | -1 (faster certified) | Standard |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.5 V (ProASIC3E core) |
| Operating Temperature | 0 to 70 C (commercial, M suffix) | 0 to 70 C (M suffix) | 0 to 70 C (M suffix) | 0 to 70 C (M suffix) | -40 to +100 C (industrial, I suffix) |
| Configuration | On-chip flash, Live-at-Power-Up Level 0, single-chip | On-chip flash, Live-at-Power-Up | On-chip flash, Live-at-Power-Up | On-chip flash, Live-at-Power-Up | On-chip flash, Live-at-Power-Up |
关键差异点
- Instant-on single-chip operation （对比 Xilinx/Intel SRAM FPGAs of similar density)
- Low-power core option with Flash*Freeze （对比 A3PE600-FGG484I (ProASIC3E))
- Completely-replace lead-free sibling available （对比 A3PE600L-FGG484M)
设计说明
The A3PE600L-FG484M requires a 1.2 V to 1.5 V core rail and 1.5 V I/O supply per the datasheet summary. A key benefit of the flash fabric is that power-rail sequencing is unrestricted - any power-up order is tolerated, unlike SRAM FPGAs. Size the core regulator for the dynamic current of your utilization level (use Libero SoC power analysis for your design, not worst-case family numbers) and enable Flash*Freeze in idle states to cut static power dramatically. Decouple each supply bank with bulk plus 0.1 uF ceramic capacitors placed at the ball-via exits.
The FG484 is a 1 mm-pitch 484-ball FBGA requiring controlled-impedance escape routing; a typical stackup uses microvia-in-pad or dog-bone escape on the outer two ball rows and via-in-pad for inner rows. Plan I/O bank assignment in Libero SoC before layout to group same-voltage signals and avoid bank voltage conflicts. Reserve JTAG access to the FlashPro programming header on every production board - in-system reprogramming of the on-chip flash is a core advantage of this device and the header costs almost nothing.
Do not confuse the FG/FGG ball-finish suffix with functional differences - they are interchangeable per FindIC cross-reference, but mixing finishes on the same reflow profile requires verifying your lead-free process compatibility. The 'M' suffix restricts operation to 0 to 70 C; substituting into an extended-temperature design requires the industrial 'I' grade (e.g., A3PE600-FGG484I), and note that the non-L ProASIC3E variants use a 1.5 V core - verify the power rail before a cross-suffix swap. Also confirm speed-grade timing closure when substituting a standard-grade part with a -1 part or vice versa.
合规信息
The FG suffix (standard ball finish) versus FGG suffix (lead-free ball finish) distinction implies the FG484M variant itself may not be lead-free; choose A3PE600L-FGG484M for lead-free/RoHS assembly. Exact RoHS/REACH status not stated in provided web data - verify on the Microchip product page.
