A3PE600L-FG484M - 600K-Gate Flash FPGA, 484-FBGA | Microchip
MPN: A3PE600L-FG484M ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.1 | $621.00 |
| 100 | $55.4 | $5,540.00 |
| 500 | $49.8 | $24,900.00 |
| 1,000 | $44.9 | $44,900.00 |
A3PE600L-FG484M Overview
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration PROM or SRAM boot device. Within the programmable logic hierarchy - FPGA -> programmable logic device -> digital logic IC - flash FPGAs occupy the single-chip, instant-on niche, making them distinct from SRAM FPGAs that require a boot sequence.
Key features include Live-at-Power-Up (Level 0) operation, true single-chip integration with no external configuration device, up to 504 kbits of true dual-port SRAM, and Flash*Freeze technology for ultra-low static power consumption. Reprogrammability without a configuration flash streamlines board design and reduces total cost of ownership (TOC), a headline benefit Microchip emphasizes for the ProASIC3 family.
Technically, the ProASIC3EL fabric uses fine-grained VersaTiles with flash switching elements, delivering ASIC-like security because the bitstream is stored invisibly on-chip. The 130-nm process with copper interconnect balances density, speed, and low static power. The 'M' suffix in the part number designates the commercial temperature grade of 0 to 70 C, and the 'L' suffix denotes the low-power core option.
Typical applications include industrial automation controllers, military and aerospace low-power logic integration, communications line cards, and medical instrumentation where instant-on, secure, single-chip programmable logic is required.
A key design consideration is power-rail sequencing: the 1.2 V/1.5 V core and 3.3 V I/O banks should be provisioned per the datasheet, although flash FPGAs tolerate any power-up order. For harsh environments, consider the RT ProASIC3 radiation-tolerant variant instead.
This page synthesizes distributor inventory, drop-in alternatives, pricing context, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for A3PE600L-FG484M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with A3PE600L-FG484M (same form factor and footprint) — differing in Package, Family, Technology, Configuration, Configuration Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE600L-FGG484M
✅ Drop-In✓ In Stock
$79.9 / Unit
View Datasheet →A3PE600L-1FGG484M
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE600L-1FG484M
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE600L-FGG484M
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$79.9 / Unit
View Datasheet →A3PE600L-FG484
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
A3PE600-FGG484I
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$44.03 / Unit
View Datasheet →A3PE600L-FG484M Maximum Ratings & Electrical Characteristics
| Family | ProASIC3EL (ProASIC3 Low Power) |
| System Gates | 600000 |
| Logic Elements (LEs) | 110592 |
| User I/Os | 270 (device max 616) |
| Embedded Memory | Up to 504 kbits True Dual-Port SRAM (family) |
| Technology | 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process |
| Core Voltage | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | 1.5 V |
| Configuration | Flash-based, single-chip, Live-at-Power-Up Level 0 |
| Low Power Feature | Flash*Freeze Technology |
| Logic Family | CMOS |
| Package | 484-Ball FBGA (FG484), 1 mm pitch |
| Pins / Balls | 484 |
| Operating Temperature | 0 to 70 C |
| Mounting Type | Surface Mount |
| Reprogrammability | Yes (in-system, nonvolatile flash) |
| Security | ASIC-level flash security (on-chip bitstream storage) |
A3PE600L-FG484M 484-ball fbga (fg484), 1 mm pitch Pin Configuration Guide
Pin configuration for A3PE600L-FG484M (484-ball fbga (fg484), 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE600L-FG484M.
Refer to the datasheet for full pin configuration.
Typical Applications
A3PE600L-FG484M is suitable for 6 applications: Industrial Automation and Control, Military and Defense Electronics, Communications Line Cards and Networking, Medical Instrumentation, Secure Embedded Systems and Anti-Tamper Designs, Battery-Powered and Low-Power Portable Systems.
Industrial Automation and Control
The A3PE600L-FG484M suits industrial automation controllers that demand deterministic, instant-on logic at power-up. Its Live-at-Power-Up Level 0 operation means motion-control sequencing, safety interlocks, and I/O polling are active the instant 1.2 V/1.5 V core and I/O rails settle - no configuration boot delay that could miss a start event. The 600K-gate fabric with up to 504 kbits of true dual-port SRAM handles encoder interpolation, PWM generation, and fieldbus protocol bridges (e.g., CAN or UART framing) on one chip, while Flash*Freeze cuts static power during machine idle. The 270 user I/Os in the 484-FBGA connect sensors, actuators, and backplanes without glue logic, and the flash fabric's on-chip bitstream storage protects proprietary control IP on the factory floor.
Recommended
Military and Defense Electronics
The ProASIC3EL family originated in Actel's military FPGA line, and the A3PE600L-FG484M datasheet is titled 'Military ProASIC3/EL Low-Power Flash FPGAs with Flash*Freeze Technology.' Defense designs value the single-chip, instant-on architecture: there is no external configuration bitstream to intercept or corrupt, and the on-chip flash provides ASIC-level resistance to cloning and overbuilding. The 600K-gate fabric implements bus interfaces, radiation-mitigated wrappers, and sensor aggregation, while the 1.2 V/1.5 V low-power core and Flash*Freeze reduce thermal load in conduction-cooled enclosures. The 0 to 70 C 'M' grade fits ground-based and sheltered platforms; for extended environments, pair with the industrial-grade A3PE600-FGG484I or move to RT ProASIC3 for space-flight qualification.
Recommended
Communications Line Cards and Networking
In communications equipment, the A3PE600L-FG484M works as a line-card bridge and control-plane fabric. The 110,592 logic elements implement framing, DES/encryption wrappers, clock-domain crossing FIFOs using the family's up-to-504-kbit true dual-port SRAM, and backplane interface glue between MACs, PHYs, and processors. Instant-on operation lets the card respond to system management at hot-swap insertion before a host can poll it - something SRAM FPGAs still configuring from external flash cannot do. The 270 user I/Os cover multiple I/O banks at 1.5 V for dense signal connection in the 1 mm-pitch 484-FBGA, and low static power helps fit line cards into restrictive thermal budgets typical of telecom shelves.
Recommended
Medical Instrumentation
Medical diagnostic equipment - patient monitors, imaging front ends, lab analyzers - benefits from the A3PE600L-FG484M's combination of quiet, low-power flash fabric and single-chip integration. There is no configuration boot delay, so acquisition chains are live the moment the device powers, supporting fast startup requirements in point-of-care instruments. The 600K-gate capacity handles ADC sequencing, digital filtering, and USB/UART interface bridging, while Flash*Freeze allows the instrument to hold state in low-power standby between measurements, important for battery-backed portables. On-chip flash bitstream storage protects embedded algorithm IP, and reprogrammability in the field lets manufacturers deliver certified firmware updates without changing hardware.
Recommended
Secure Embedded Systems and Anti-Tamper Designs
Because ProASIC3EL stores its bitstream in on-chip nonvolatile flash, the A3PE600L-FG484M is a natural fit for secure embedded systems that must resist readback, cloning, and unauthorized reprogramming. Unlike SRAM FPGAs that load a bitstream from external flash at every power-up - exposing the design at the bus - this device requires no external configuration image at all, eliminating that attack surface entirely. Designers implement AES wrappers, key-storage logic, and secure-boot roots of trust in the 600K-gate fabric, with instant-on operation ensuring security logic is active from power application (Level 0). This makes it a common choice in defense, payment, and DRM-adjacent equipment where design IP protection is a procurement requirement.
Recommended
Battery-Powered and Low-Power Portable Systems
The 'L' low-power designation and Flash*Freeze technology make the A3PE600L-FG484M well suited to battery-powered equipment such as portable test instruments, handheld field terminals, and unmanned-vehicle control boards. The 1.2 V core option reduces dynamic power across the 110,592-element fabric, and Flash*Freeze allows the device to enter an ultra-low static power state while retaining register and SRAM state - wake-up is immediate because configuration is nonvolatile. With 270 user I/Os available in the 484-FBGA, one chip can consolidate sensor interfaces, display drivers, and radio-module glue logic, removing multiple discrete devices and their quiescent budgets. The commercial 0 to 70 C grade covers typical portable operating environments.
Recommended
Recommended Products Summary
Engineering reference data for A3PE600L-FG484M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE600L-FGG484M | A3PE600L-1FGG484M | A3PE600L-1FG484M | A3PE600-FGG484I |
|---|---|---|---|---|---|
| Package | 484-Ball FBGA (FG484), 1 mm pitch | 484-Ball FBGA (FGG484) - same footprint, lead-free balls | 484-Ball FBGA (FGG484) - same footprint | 484-Ball FBGA (FG484) - same footprint | 484-Ball FBGA (FGG484) - same footprint, industrial grade |
| Brand | Microchip Technology (Actel/Microsemi legacy) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Speed Grade | Standard | Standard | -1 (faster certified) | -1 (faster certified) | Standard |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.5 V (ProASIC3E core) |
| Operating Temperature | 0 to 70 C (commercial, M suffix) | 0 to 70 C (M suffix) | 0 to 70 C (M suffix) | 0 to 70 C (M suffix) | -40 to +100 C (industrial, I suffix) |
| Configuration | On-chip flash, Live-at-Power-Up Level 0, single-chip | On-chip flash, Live-at-Power-Up | On-chip flash, Live-at-Power-Up | On-chip flash, Live-at-Power-Up | On-chip flash, Live-at-Power-Up |
Key Differentiators
- Instant-on single-chip operation (vs Xilinx/Intel SRAM FPGAs of similar density)
- Low-power core option with Flash*Freeze (vs A3PE600-FGG484I (ProASIC3E))
- Completely-replace lead-free sibling available (vs A3PE600L-FGG484M)
Design Notes
The A3PE600L-FG484M requires a 1.2 V to 1.5 V core rail and 1.5 V I/O supply per the datasheet summary. A key benefit of the flash fabric is that power-rail sequencing is unrestricted - any power-up order is tolerated, unlike SRAM FPGAs. Size the core regulator for the dynamic current of your utilization level (use Libero SoC power analysis for your design, not worst-case family numbers) and enable Flash*Freeze in idle states to cut static power dramatically. Decouple each supply bank with bulk plus 0.1 uF ceramic capacitors placed at the ball-via exits.
The FG484 is a 1 mm-pitch 484-ball FBGA requiring controlled-impedance escape routing; a typical stackup uses microvia-in-pad or dog-bone escape on the outer two ball rows and via-in-pad for inner rows. Plan I/O bank assignment in Libero SoC before layout to group same-voltage signals and avoid bank voltage conflicts. Reserve JTAG access to the FlashPro programming header on every production board - in-system reprogramming of the on-chip flash is a core advantage of this device and the header costs almost nothing.
Do not confuse the FG/FGG ball-finish suffix with functional differences - they are interchangeable per FindIC cross-reference, but mixing finishes on the same reflow profile requires verifying your lead-free process compatibility. The 'M' suffix restricts operation to 0 to 70 C; substituting into an extended-temperature design requires the industrial 'I' grade (e.g., A3PE600-FGG484I), and note that the non-L ProASIC3E variants use a 1.5 V core - verify the power rail before a cross-suffix swap. Also confirm speed-grade timing closure when substituting a standard-grade part with a -1 part or vice versa.
Compliance Information
The FG suffix (standard ball finish) versus FGG suffix (lead-free ball finish) distinction implies the FG484M variant itself may not be lead-free; choose A3PE600L-FGG484M for lead-free/RoHS assembly. Exact RoHS/REACH status not stated in provided web data - verify on the Microchip product page.
