DSPIC33CK64MP103-I/M5 - 100MHz 16-bit DSC 64KB Flash | Microchip
料号： DSPIC33CK64MP103-I/M5 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.1 | $2.10 |
| 10 | $1.95 | $19.50 |
| 100 | $1.68 | $168.00 |
| 500 | $1.55 | $775.00 |
| 1,000 | $1.38 | $1,380.00 |
DSPIC33CK64MP103-I/M5 概述
A digital signal controller combines the processing architecture of a digital signal processor (DSP) with the peripheral set and ease of use of a microcontroller (MCU). Within the power management hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, offering deterministic single-cycle MAC/DSP instructions for time-critical closed-loop control such as digital power conversion and field-oriented motor control.
Key features include the 100 MIPS dsPIC33CK core with DSP engine, 64 KB Flash with live updating, 8 KB RAM, multiple 12-bit high-speed ADC (ADC2) modules with up to 3.5 Msps sampling, integrated operational amplifiers for current sensing, analog comparators, and high-resolution PWM peripherals optimized for power conversion topologies. The part is also positioned in Microchip's Functional Safety (FuSa) offering for safety-oriented designs.
Architecturally, the dsPIC33CK core uses a modified Harvard pipeline with hardware looping, bit-reversed addressing and single-cycle MAC, allowing control loops to execute deterministically without interrupts being blocked by heavy math. The MP103 variant integrates analog front-end blocks (op amps and comparators) directly on chip, reducing external component count in current-sense paths.
Typical applications include digital power supplies (LLC, totem-pole PFC), brushless DC and PMSM motor control, solar micro-inverters, battery chargers and advanced sensing systems.
Design consideration: the device operates at 3.0 V to 3.6 V, so logic-level shifting or gate-driver selection must match 3.3 V I/O for direct power-stage drive.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33CK64MP103-I/M5 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33CK64MP103-I/M5 （相同外形与封装尺寸） ——差异在于 Package, Core Architecture, RAM, Operating Temperature, Programming Interface.
快速对比工具——选择替代料号进行并排对比：
DSPIC33CK64MP102-I/M5
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK32MP103-I/M5
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.64 / 个
查看数据手册 →DSPIC33CK64MC103T-I/M5
✅ 直接替换✓ 有现货
$0.58 / 个
查看数据手册 →DSPIC33CK64MP103-E/M5
✅ 直接替换✓ 有现货
$2.38 / 个
查看数据手册 →DSPIC33CH64MP503-I/M5
✅ 直接替换✓ 有现货
$3.55 / 个
查看数据手册 →DSPIC33CK64MP103-I/M5 最大额定值与电气特性
| Core Architecture | 16-bit dsPIC33CK single-core DSC |
| Maximum CPU Speed | 100 MHz (100 MIPS) |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM | 8 KB |
| Supply Voltage Range | 3 V to 3.6 V |
| 工作温度 | -40C to +85C |
| 封装 | 36-UQFN (5x5 mm) exposed pad |
| 安装类型 | Surface Mount |
| ADC Resolution | 12-bit |
| Integrated Peripherals | Op Amps, 12-bit ADCs, Comparators, High-Resolution PWM |
| DSP Engine | Single-cycle MAC, integrated DSP instructions |
| Product Family | dsPIC33CK64MP10X |
| Functional Safety | FuSa-supported device |
| Programming Interface | ICSP (PGECx/PGEDx pairs) |
| Typical Applications | Digital power, motor control, advanced sensing |
| RoHS 状态 | Compliant |
| Core Type | PIC RISC with DSP |
DSPIC33CK64MP103-I/M5 36-uqfn (5x5 mm) exposed pad 引脚配置指南
DSPIC33CK64MP103-I/M5（36-uqfn (5x5 mm) exposed pad 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33CK64MP103-I/M5.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33CK64MP103-I/M5 适用于 6 应用s: Digital Power Conversion (LLC / Totem-Pole PFC), Brushless DC and PMSM Motor Control, Solar Micro-Inverters and Power Optimizers, Battery Chargers and BMS Front-End Control, Industrial Sensing and Control Nodes, Adaptive Lighting and Electronic Ballasts.
Digital Power Conversion (LLC / Totem-Pole PFC)
The DSPIC33CK64MP103-I/M5 fits digital power conversion because its 100 MIPS core executes current- and voltage-loop control at switching frequencies of several hundred kHz with single-cycle MAC arithmetic, while its high-resolution PWM provides sub-nanosecond edge placement critical for zero-voltage-switching timing in LLC and totem-pole PFC stages. In a typical topology, the 12-bit high-speed ADC samples inductor current and output voltage synchronized to PWM events, the integrated op amp conditions the shunt signal without an external amplifier, and the control loop closes within one switching period. The trade-off versus a pure hardware controller is firmware complexity, offset by Microchip's digital power reference designs and the 3.3 V direct gate-drive capability that removes level-shifting components from the power stage interface.
推荐
Brushless DC and PMSM Motor Control
For sensorless field-oriented control (FOC) of BLDC and PMSM motors, the DSPIC33CK64MP103-I/M5 provides the required computational headroom and analog integration: the 100 MHz dsPIC33CK core executes Park/Clarke transforms and PI current loops in a fraction of a 20 kHz PWM period, the on-chip op amps amplify low-side shunt currents, and the 12-bit ADCs trigger exactly at PWM center for ripple-free current measurement. The high-resolution PWM generates three complementary pairs with dead-time insertion. Using the integrated analog saves roughly three external amplifier ICs per drive, lowering BOM cost. Designers should budget RAM carefully - the 8 KB RAM supports single-motor FOC with position observers but limited headroom for complex observers or dual-motor schemes.
推荐
Solar Micro-Inverters and Power Optimizers
Micro-inverters demand MPPT control, grid-synchronized inversion and safety monitoring simultaneously - a workload the DSPIC33CK64MP103-I/M5 handles with its 100 MIPS DSP core and synchronized analog. The 12-bit ADC measures panel voltage/current for maximum-power-point tracking while a second acquisition path monitors grid voltage for PLL synchronization and anti-islanding protection. The high-resolution PWM drives the interleaved boost and DC-AC stages, and the integrated comparators provide fast cycle-by-cycle overcurrent protection independent of software latency, a critical safety requirement. The -40C to +85C industrial range suits outdoor enclosures. The device's Functional Safety (FuSa) positioning additionally supports designs targeting photovoltaic safety compliance documentation.
推荐
Battery Chargers and BMS Front-End Control
In multi-chemistry battery chargers, the DSPIC33CK64MP103-I/M5 implements CC/CV charging profiles, coulomb counting and protection logic on one chip. The 12-bit ADC channels sequence through battery voltage, current and temperature inputs, the op amps condition current-sense signals, and the PWM peripheral drives synchronous buck charging stages at high frequency for small magnetics. Charge termination and fault responses run deterministically on the 100 MIPS core. Designers should note the 3.0-3.6 V supply domain: battery-stack voltage sensing above the rail requires resistor dividers or isolated amplifiers with attention to the ADC input impedance and acquisition time per the datasheet recommendations.
推荐
Industrial Sensing and Control Nodes
The DSPIC33CK64MP103-I/M5 serves as a smart sensor hub where raw analog signals need DSP-class conditioning close to the point of measurement. Its on-chip 12-bit ADCs, op amps and comparators form a complete analog front end for strain, pressure and current sensors, while the 100 MIPS core applies digital filtering (IIR/FIR) and condition-monitoring algorithms in real time. The industrial -40C to +85C rating and small 5x5 mm 36-UQFN footprint suit dense DIN-rail and embedded modules. The FuSa (Functional Safety) designation supports deployments where diagnostic coverage must be documented. Communication to plant networks typically pairs the DSC with an external transceiver or interface IC on SPI/UART.
推荐
Adaptive Lighting and Electronic Ballasts
High-frequency resonant lamp and LED driver stages benefit from the DSPIC33CK64MP103-I/M5's high-resolution PWM and fast analog comparators. The DSC sweeps the half-bridge switching frequency through resonance for lamp ignition or dimming control, with the 100 MHz core adjusting frequency targets closed-loop based on ADC-measured tank current via the integrated op amp. Cycle-by-cycle current limiting through the analog comparators protects the power stage during ignition transients without CPU intervention. At 3.3 V logic with direct 3.3 V gate-driver compatibility, the gate-drive interface stays simple. The compact 36-UQFN package fits the constrained PCB area typical of lighting ballast form factors.
推荐
推荐产品汇总
工程参考数据： DSPIC33CK64MP103-I/M5 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33CK64MP102-I/M5 | DSPIC33CK32MP103-I/M5 | DSPIC33CK64MC103T-I/M5 | DSPIC33CH64MP503-I/M5 |
|---|---|---|---|---|---|
| Package | 36-UQFN (5x5 mm) | 36-UQFN (5x5 mm) - same | 36-UQFN (5x5 mm) - same | 36-UQFN (5x5 mm) - same | 36-UQFN (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz x2 (dual core) |
| Flash Memory | 64 KB | 64 KB | 32 KB | 64 KB | 64 KB (dual-core partitioned) |
| Core Architecture | Single-core 16-bit dsPIC33CK DSC | Single-core dsPIC33CK | Single-core dsPIC33CK | Single-core dsPIC33CK | Dual-core dsPIC33CH |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Primary Target Application | Digital power, motor control, advanced sensing | Digital power (reduced peripheral set) | Cost-sensitive digital power | Motor control | Digital power with partitioned control/communication |
关键差异点
- Full MP-series high-speed analog set in the smallest footprint （对比 DSPIC33CK64MP102-I/M5)
- Double the program memory of the cost-optimized sibling （对比 DSPIC33CK32MP103-I/M5)
- Deterministic single-core timing for hardest-real-time loops （对比 DSPIC33CH64MP503-I/M5)
- Digital-power-optimized analog versus motor-control variant （对比 DSPIC33CK64MC103T-I/M5)
设计说明
Supply the DSPIC33CK64MP103-I/M5 from a clean 3.3 V rail (3.0-3.6 V range). Decouple every VDD pin with 100 nF ceramic capacitors placed within 2 mm of the pin, plus one bulk 4.7-10 uF capacitor near the package. In digital power designs where the DSC shares a board with a switching power stage, separate the analog supply path or use an LC filter so that switching ripple does not degrade ADC accuracy. All VSS and VDD pins must be connected per the datasheet - floating a power pin is a common bring-up failure.
The 36-UQFN 5x5 mm package has an exposed thermal pad that must be soldered to a grounded copper pour - it is the primary ground return and heat path. Use a pin 1 indicator on your silkscreen and verify footprint pad geometry against the Microchip landing pattern before production. Route PGECx/PGEDx ICSP pairs as matched pairs to a programming header; keep traces short and away from PWM/power-stage nodes to avoid noise pickup during in-circuit debugging.
ICSP programming requires using PGECx and PGEDx as a matched pair: if PGEC2 drives ICSPCLK, the same index-2 PGED2 must carry ICSPDAT - mixing indices halts programming. Also verify ADC input impedance versus your divider network: high-impedance sources need longer acquisition times or an op-amp buffer (the integrated op amps are convenient here). Finally, remember the 3.0-3.6 V I/O domain: 5 V sensors require level shifting, and direct 3.3 V gate-drive designs must select gate drivers rated for 3.3 V logic inputs.
合规信息
Sold in Microchip standard commercial (-I) flow, RoHS compliant and lead-free per DigiKey/LCSC listings. Formal material-declaration certificates should be pulled from Microchip's documentation portal. Not an automotive AEC-Q100 orderable in this suffix.