DSPIC33CK32MP103-I/M5 - 100MHz 16-bit DSC 32KB Flash | Microchip
MPN: DSPIC33CK32MP103-I/M5 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.12 | $4.12 |
| 10 | $3.71 | $37.10 |
| 100 | $3.3 | $330.00 |
| 500 | $2.97 | $1,485.00 |
| 1,000 | $2.64 | $2,640.00 |
DSPIC33CK32MP103-I/M5 Overview
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, DSCs such as the dsPIC33CK sit between general-purpose MCUs and full DSPs, offering deterministic single-cycle MAC/DSP instructions for control-loop mathematics. The dsPIC33CK family belongs to Microchip's dsPIC33C generation of single-core digital signal controllers used for real-time closed-loop control.
Key features include the 100 MHz single-core 16-bit pipeline with integrated DSP engine, on-chip operational amplifiers, 12-bit ADCs, high-speed comparators, and high-resolution PWM peripherals. The -I temperature suffix indicates industrial operation from -40C to +85C, and the device carries Functional Safety (FuSa) support documentation, which matters for IEC 61508-style industrial designs. The 3.3V supply range of 3V to 3.6V matches standard industrial logic levels.
Technically, the dsPIC33CK core executes one instruction per cycle at 100 MIPS, enabling fast control-law computation for power-conversion and motor-control algorithms. The intelligent analog front end - op amps driving the ADC inputs and comparators feeding the high-resolution PWM - allows a complete analog control loop to be closed on-chip with minimal external components. Twenty-seven general-purpose I/O lines are available on the 36-pin package.
Typical applications include digital power supplies (LLC, PFC, buck/boost converters), brushless DC and PMSM motor control, and advanced sensing front ends where fast 12-bit ADC sampling plus DSP filtering is required. The small 5x5 mm UQFN footprint suits compact, high-density power boards.
Design consideration: the exposed pad on the UQFN-36 must be soldered to a grounded thermal landing pattern both for heat dissipation and for the ground return of the fast analog peripherals.
This page synthesizes verified distributor data, drop-in same-package alternatives, pricing tiers, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33CK32MP103-I/M5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK32MP103-I/M5 (same form factor and footprint) — differing in Package, Operating Temperature, Core Processor, Packaging, Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK64MP103-I/M5
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.38 / Unit
View Datasheet →DSPIC33CK32MP102-I/M5
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33CK128MC503T-I/M5
✅ Drop-In✓ In Stock
$3 / Unit
View Datasheet →DSPIC33CH64MP503-I/M5
✅ Drop-In✓ In Stock
$3.55 / Unit
View Datasheet →DSPIC33CH128MP203-I/M5
✅ Drop-In✓ In Stock
$3.85 / Unit
View Datasheet →DSPIC33CK32MP103-I/M5 Maximum Ratings & Electrical Characteristics
| Core Processor | dsPIC 33CK (16-bit DSC) |
| Core Size | 16-bit |
| Speed | 100 MHz (100 MIPS) |
| Program Memory Size | 32KB (32K x 8) Flash |
| RAM Size | 8KB (8K x 8) |
| Supply Voltage Range | 3 V to 3.6 V |
| Number of I/O | 27 |
| On-chip Peripherals | Op Amps, 12-bit ADCs, Comparators, High-Resolution PWM |
| Package | 36-UQFN (5x5 mm) with exposed pad |
| Operating Temperature | -40C to +85C (industrial, -I suffix) |
| Mounting Type | Surface Mount |
| Functional Safety Support | Yes (FuSa package) |
| Series | dsPIC 33CK, Functional Safety (FuSa) |
| Product Status | Active |
| Packaging | Tray |
DSPIC33CK32MP103-I/M5 36-uqfn (5x5 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33CK32MP103-I/M5 (36-uqfn (5x5 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK32MP103-I/M5.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK32MP103-I/M5 is suitable for 6 applications: Digital Power Supplies, Brushless DC and PMSM Motor Control, Advanced Sensing and Signal Conditioning, Industrial Control and Automation, Adaptive Lighting and LED Drivers, Wireless-Connected IoT Control Nodes.
Digital Power Supplies
The DSPIC33CK32MP103-I/M5 fits digital power conversion because its 100 MIPS dsPIC33CK core closes voltage- and current-loop compensation in real time for LLC, PFC, and buck/boost topologies. The integrated op amps buffer current-shunt signals directly into the 12-bit ADCs, and the high-resolution PWM delivers fine duty-cycle resolution required for tight regulation at switching frequencies of several hundred kilohertz. In a typical topology the controller samples inductor current and output voltage each switching cycle, executes a PID or type-III compensator in DSP arithmetic, and updates the PWM duty cycle within the same period. Unlike analog controllers, the digital loop adapts its coefficients in firmware, enabling soft-start profiling, mode switching, and fault logging without hardware changes, at the cost of firmware development effort.
Recommended
Brushless DC and PMSM Motor Control
Sensorless and sensored BLDC/PMSM drives benefit directly from the DSPIC33CK32MP103-I/M5 architecture. The 100 MHz 16-bit core executes field-oriented control (FOC) with single-cycle MAC instructions, while three complementary high-resolution PWM channels generate center-aligned six-step or SVPWM waveforms with sub-nanosecond edge resolution that reduces torque ripple and audible noise. On-chip op amps amplify motor phase-current shunt signals into the 12-bit ADCs, which can be triggered synchronously to the PWM center so that current sampling avoids switching noise. Microchip provides reference designs and the Motor Control Library for this exact family, shortening development time. The 27 available I/O lines handle gate-drive enable, hall/encoder inputs, and fault feedback on the 36-pin package, keeping the overall drive BOM compact.
Recommended
Advanced Sensing and Signal Conditioning
For smart-sensor nodes, the DSPIC33CK32MP103-I/M5 integrates the complete analog front end: op amps for gain staging, 12-bit ADCs for digitization, and the DSP engine for real-time filtering such as FIR/IIR and oversampling decimation. Running the DSP core at 100 MIPS allows hundred-of-kHz-rate sampling with concurrent filter execution, achieving effective noise floors better than the raw ADC spec through averaging. The Functional Safety (FuSa) documentation package supports deployment in monitoring systems that need documented development processes. Compared with a discrete signal chain of an op amp, ADC, and separate MCU, this single-chip approach reduces board area, eliminates inter-IC analog routing errors, and lowers BOM cost - though its 3V-3.6V supply domain requires level shifting for 5V sensor outputs.
Recommended
Industrial Control and Automation
In factory automation nodes, the DSPIC33CK32MP103-I/M5 provides deterministic real-time control with the industrial -40C to +85C temperature rating and 3.3V logic compatible with PLC I/O subsystems. The 32KB Flash accommodates control loops plus a communication stack, and the high-resolution PWM directly drives actuators, heaters via SSR control, or variable-speed pumps. Functional Safety (FuSa) family support assists designs targeting documented industrial safety processes. Its 100 MIPS headroom runs PID loops on multiple channels concurrently with protocol handling, while 27 I/O lines cover limit switches, encoder feedback, and status indication. Compared with a general-purpose MCU, the on-chip analog (op amps, comparators, fast ADC) removes external signal-conditioning ICs in typical machine-control boards, and the exposed-pad UQFN package withstands vibration better than leaded packages.
Recommended
Adaptive Lighting and LED Drivers
Digitally controlled LED drivers use the DSPIC33CK32MP103-I/M5 to regulate LED current with the high-resolution PWM driving the power stage and the 12-bit ADC monitoring current sense and temperature feedback. The 100 MIPS core implements average-current-mode control plus dimming algorithms (PWM dimming, CCR, or color mixing for RGBW fixtures) in firmware, enabling tunable-white and flicker-free dimming profiles that analog dimmers struggle to match. On-chip comparators provide hardware cycle-by-cycle current limiting independent of software, protecting the LEDs during transients. The 5x5 mm UQFN fits the driver electronics inside luminaire housings with tight space constraints, and the -I industrial temperature rating covers enclosed fixtures with elevated ambient temperatures. Firmware-based compensation also allows single hardware platform reuse across wattage variants.
Recommended
Wireless-Connected IoT Control Nodes
The DSPIC33CK32MP103-I/M5 serves as the deterministic control processor in IoT edge nodes where real-time loops coexist with cloud connectivity. The DSC handles the hard-real-time work - power conversion, motor control, or sensor processing - while an external radio module manages the network stack over UART/SPI. This partitioning avoids the timing jitter that occurs when protocol stacks and control loops share one general-purpose MCU. The 3.3V I/O connects directly to common Wi-Fi, BLE, and LoRa modules, and the 32KB Flash is sufficient for the control firmware with a lightweight UART command parser. With 27 I/O lines and the integrated analog front end, the node's sensing circuitry collapses into the DSC, and the FuSa family documentation aids certification-oriented deployments such as connected industrial monitoring.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK32MP103-I/M5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK64MP103-I/M5 | DSPIC33CK32MP102-I/M5 | DSPIC33CK128MC503T-I/M5 | DSPIC33CH64MP503-I/M5 |
|---|---|---|---|---|---|
| Package | 36-UQFN (5x5 mm) | 36-UQFN (5x5 mm) - same | 36-UQFN (5x5 mm) - same | 36-UQFN (5x5 mm) - same | 36-UQFN (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | dsPIC33CK single-core 16-bit | dsPIC33CK single-core 16-bit | dsPIC33CK single-core 16-bit | dsPIC33CK single-core 16-bit | dsPIC33CH dual-core 16-bit |
| Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz | 100 MHz (100 MIPS main core) |
| Flash Memory | 32KB | 64KB | 32KB | 128KB | 64KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C (T, tape/reel) | -40C to +85C |
| Key Differentiator | Balanced 32KB Flash + full MP analog for digital power | 2x Flash headroom, same peripherals | Lower cost, fewer peripherals | 4x Flash, touch-oriented analog | Dual-core processing |
Key Differentiators
- Full MP-family analog front end in 32KB Flash configuration (vs DSPIC33CK32MP102-I/M5)
- Lowest-cost entry into the 36-UQFN MP family (vs DSPIC33CK64MP103-I/M5)
- Single-core simplicity for deterministic control loops (vs DSPIC33CH64MP503-I/M5)
Design Notes
The 36-UQFN 5x5 mm package has an exposed pad under the die that serves as the primary ground connection and heat-removal path. Design the PCB land pattern with a central thermal landing of at least 4x4 mm connected to the ground plane through a 5x5 via array (0.3 mm vias). Insufficient exposed-pad soldering is the most common cause of analog performance issues on this package - the op amps and ADC return currents depend on a low-impedance ground. Follow Microchip's UQFN land-pattern application note for stencil aperture design; typically 50-70% paste coverage on the pad prevents voiding while ensuring full wetting.
Supply the DSC from a clean 3.3V rail within the 3.0V-3.6V specified range. Decouple each VDD pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus at least one 4.7uF-10uF bulk capacitor near the package. When the high-resolution PWM drives a power stage, switching noise couples back through the ground; separate the power-ground return from the analog ground under the ADC/op-amp pins and join them at a single point at the exposed pad. Consider a ferrite bead between the digital rail and the AVDD supply to preserve ADC accuracy in digital power designs.
ICSP programming requires PGECx/PGEDx pins to be used as a matched pair - do not mix PGEC2 with PGED1. Keep series resistors (typically 100 ohm-470 ohm) on PGD/PGC lines if they drive circuitry during normal operation, so programming is not blocked. Also note the I/O pins are 3.3V only; connecting 5V sensor outputs directly risks latch-up. Finally, when migrating between 32KB and larger-Flash alternatives, re-verify configuration words and interrupt vector tables, since Flash sizes and some peripheral instances differ across family members.
Compliance Information
Lead-free assumed per standard Microchip -I suffix commercial parts; RoHS/REACH status not stated in provided web data - confirm on Microchip's product page environmental section before release.
