DSPIC33EP256GP506T-I/MR - 16-bit DSC, 70 MIPS, 256KB Flash | Microchip
料号： DSPIC33EP256GP506T-I/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $5.16 | $516.00 |
| 500 | $4.62 | $2,310.00 |
| 1,000 | $4.15 | $4,150.00 |
DSPIC33EP256GP506T-I/MR 概述
A Digital Signal Controller combines the peripheral set and processing model of a microcontroller with the multiply-accumulate datapath of a DSP, sitting in the product hierarchy between a general-purpose MCU and a dedicated DSP. The dsPIC33E family from Microchip Technology serves motor control, digital power conversion, sensing, and general embedded control applications where a single chip must handle both real-time control loops and communication stacks.
Key features of this part include the 70 MIPS, 16-bit modified Harvard core with DSP engine, 256KB of self-programmable Flash with ECC-class reliability options, 32KB on-chip RAM, and a rich analog mix: integrated operational amplifiers, comparators, a Charge Time Measurement Unit (CTMU), and high-performance ADC capability. A Peripheral Trigger Generator (PTG) automates ADC/PWM sequencing offload from the CPU.
Connectivity is equally comprehensive: one CAN 2.0B module plus I2C, SPI, up to two UARTs with IrDA and LINbus support, enabling gateways and multi-protocol industrial nodes. On-chip resources include high-speed PWM outputs suitable for digital power and motor drive, an RTC, watchdog timer, and multiple power-saving modes.
Typical applications include BLDC and PMSM motor control, switch-mode power supplies and digital lighting, industrial automation and sensor nodes with CAN bus, and general-purpose embedded control that benefits from DSP-grade math. The VQFN-64 package suits compact, thermally constrained designs; the same silicon is offered in 64-pin TQFP (PT suffix) for prototyping-friendly layouts.
Design consideration: the dsPIC33EP family requires a stable 3.3V rail with proper decoupling on VDDCore/VCAP, and MCLR-based programming with ICSP/ICD is standard via Microchip MPLAB X and tools such as ICD 3, ICD 4, PICkit 3/4, and REAL ICE.
This page adds distributor-verified data, drop-in alternatives, and practical design notes synthesized beyond the raw datasheet, providing information gain not found on typical parametric-search listings.
直接替换替代料： DSPIC33EP256GP506T-I/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33EP256GP506T-I/MR （相同外形与封装尺寸） ——差异在于 Package, Packaging, Connectivity, Core, Special Peripherals.
快速对比工具——选择替代料号进行并排对比：
DSPIC33EP256GP506T-E/MR
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EP256GP506-H/MR
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EP256GM306T-I/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
联系询价
查看数据手册 →DSPIC33EP128GP506-I/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.42 / 个
查看数据手册 →DSPIC33EP64GP506-I/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33EP256MC506-I/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33EP256GP506T-I/MR 最大额定值与电气特性
| Core | dsPIC33E, 16-bit |
| Core Speed | 70 MIPS (60 MHz) |
| Program Memory | 256KB (85.5K x 24) Flash |
| RAM | 32KB |
| 封装 | 64-VQFN (9x9 mm) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +85C (I grade) |
| Connectivity | CANbus, I2C, SPI, UART/USART, IrDA, LINbus |
| Analog Peripherals | Op Amps, Comparators, CTMU, ADC |
| Special Peripherals | Peripheral Trigger Generator (PTG), PWM, RTC |
| Programming Interface | ICSP/ICD (In-Circuit Serial Programming) |
| Packaging | Tape & Reel (T suffix) |
DSPIC33EP256GP506T-I/MR 64-vqfn (9x9 mm) 引脚配置指南
DSPIC33EP256GP506T-I/MR（64-vqfn (9x9 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33EP256GP506T-I/MR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33EP256GP506T-I/MR 适用于 6 应用s: BLDC / PMSM Motor Control, Industrial Automation with CAN Bus, Digital Power Conversion, Precision Sensing and CTMU Measurement, Portable Instruments and Test Equipment, Embedded Control Gateways and IoT Nodes.
BLDC / PMSM Motor Control
The DSPIC33EP256GP506T-I/MR fits motor control because its 70 MIPS 16-bit DSP core executes field-oriented control (FOC) loops with single-cycle multiply-accumulate, while integrated op amps and comparators condition shunt-current feedback without external amplifiers. In a typical FOC topology, ADC samples phase currents synchronized to the PWM carrier; the Peripheral Trigger Generator (PTG) sequences ADC conversions off the PWM edges, offloading the CPU. The on-chip high-speed PWM drives a three-phase MOSFET bridge through gate drivers. A quantified benefit: closing the current loop at 16-20 kHz PWM with the DSP engine leaves ample CPU headroom for CAN communication and the host protocol stack. For designs needing complementary PWM outputs with dead-band insertion, the same-footprint DSPIC33EP256GM306T-I/MR offers an advanced PWM module without PCB redesign.
推荐
Industrial Automation with CAN Bus
The DSPIC33EP256GP506T-I/MR suits industrial automation nodes because it integrates a CAN 2.0B controller alongside SPI, I2C, and dual UARTs, letting one chip bridge fieldbus traffic to local sensors and actuators. In a typical node, the CAN module buffers messages in hardware while the 70 MIPS core runs the application, and the -40C to +85C industrial temperature rating covers cabinet and machine environments. The 256KB Flash accommodates protocol stacks such as CANopen plus application logic without external memory, and the 32KB RAM supports message queues and control state machines. Using the integrated comparators for fault protection (overcurrent trip) reduces response latency compared to software-only protection. Tape & Reel packaging supports automated SMT assembly for panelized industrial controller boards.
推荐
Digital Power Conversion
The DSPIC33EP256GP506T-I/MR is appropriate for digital power supplies and LED drivers because its high-speed PWM and fast ADC, triggered via the PTG, enable peak-current-mode or average-current-mode control loops at switching frequencies of hundreds of kHz. The integrated op amps buffer feedback signals and the comparators provide cycle-by-cycle overcurrent protection independent of firmware. With 70 MIPS of DSP throughput, compensator calculations (PID or 2P2Z) execute within the PWM period, and the 256KB Flash leaves room for multi-mode operation (constant voltage, constant current, soft start). The 64-VQFN (9x9) package with low lead inductance suits compact power stages, though layout must keep analog ground of the ADC separate from power-switching returns to preserve conversion accuracy.
推荐
Precision Sensing and CTMU Measurement
The DSPIC33EP256GP506T-I/MR serves precision sensing products because the Charge Time Measurement Unit (CTMU) enables capacitive touch, time-of-flight, and ratiometric resistance measurements with sub-LSB timing resolution, while the on-chip op amps amplify small sensor signals before the ADC converts them. A typical implementation charges a sensor capacitance with the CTMU constant-current source, measures the charge time via a comparator and timer, and averages results in the 32KB RAM; the 70 MIPS core applies calibration and filtering algorithms such as oversampled averaging. The -40C to +85C grade supports factory-floor sensing, and the VQFN-64's many GPIO lines handle multiplexed sensor arrays. This single-chip integration replaces discrete amplifiers and touch controllers, cutting BOM cost in hand-held meters and HMI panels.
推荐
Portable Instruments and Test Equipment
The DSPIC33EP256GP506T-I/MR fits hand-held and bench instruments because the 70 MIPS DSP engine performs FFT and filtering on acquired waveforms while the rich peripheral set (multi-UART for PC links, SPI for display and data-converter interfacing, I2C for EEPROM calibration storage) consolidates the instrument's digital section into one chip. The VQFN-64 (9x9 mm) footprint yields a compact main board, and power-saving modes extend battery life between measurements. The 256KB Flash supports a full menu-driven UI, USB-serial bridge firmware, and DSP libraries simultaneously; the PTG can drive periodic ADC sampling for data logging without CPU wake overhead. The TQFP (PT) family siblings are convenient during the prototyping phase, then the MR VQFN version carries the design into volume production with the same firmware binary.
推荐
Embedded Control Gateways and IoT Nodes
The DSPIC33EP256GP506T-I/MR is a solid controller for connectivity gateways because it pairs the CAN controller with UARTs supporting IrDA and LINbus, letting a single device translate between industrial fieldbus and serial-linked radio modules or sensors. The 70 MIPS core runs protocol translation concurrently with local control tasks, and 32KB RAM buffers burst traffic between slower external links and the application. RTC and watchdog peripherals support scheduled reporting and autonomous recovery in unattended installations, while multiple sleep modes trim average current in battery-backed nodes. Flash self-programming enables field firmware updates delivered over CAN or UART. The industrial -40C to +85C rating and Tape & Reel supply make the MR VQFN part practical for both prototyping and automated volume assembly of IoT edge controllers.
推荐
推荐产品汇总
工程参考数据： DSPIC33EP256GP506T-I/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33EP256GP506T-E/MR | DSPIC33EP256GP506-H/MR | DSPIC33EP256GM306T-I/MR | DSPIC33EP128GP506-I/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 256KB (85.5K x 24) | 256KB | 256KB | 256KB | 128KB (-50%) |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | H voltage variant; temp per datasheet | -40C to +85C (I grade) | -40C to +85C (I grade) |
| CAN Channels | 1 (CAN 2.0B) | 1 | 1 | 2 (dual CAN) | 1 |
| PWM / Special Peripherals | High-speed PWM, PTG, CTMU, op amps | Same peripheral set | Same peripheral set | Advanced complementary PWM (GM) | Same GP peripheral set |
关键差异点
- Industrial temperature grade at standard cost （对比 DSPIC33EP256GP506T-E/MR)
- General-purpose peripheral balance （对比 DSPIC33EP256GM306T-I/MR)
- Full 256KB Flash headroom （对比 DSPIC33EP128GP506-I/MR)
- Compact VQFN with thermal pad （对比 DSPIC33EP256GP506T-I/PT)
设计说明
Provide a clean 3.3V rail with 0.1uF ceramic decoupling at every VDD pin pair plus bulk 10uF near the package. The dsPIC33EP core regulator requires the specified VCAP capacitor on the VDDCore pin - use the value recommended in the manufacturer datasheet, place it as close to the pin as possible, and do not connect external loads to it. Poor VCAP decoupling is a leading cause of sporadic resets and brownout events on dsPIC33E designs. Verify brownout/reset configuration bits against your rail rise time.
The 64-VQFN (9x9, MR) has a center thermal pad and perimeter leads; connect the thermal pad to a solid ground plane with an array of vias to improve heat spreading and signal return paths. Keep crystal/oscillator traces short and guarded by ground. Route the ICSP programming pins (MCLR, PGD, PGC) to a header during layout - retrofitting programming access on a populated VQFN board is impractical. Isolate analog sensing traces (op amp/ADC inputs) from PWM switching loops to preserve ADC accuracy.
Do not confuse suffix variants when placing BOM lines: -I is industrial (-40C to +85C) while -E extends to +125C; the -H part is a voltage-range variant. All are footprint-compatible, but firmware configuration bits and electrical derating differ. The T suffix denotes Tape & Reel; ordering non-reel substitutes changes packaging but not the die. When substituting a GM or MC variant on a GP-designed PCB, re-check peripheral pin mapping in MPLAB X since peripheral mux assignments can differ between family sub-families.
合规信息
Compliance status for this MPN was not explicitly stated in retrieved distributor data. Confirm RoHS/REACH certificates on Microchip's official product page before ordering.
