EP1M350F780C5 - 350K LE Mercury FPGA with 1.25 Gbps CDR | Altera
MPN: EP1M350F780C5 ✗ Cuối đờiEP1M350F780C5 Tóm tắt
An FPGA (Field-Programmable Gate Array) is a programmable logic device (PLD) built from an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and a programmable interconnect, all wired up by SRAM configuration bits. FPGAs sit in the broader hierarchy of programmable logic devices -> complex programmable logic devices (CPLDs) -> FPGAs -> SoC FPGAs, and they occupy the high-density, high-performance tier of the semiconductor ecosystem. Unlike ASICs they are fully re-programmable, which makes them ideal for prototyping, low-volume production, and designs where time-to-market outweighs per-unit cost.
The Mercury family's distinguishing feature is integrated CDR support up to 1.25 Gbps per channel, eliminating the need for external physical-layer devices in many serial backplane, Fibre Channel, gigabit Ethernet, and RapidIO applications. Combined with the EP1M350F780C5's high LUT count and 486 user I/Os, designers can implement both the physical-layer glue and the application-layer protocol on a single device, reducing board area, BOM cost, and signal-integrity risk from multiple chip-to-chip serial links.
The 780-FBGA package (29 mm x 29 mm body, 1 mm ball pitch) is a common footprint in the Mercury family, allowing designers to migrate between densities and speed grades without re-spinning the PCB. The C5 speed grade is the fastest commercial bin, suitable for timing-critical datapaths where setup/hold slack is at a premium.
Typical applications include high-speed serial backplane bridges, protocol-conversion cards (e.g., SPI-4.2 to SFI-4.1), gigabit Ethernet switch line cards, Fibre Channel controllers, and telecom aggregation equipment that need both multi-gigabit serial I/O and a large parallel fabric for buffering and packet processing.
When designing with this part, pay close attention to power-rail sequencing (the core must come up before or simultaneously with the I/O banks) and thermal management on a 1.8 V core. The 780-FBGA requires a multilayer PCB with buried vias or microvias to escape all balls reliably.
This page combines current distributor stock, verified Mercury-family cross-references, and practical design notes that go beyond the manufacturer datasheet to support engineering evaluation.
Bộ thay thế dễ dàng lắp đặt cho EP1M350F780C5 — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP1M350F780C5 (cùng hình factor và footprint) — khác nhau ở Package, Operating Temperature, RoHS Status, Speed Grade, Family.
EP1M350F780-C7
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1M350F78016
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP1M350F672C7N
✅ Drop-In ⚠️ Thông số chưa được xác minhLiên hệ để biết giá
Xem tài liệu →EP1M350F780C5 Tỷ lệ tối đa & tính chất điện
| Device Family | Mercury |
| Logic Elements (approx.) | 350,000 |
| User I/O Pins | 486 |
| Embedded Transceivers | High-speed CDR channels up to 1.25 Gbps |
| Core Voltage | 1.71 V to 1.89 V |
| Speed Grade | C5 (commercial, fastest) |
| Nhiệt độ hoạt động | 0 °C to +85 °C (TJ) |
| Hộp | 780-ball FCBGA (29 mm x 29 mm, 1 mm pitch) |
| Supply Voltage Range | 1.71 V ~ 1.89 V |
| Supplier Device Package | 780-FBGA (29x29) |
| Hộp / Vỏ | 780-BBGA, FCBGA |
| Series | Mercury |
| Kiểu lắp đặt | Surface Mount |
| Trạng thái RoHS | Non-compliant (per some distributor listings) |
| Trạng thái vòng đời | Not Recommended for New Designs (NRND) |
Hướng dẫn cấu hình chân EP1M350F780C5 780-bbga, fcbga
Cấu hình chân cho EP1M350F780C5 (780-bbga, fcbga gói). IC số này bao gồm chân GPIO, giao diện truyền thông (UART, SPI, I2C) và chân nguồn. Tham khảo tài liệu thông số kỹ thuật của nhà sản xuất để biết các chức năng chân thay thế và tùy chọn cấu hình. Cực kỳ quan trọng cho thiết kế hệ thống tích hợp và lập trình PCB.
Không có dữ liệu chân cụ thể sẵn có cho EP1M350F780C5.
Tham khảo: tài liệu kỹ thuật cho cấu hình chân đầy đủ.
Ứng dụng tiêu biểu
EP1M350F780C5 phù hợp cho 6 Áp dụngs: High-Speed Serial Backplane Bridge, Gigabit Ethernet Line Card Aggregation, Fibre Channel Storage Controller, Telecom Aggregation and Protocol Conversion, Industrial Test and Measurement Equipment, Legacy ASIC/ASSP Replacement in Maintenance Programs.
High-Speed Serial Backplane Bridge
The EP1M350F780C5 is purpose-built for backplane bridging because its integrated 1.25 Gbps CDR transceivers eliminate the need for external SerDes in many legacy backplane designs. The 350K logic elements provide enough fabric to implement protocol-conversion state machines, FIFOs, and PCS glue between SPI-4.2, SFI-4.1, or proprietary parallel interfaces and the multi-gigabit serial links. Designers place the device on the line card with AC-coupled serial traces to the backplane connector, using the on-chip CDR to recover clock and data without an external PHY. The 780-FBGA footprint supports controlled-impedance escape routing on standard FR-4 backplanes, and the 1.8 V core simplifies power tree design compared to 1.2 V modern parts.
Được đề xuất
Gigabit Ethernet Line Card Aggregation
In gigabit Ethernet aggregation switches, the EP1M350F780C5's combination of multi-gigabit transceivers and a large LUT fabric allows designers to implement multiple MACs, classifier engines, and traffic shapers on a single die. Each 1.25 Gbps CDR channel can carry a gigabit Ethernet link, and 486 user I/O pins give access to multiple parallel datastreams to external TCAMs, RLDRAMs, or network processors. The C5 speed grade is critical for tight inter-packet timing at line rate, and the 780-FBGA package provides adequate thermal headroom when paired with the recommended thermal management footprint. This part is typically placed at the heart of legacy enterprise switching products that have not yet migrated to Stratix-class devices.
Được đề xuất
Fibre Channel Storage Controller
Fibre Channel at 1 Gbps operates well within the EP1M350F780C5's 1.25 Gbps CDR envelope, making this device a natural fit for legacy Fibre Channel storage controllers and HBAs. The 350K logic elements can host the FC protocol engine, SCSI/ATA bridging logic, and DMA engines that move payloads to system memory, while the integrated transceivers handle the FC-0 and FC-1 layers directly. Designers save bill-of-materials cost and board area by avoiding an external SerDes plus encoder/decoder pair. The commercial 0-85 °C junction range covers typical server-room environments, and the FCBGA package's thermal characteristics are well documented in the Mercury device handbook.
Được đề xuất
Telecom Aggregation and Protocol Conversion
Telecom equipment manufacturers adopted the Mercury family for protocol conversion between legacy TDM/ATM fabrics and emerging packet-based switching. The EP1M350F780C5 supports multiple 1.25 Gbps links alongside a deep LUT fabric, allowing designers to terminate serial backplane traffic, de/packetize it, and forward it to parallel framers or network processors. The 486 user I/O pins are well-matched to UTOPIA / POS-PHY Level 3/4 bus widths to external framers. Designers should follow Mercury power-sequencing guidelines carefully because the 1.8 V core and I/O banks must ramp in a defined order to prevent permanent damage.
Được đề xuất
Industrial Test and Measurement Equipment
Test and measurement instruments such as protocol analyzers, BERT testers, and high-speed data recorders benefit from the EP1M350F780C5's combination of multi-gigabit serial I/O and large parallel fabric. Designers can build custom pattern generators, error detectors, and protocol-aware capture logic that connect directly to 1.25 Gbps serial links under test, with the parallel fabric handling triggering, timestamping, and host-side data movement. The 780-FBGA is straightforward to integrate on a 6-layer or 8-layer test-instrument mainboard, and the C5 speed grade supports deterministic timing for compliance test suites. When targeting industrial (-40 °C to +100 °C) environments, designers should select the industrial-temperature EP1M350F78016 variant.
Được đề xuất
Legacy ASIC/ASSP Replacement in Maintenance Programs
When a discontinued ASIC or ASSP drives a critical end-product, the EP1M350F780C5 is often used as an FPGA-based form-fit-function replacement because the Mercury family's 1.25 Gbps transceivers and 486 I/O pins can reproduce the I/O signature of many older networking ASICs. The C5 speed grade helps close timing on replacement designs, and the 780-FBGA footprint can be laid out to match the legacy ASIC's BGA pattern when board spin is not feasible. Designers should treat this use case as a maintenance activity only; Altera's NRND recommendation is to migrate active programs to Stratix IV GX or later families with active PCN support and modern transceivers.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP1M350F780C5 — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP1M350F780-C7 | EP1M350F78016 | EP1M350F672C7N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 780-FBGA (29x29) | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 672-BGA - different, smaller |
| User I/O Pins | 486 | 486 | 486 | fewer than 486 (smaller package) |
| Transceiver Rate | up to 1.25 Gbps CDR | up to 1.25 Gbps CDR | up to 1.25 Gbps CDR | up to 1.25 Gbps CDR |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Operating Temperature | 0 °C to +85 °C (TJ) | 0 °C to +85 °C (TJ) | Industrial (-40 °C to +100 °C) | 0 °C to +85 °C (TJ) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Bảo phân biệt quan trọng
- Integrated 1.25 Gbps CDR transceivers (vsEP1M350F780-C7)
- Fastest commercial speed grade (vsEP1M350F78016)
- High user I/O count (vsEP1M350F672C7N)
- Mature Mercury toolchain (vsNewer Altera/Intel families)
Ghi chú thiết kế
Estimated: The Mercury family's 1.8 V core and I/O rails must ramp in the sequence specified in the Mercury device handbook. Designers commonly use a four-rail sequencer (e.g., LTC2928 or equivalent) to enforce VCCINT before VCCIO and clamp the POR pin until all rails are stable. Skipping sequencing risks latch-up; budget for the sequencer and its supporting passives in the BOM. Core current at full fabric utilization on a 350K-LE device can exceed several amps, so plan for at least 4 oz copper pours or external copper heatsinks directly under the FCBGA thermal pad.
The 780-FBGA at 1 mm pitch requires a multilayer PCB stack-up with microvias or laser-drilled blind/buried vias to reliably escape all balls. A 6-layer 1-6-1 stack-up is the minimum; an 8-layer 1-5-2 design gives better signal-integrity margin for the multi-gigabit serial traces. Matched-impedance (100 ohm differential for serial links, 50 ohm single-ended for control) must be verified with a 3D EM field solver before tape-out; do not rely on rule-of-thumb calculators for BGA escapes.
Configuration bitstream storage: the EP1M350F780C5 requires an external configuration PROM (typically EPC16 or EPC8) or a microcontroller to load the SRAM configuration at power-up. Designers sometimes forget to size the PROM correctly for compressed bitstreams or fail to add JTAG headers for in-system programming. Also note the NRND status of the configuration PROMs themselves - if your PROM is also NRND, plan a migration path before your program goes into production.
AC-coupling capacitors on the 1.25 Gbps CDR serial links must be placed within 200 mil of the BGA balls and use 0402 or smaller packages to minimize stub length. Use 0.1 µF X7R capacitors rated for at least 6.3 V to handle bias transients. Reference-plane stitching vias should be placed at least every λ/20 along the serial traces to suppress return-path discontinuities. Run post-layout simulation with IBIS-AMI models of the Mercury transceiver before committing to fabrication.
Thông tin tuân thủ
RoHS non-compliance reported by alterachips.com distributor listing; reach/lead-free/halogen-free data not present in Verified Web Data and marked unknown. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Conflict-minerals status not stated.
