EP1SGX10CF672C6 - Stratix GX FPGA, 10K LEs, 672-FBGA | Intel
料号： EP1SGX10CF672C6 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $195 | $19,500.00 |
| 500 | $175.5 | $87,750.00 |
| 1,000 | $158 | $158,000.00 |
EP1SGX10CF672C6 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnects, and dedicated I/O and memory resources that can be re-programmed to implement virtually any digital logic function. Stratix GX devices in particular are positioned for high-bandwidth serial connectivity, sitting within the broader hierarchy of programmable logic devices (PLD) and bridging toward ASIC-class performance in communication infrastructure.
Key features of the EP1SGX10CF672C6 include up to 20 full-duplex transceiver channels supporting 840 Mbps to 3.125 Gbps, embedded multiplier blocks for DSP, 16 global clock networks, and a typical core frequency performance class suitable for parallel and serial datapath co-processing. The 'C6' speed grade combined with the commercial 0°C to 85°C temperature rating balances timing margin and operating range for non-automotive applications.
Architecturally, the device combines a Lookup-Table (LUT)-based logic fabric with embedded transceiver circuitry, on-chip TriMatrix memory, and PLL-based clock management. The 672-pin FBGA package provides ample I/O for parallel interfaces while supporting the high-speed differential serial channels required in backplane and chip-to-chip links.
Typical applications include telecom line cards, baseband and protocol bridging hardware, broadcast video processing, high-speed serial interface bridging (XAUI, Serial RapidIO, PCI Express endpoint bridging), and ASIC prototyping. When designing with this part, pay close attention to transceiver reference clock jitter, decoupling on the 1.5 V core rail, and PCB signal-integrity routing for the high-speed serial lanes. This page synthesizes distributor pricing, drop-in alternatives, and engineering guidance not found on a typical distributor listing.
直接替换替代料： EP1SGX10CF672C6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1SGX10CF672C6 （相同外形与封装尺寸） ——差异在于 Package, Family, Operating Temperature, RoHS Status, Series.
快速对比工具——选择替代料号进行并排对比：
EP1S25F672C6
✅ 直接替换✓ 有现货
$125 / 个
查看数据手册 →EP1S20F672C6
✅ 直接替换✓ 有现货
$470 / 个
查看数据手册 →EP1S10F672C6
✅ 直接替换✓ 有现货
$72 / 个
查看数据手册 →EP1S10F672C7
✅ 直接替换✓ 有现货
$158 / 个
查看数据手册 →EP1SGX10CF672C6 最大额定值与电气特性
| Family | Stratix GX |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| User I/Os | 362 |
| Total Memory Bits | 920,448 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| 封装 | 672-FBGA (FineLine BGA) |
| Package Dimensions | 33 mm x 33 mm, 1 mm pitch |
| 工作温度 | 0°C to +85°C (Commercial) |
| Speed Grade | C6 |
| 安装类型 | Surface Mount |
| Logic Family | CMOS |
EP1SGX10CF672C6 33 mm x 33 mm, 1 mm pitch 引脚配置指南
EP1SGX10CF672C6（33 mm x 33 mm, 1 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP1SGX10CF672C6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP1SGX10CF672C6 适用于 6 应用s: Telecom Line Card Interface Bridging, Baseband Signal Processing and DSP Co-Processing, Broadcast Video Processing and Routing, High-Speed Serial Interface Bridging (XAUI / Serial RapidIO), ASIC Prototyping and Emulation, Industrial Control and Test Instrumentation.
Telecom Line Card Interface Bridging
The EP1SGX10CF672C6's integrated multi-gigabit serial transceivers and 362 user I/Os make it well-suited for telecom line cards that bridge between backplane serial links (such as SPI-4.2 or proprietary LVDS buses) and external SERDES lanes. Its 10K logic elements provide the datapath width needed for packet processing glue logic, while the 672-FBGA package supports dense parallel buses. Designers typically instantiate MAC layers, framer blocks, and rate-matching FIFOs in the fabric, with the hard transceivers handling the physical layer at 1-3 Gbps line rates.
推荐
Baseband Signal Processing and DSP Co-Processing
The Stratix GX fabric includes dedicated embedded multiplier blocks suitable for FFT and channelization co-processing in baseband units. With 10,570 LEs and 920 Kbits of on-chip memory, the EP1SGX10CF672C6 can host multi-channel filter banks, correlators, and channel estimators offloading the host DSP. The 1.5 V core enables low power per MAC, while the serial transceivers move digitized IF samples between boards at multi-gigabit rates.
推荐
Broadcast Video Processing and Routing
Broadcast video routers and format converters benefit from the EP1SGX10CF672C6's combination of high I/O count and embedded memory bandwidth. The device can perform SDI-to-HDMI bridging, color-space conversion, and frame-rate conversion while the parallel I/O banks handle uncompressed video buses. Its 362 user I/Os accommodate multiple SDI streams plus ancillary data and control interfaces within a single chip.
推荐
High-Speed Serial Interface Bridging (XAUI / Serial RapidIO)
With multiple 3.125 Gbps-capable transceivers, the EP1SGX10CF672C6 can bridge between ASIC-class devices using XAUI, Serial RapidIO, or proprietary serial protocols. The 672-FBGA ball map routes four differential transceiver channels plus the reference clock infrastructure needed for backplane-class link training, with the FPGA fabric implementing 8b/10b encoding, clock compensation, and link-layer state machines.
推荐
ASIC Prototyping and Emulation
The 10K logic elements and high I/O count make the EP1SGX10CF672C6 a usable prototyping vehicle for mid-complexity ASIC designs, especially those with serial I/O. Designers map ASIC blocks into the Stratix fabric and use the transceivers to emulate the production ASIC's SERDES interface, validating protocol behavior and timing before tape-out. Multi-FPGA partitioning can be supported by stacking multiple EP1SGX10CF672C6 or higher-density EP1S25F672C6 devices.
推荐
Industrial Control and Test Instrumentation
The EP1SGX10CF672C6's commercial 0-85°C range, generous I/O, and on-chip memory suit industrial test and measurement platforms such as protocol analyzers, ATE interface cards, and high-speed data recorders. The serial transceivers stream digitized samples to host processors, while the fabric implements stimulus generation, response comparison, and result aggregation. The 672-FBGA package provides mechanical robustness for vibration-prone test environments.
推荐
推荐产品汇总
工程参考数据： EP1SGX10CF672C6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1S25F672C6 | EP1S20F672C6 | EP1S10F672C6 | EP1S10F672C7 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 672-FBGA | 672-FBGA | 672-FBGA | 672-FBGA | 672-FBGA |
| Logic Elements | 10,570 | ~25,660 | ~20,000 | ~10,570 | ~10,570 |
| Speed Grade | C6 | C6 | C6 | C6 | C7 (faster) |
| Operating Temperature | 0°C to +85°C (Commercial) | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C | 0°C to +85°C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
关键差异点
- Pin-compatible density upgrade path within same 672-FBGA （对比 EP1S10F672C6)
- Higher logic density in same footprint （对比 EP1S25F672C6)
- Faster timing closure in same footprint （对比 EP1S10F672C7)
- Family consistency with Quartus tool flow （对比 Xilinx Virtex-II Pro XC2VP7)
设计说明
Estimated: at full utilization of 10K logic elements toggling at ~200 MHz with all 20 transceivers active at 3.125 Gbps, the EP1SGX10CF672C6 core power consumption can reach 8-12 W on the 1.5 V rail. Designers should allocate dedicated switching regulator headroom and follow Altera's reference decoupling network, including bulk capacitors on each supply pin group and a pi-filter on the analog transceiver supply. Power sequencing must follow Intel's documented order (core before I/O) to avoid latch-up damage during configuration.
The high-speed serial transceiver channels on the EP1SGX10CF672C6 require controlled-impedance differential routing (typically 100 ohm differential) with matched lengths within a transceiver group. The reference clock input must be routed with controlled impedance and isolated from noisy digital traces. Use the Altera/Intel Quartus pin planner to assign transceiver channels and the Transceiver Toolkit to validate signal integrity at the intended line rate.
The 672-FBGA package at 1 mm ball pitch requires multilayer PCB construction with microvia or via-in-pad technology for reliable BGA assembly. Power and ground planes should be placed on inner layers adjacent to the BGA escape traces. Provide a minimum 4-layer stack-up with continuous ground plane beneath the device for transceiver return-current integrity; 6-10 layer stack-ups are typical for production designs.
Estimated: at 10 W dissipation in the 672-FBGA (theta_JA approximately 15-20 C/W with adequate PCB thermal vias), junction temperature rises 150-200 C above ambient. The commercial 85°C operating ceiling leaves limited thermal headroom; designers must include thermal vias under the package center pad and connect them to internal ground/power planes. For enclosed chassis, active cooling may be necessary when all transceivers are active.
Do not exceed the maximum I/O voltage of 3.3 V on user I/O banks; mixing 5 V tolerant signals requires level-shifters. Configuration mode (AS, PS, JTAG) must be selected correctly via MSEL pins before power-up. The JTAG chain order matters in multi-device configurations - consult the Stratix GX configuration handbook to avoid configuration failures. As of 2026-09-07, the part is NRND so confirm long-term availability before committing to new designs.
合规信息
Lifecycle status NRND per distributor data as of 2026-09-07. RoHS/REACH/lead-free status not confirmed in the provided web data - consult Intel's product compliance documentation for definitive certification. Not AEC-Q100 qualified - not intended for automotive applications.
