EP1SGX40DF1020C6ES - 41,250-Cell Stratix GX FPGA | Intel
MPN: EP1SGX40DF1020C6ES ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for EP1SGX40DF1020C6ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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Request AlternativesEP1SGX40DF1020C6ES Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array |
| Device Family | Stratix GX |
| Logic Cells | 41,250 cells |
| Logic Array Blocks | 4,125 LABs |
| Configurable Logic Blocks | 4,125 CLBs |
| Maximum Frequency | 5,000 MHz |
| Process Technology | 130 nm |
| Logic Family | CMOS |
| Supply Voltage | 1.5 V |
| Number of Inputs | 624 |
| Number of Outputs | 624 |
| Operating Temperature | 0 °C to 85 °C |
| Package | 1020-ball FC-FBGA |
| Package Body | 33 mm × 33 mm |
| Terminal Pitch | 1.00 mm |
| Pin Count | 1020 |
| JESD-30 Package Code | S-PBGA-B1020 |
| Mounting Type | Surface Mount |
EP1SGX40DF1020C6ES s-pbga-b1020 Pin Configuration Guide
Complete pinout information for EP1SGX40DF1020C6ES (s-pbga-b1020 package) with 1020 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40DF1020C6ES.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1020 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40DF1020C6ES is suitable for 6 applications: Communications Infrastructure, High-Throughput Digital Processing, Protocol Bridge and Interface Aggregation, Industrial Control Platforms, Test and Measurement Equipment, Legacy Platform Maintenance.
Communications Infrastructure
EP1SGX40DF1020C6ES is relevant to communications infrastructure that needs substantial programmable datapath capacity and many physical connections. Its verified 41,250 logic cells provide resources for parallel packet processing, framing, buffering control, protocol adaptation, and interface management. The device exposes a reported 624 inputs and 624 outputs, which can help when many control, status, and data signals must be aggregated. A 1020-ball package, however, makes board planning critical: every bank, voltage, clock, and transceiver requirement must be reconciled with the exact family documentation. The part is most suitable when an existing Stratix GX design is being maintained and its configuration, timing, and assembly flow are already qualified.
Recommended
High-Throughput Digital Processing
EP1SGX40DF1020C6ES fits high-throughput digital processing where parallel RTL structures can benefit from 41,250 programmable logic cells. Designers can use the FPGA for fixed-latency datapaths, state machines, channel aggregation, filtering, and control functions that benefit from hardware concurrency. Its 4,125 logic array or configurable logic blocks provide a large implementation field, while the 1.5 V supply defines a legacy low-voltage design context. The retrieved 5,000 MHz value is a parametric listing, not a validated system-clock target, so timing closure must use the selected configuration, device speed grade, and manufacturer timing model. The 0 °C to 85 °C range also requires explicit system-level thermal analysis.
Recommended
Protocol Bridge and Interface Aggregation
EP1SGX40DF1020C6ES can support systems that bridge parallel, serialized, or vendor-specific interfaces through programmable logic. The 624 reported inputs and 624 reported outputs are useful for consolidating address, data, control, and status paths around an FPGA, while the 41,250-cell architecture offers room for conversion, adaptation, and supervisory logic. Engineers must verify whether the target configuration supports the required interface standards, clocking resources, I/O voltages, and any integrated serial functions in the family documentation. A 1020-ball BGA is appropriate for a connection-rich design only when signal-integrity, escape-routing, decoupling, and assembly constraints are controlled from schematic capture through fabrication.
Recommended
Industrial Control Platforms
EP1SGX40DF1020C6ES can serve in industrial control platforms requiring deterministic parallel processing, numerous I/O connections, and configurable timing behavior. The 41,250-cell capacity supports motor-control sequencing, machine-state handling, sensor aggregation, and protocol conversion, while the reported 624 inputs and 624 outputs provide a high physical I/O count for a complex controller. The verified commercial operating range of 0 °C to 85 °C does not establish suitability for an uncontrolled enclosure; exact power, junction temperature, reliability, and environmental requirements must be reviewed. A legacy 130 nm CMOS FPGA is most attractive when existing Stratix GX IP, tool flow, and board design reduce migration and requalification costs.
Recommended
Test and Measurement Equipment
EP1SGX40DF1020C6ES is applicable to test and measurement equipment that needs configurable acquisition control, pattern generation, timing sequencing, and result processing. Its 41,250 logic cells can host parallel measurement engines, while the reported 624 inputs and 624 outputs support extensive fixture, trigger, status, and data connectivity. The 1.5 V supply and 130 nm process identify the device’s technology context, but they do not specify ADC, DAC, comparator, memory, or measurement accuracy. Those companion functions require separate components and verified interfaces. System planning must also address the 33 mm by 33 mm 1020-ball package, including power delivery, signal integrity, heat removal, programming access, and production testability.
Recommended
Legacy Platform Maintenance
EP1SGX40DF1020C6ES is especially relevant to maintaining an existing Stratix GX platform where changing FPGA density, package, or vendor would force extensive PCB and firmware rework. The target is verified as a 41,250-cell device with 4,125 logic array or configurable logic blocks, a 1.5 V supply, and a 1020-ball package. Retaining the established architecture can preserve investment in RTL, timing constraints, board layout, qualification records, and production test procedures. The 130 nm technology also implies a review of tool availability, lifecycle planning, and counterfeit-risk controls. Engineers should compare exact ordering-code suffixes and documented ball assignments before authorizing an engineering replacement; similarly named family MPNs are not automatically drop-in compatible.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40DF1020C6ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Package | 1020-ball FC-FBGA, 33 mm × 33 mm, 1.00 mm pitch |
| Brand | Intel |
| Device Family | Stratix GX |
| Logic Cells | 41,250 cells |
| Logic Array or Configurable Logic Blocks | 4,125 blocks |
| Process Technology | 130 nm CMOS |
| Supply Voltage | 1.5 V |
| Operating Temperature | 0 °C to 85 °C |
| Reported Inputs and Outputs | 624 inputs and 624 outputs |
| Quantity-1 Price | [DATA_NEEDED] |
Key Differentiators
- Verified high-density resource profile (vs EP1SGX40DF1020C5ES)
- Explicit 1020-ball package context (vs EP1SGX40DF1020C6BN)
- Established Stratix GX ordering variant (vs EP1SGX40DF1020C6)
Design Notes
Treat the 1020-ball package as a package-specific implementation rather than a generic high-pin-count BGA. Use the manufacturer’s exact land pattern, ball map, escape recommendations, and board-stackup constraints. The verified body size is 33 mm by 33 mm and pitch is 1.00 mm. Confirm whether the design uses through-via, via-in-pad, or sequential-build structures with the PCB fabricator, because these choices affect yield, inspection, rework, and cost. Do not infer a package drawing from the FC-FBGA or PBGA labels without resolving the exact manufacturer package designation.
The verified supply specification is 1.5 V, but total current, rail tolerances, auxiliary supplies, power-up sequence, and decoupling values are not provided. Use the Stratix GX family datasheet and applicable design guidelines to select regulator transient response, bulk capacitance, local ceramic bypassing, and plane geometry. Separate noisy and sensitive return paths where practical, and keep high-current transitions away from precision interfaces. Exact power estimates require configuration utilization, clock rates, toggle rates, I/O loading, and environmental conditions; no junction-temperature conclusion should be made from the 1.5 V value alone.
Do not assume that similarly named Stratix GX ordering codes are drop-in replacements. The supplied web data does not prove that any alternative shares the target’s ball map, speed grade, temperature grade, supply requirements, configuration interface, timing, or reliability controls. The 5,000 MHz value appears in a parametric search result but lacks enough context to define a system clock target. Treat it as a listing fact only and use the applicable family timing tables. Before procurement or redesign, compare full ordering information, land pattern, errata, supported tool version, and qualification evidence.
Compliance Information
The verified web data does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The target is a Stratix GX FPGA; no AEC-Q100 claim is present in the supplied data.
