EP1SGX40DF1020C6ES - 41,250-Cell Stratix GX FPGA | Intel
부품 번호: EP1SGX40DF1020C6ES ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP1SGX40DF1020C6ES 개요
A field-programmable gate array is a programmable logic device whose configurable logic blocks, routing resources, and input/output elements implement digital circuits after manufacturing. An FPGA occupies the broader hierarchy of semiconductor, programmable logic, and digital integrated circuit products. Unlike a fixed-function application-specific integrated circuit, the same FPGA can be configured for interfaces, protocol processing, control, digital filtering, and other parallel functions. Stratix GX devices are associated with high-density programmable logic and integrated transceiver-oriented system designs.
The headline parameters are 41,250 cells, 4,125 logic array blocks or configurable logic blocks as separately described by the retrieved sources, and a 1020-ball package. The device uses CMOS logic and a 130 nm process technology. It operates from a 1.5 V supply and is specified for an ambient operating range of 0 °C to 85 °C. The package’s 1.00 mm pitch supports a substantial ball grid while still requiring a controlled surface-mount assembly process.
Architecturally, the part combines programmable logic with configurable routing and I/O resources, allowing parallel datapaths and interface logic to be customized for a target system. The supplied results also characterize the package as 1020-ball PBGA with JESD-30 code S-PBGA-B1020, while other results identify FC-FBGA. Engineering review should therefore use the complete ordering information and the manufacturer family datasheet to resolve package nomenclature and confirm the exact pin and ball assignments before layout release.
Typical applications include communications equipment, high-throughput digital systems, protocol bridging, and industrial processing platforms requiring many programmable logic resources. The device can host parallel control and data-path functions, while its high pin count provides broad physical connectivity for multi-bank designs. Suitability depends on the exact configuration, I/O standards, power integrity, timing constraints, and transceiver support verified in the original family documentation.
Designers should preserve continuous power and ground references, follow the family datasheet decoupling and ball-map guidance, and validate all high-speed routes against the selected I/O standard. Because the target is a 1020-ball BGA, assembly, via-in-pad policy, solder-mask definition, escape routing, and inspection must be agreed with the PCB fabricator before production. A 5,000 MHz figure appears in search metadata, but no device-wide operating-frequency conclusion should be drawn without the relevant manufacturer timing definition.
This product record consolidates verified package, process, density, temperature, and supply information, while marking unsupported electrical and lifecycle fields instead of guessing. It also distinguishes confirmed device facts from package-label terminology and cross-reference-search results that did not establish any verified drop-in replacement.
드롭인 대체품: EP1SGX40DF1020C6ES — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX40DF1020C6ES (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Package Dimensions, Package Type, Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청EP1SGX40DF1020C6ES 최대 정격 & 전기적 특성
| Product Type | Field Programmable Gate Array |
| Device Family | Stratix GX |
| Logic Cells | 41,250 cells |
| Logic Array Blocks | 4,125 LABs |
| Configurable Logic Blocks | 4,125 CLBs |
| Maximum Frequency | 5,000 MHz |
| Process Technology | 130 nm |
| Logic Family | CMOS |
| 공급 전압 | 1.5 V |
| Number of Inputs | 624 |
| 출력 수 | 624 |
| 동작 온도 | 0 °C to 85 °C |
| 패키지 | 1020-ball FC-FBGA |
| Package Body | 33 mm × 33 mm |
| Terminal Pitch | 1.00 mm |
| 핀 수 | 1020 |
| JESD-30 Package Code | S-PBGA-B1020 |
| 실장 유형 | Surface Mount |
EP1SGX40DF1020C6ES s-pbga-b1020 핀 구성 가이드
EP1SGX40DF1020C6ES(s-pbga-b1020 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX40DF1020C6ES.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX40DF1020C6ES 적합 용도: 6 애플리케이션s: Communications Infrastructure, High-Throughput Digital Processing, Protocol Bridge and Interface Aggregation, Industrial Control Platforms, Test and Measurement Equipment, Legacy Platform Maintenance.
Communications Infrastructure
EP1SGX40DF1020C6ES is relevant to communications infrastructure that needs substantial programmable datapath capacity and many physical connections. Its verified 41,250 logic cells provide resources for parallel packet processing, framing, buffering control, protocol adaptation, and interface management. The device exposes a reported 624 inputs and 624 outputs, which can help when many control, status, and data signals must be aggregated. A 1020-ball package, however, makes board planning critical: every bank, voltage, clock, and transceiver requirement must be reconciled with the exact family documentation. The part is most suitable when an existing Stratix GX design is being maintained and its configuration, timing, and assembly flow are already qualified.
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High-Throughput Digital Processing
EP1SGX40DF1020C6ES fits high-throughput digital processing where parallel RTL structures can benefit from 41,250 programmable logic cells. Designers can use the FPGA for fixed-latency datapaths, state machines, channel aggregation, filtering, and control functions that benefit from hardware concurrency. Its 4,125 logic array or configurable logic blocks provide a large implementation field, while the 1.5 V supply defines a legacy low-voltage design context. The retrieved 5,000 MHz value is a parametric listing, not a validated system-clock target, so timing closure must use the selected configuration, device speed grade, and manufacturer timing model. The 0 °C to 85 °C range also requires explicit system-level thermal analysis.
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Protocol Bridge and Interface Aggregation
EP1SGX40DF1020C6ES can support systems that bridge parallel, serialized, or vendor-specific interfaces through programmable logic. The 624 reported inputs and 624 reported outputs are useful for consolidating address, data, control, and status paths around an FPGA, while the 41,250-cell architecture offers room for conversion, adaptation, and supervisory logic. Engineers must verify whether the target configuration supports the required interface standards, clocking resources, I/O voltages, and any integrated serial functions in the family documentation. A 1020-ball BGA is appropriate for a connection-rich design only when signal-integrity, escape-routing, decoupling, and assembly constraints are controlled from schematic capture through fabrication.
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Industrial Control Platforms
EP1SGX40DF1020C6ES can serve in industrial control platforms requiring deterministic parallel processing, numerous I/O connections, and configurable timing behavior. The 41,250-cell capacity supports motor-control sequencing, machine-state handling, sensor aggregation, and protocol conversion, while the reported 624 inputs and 624 outputs provide a high physical I/O count for a complex controller. The verified commercial operating range of 0 °C to 85 °C does not establish suitability for an uncontrolled enclosure; exact power, junction temperature, reliability, and environmental requirements must be reviewed. A legacy 130 nm CMOS FPGA is most attractive when existing Stratix GX IP, tool flow, and board design reduce migration and requalification costs.
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Test and Measurement Equipment
EP1SGX40DF1020C6ES is applicable to test and measurement equipment that needs configurable acquisition control, pattern generation, timing sequencing, and result processing. Its 41,250 logic cells can host parallel measurement engines, while the reported 624 inputs and 624 outputs support extensive fixture, trigger, status, and data connectivity. The 1.5 V supply and 130 nm process identify the device’s technology context, but they do not specify ADC, DAC, comparator, memory, or measurement accuracy. Those companion functions require separate components and verified interfaces. System planning must also address the 33 mm by 33 mm 1020-ball package, including power delivery, signal integrity, heat removal, programming access, and production testability.
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Legacy Platform Maintenance
EP1SGX40DF1020C6ES is especially relevant to maintaining an existing Stratix GX platform where changing FPGA density, package, or vendor would force extensive PCB and firmware rework. The target is verified as a 41,250-cell device with 4,125 logic array or configurable logic blocks, a 1.5 V supply, and a 1020-ball package. Retaining the established architecture can preserve investment in RTL, timing constraints, board layout, qualification records, and production test procedures. The 130 nm technology also implies a review of tool availability, lifecycle planning, and counterfeit-risk controls. Engineers should compare exact ordering-code suffixes and documented ball assignments before authorizing an engineering replacement; similarly named family MPNs are not automatically drop-in compatible.
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추천 제품 요약
엔지니어링 참조 데이터: EP1SGX40DF1020C6ES — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Package | 1020-ball FC-FBGA, 33 mm × 33 mm, 1.00 mm pitch |
| Brand | Intel |
| Device Family | Stratix GX |
| Logic Cells | 41,250 cells |
| Logic Array or Configurable Logic Blocks | 4,125 blocks |
| Process Technology | 130 nm CMOS |
| Supply Voltage | 1.5 V |
| Operating Temperature | 0 °C to 85 °C |
| Reported Inputs and Outputs | 624 inputs and 624 outputs |
주요 차별점
- Verified high-density resource profile (vs EP1SGX40DF1020C5ES)
- Explicit 1020-ball package context (vs EP1SGX40DF1020C6BN)
- Established Stratix GX ordering variant (vs EP1SGX40DF1020C6)
설계 노트
Treat the 1020-ball package as a package-specific implementation rather than a generic high-pin-count BGA. Use the manufacturer’s exact land pattern, ball map, escape recommendations, and board-stackup constraints. The verified body size is 33 mm by 33 mm and pitch is 1.00 mm. Confirm whether the design uses through-via, via-in-pad, or sequential-build structures with the PCB fabricator, because these choices affect yield, inspection, rework, and cost. Do not infer a package drawing from the FC-FBGA or PBGA labels without resolving the exact manufacturer package designation.
The verified supply specification is 1.5 V, but total current, rail tolerances, auxiliary supplies, power-up sequence, and decoupling values are not provided. Use the Stratix GX family datasheet and applicable design guidelines to select regulator transient response, bulk capacitance, local ceramic bypassing, and plane geometry. Separate noisy and sensitive return paths where practical, and keep high-current transitions away from precision interfaces. Exact power estimates require configuration utilization, clock rates, toggle rates, I/O loading, and environmental conditions; no junction-temperature conclusion should be made from the 1.5 V value alone.
Do not assume that similarly named Stratix GX ordering codes are drop-in replacements. The supplied web data does not prove that any alternative shares the target’s ball map, speed grade, temperature grade, supply requirements, configuration interface, timing, or reliability controls. The 5,000 MHz value appears in a parametric search result but lacks enough context to define a system clock target. Treat it as a listing fact only and use the applicable family timing tables. Before procurement or redesign, compare full ordering information, land pattern, errata, supported tool version, and qualification evidence.
규정 준수 정보
The verified web data does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The target is a Stratix GX FPGA; no AEC-Q100 claim is present in the supplied data.